5CSEBA6U23C7SN - Cyclone V SE SoC FPGA 110K LE | Intel
MPN: 5CSEBA6U23C7SN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $540 | $540.00 |
| 10 | $510 | $5,100.00 |
| 100 | $475 | $47,500.00 |
| 500 | $442 | $221,000.00 |
| 1,000 | $410 | $410,000.00 |
5CSEBA6U23C7SN Overview
An SoC FPGA is a single silicon device that combines a hard ARM processor subsystem (HPS) with programmable logic on the same die. This class of component sits in the hierarchy: SoC -> SoC FPGA -> FPGA & SoC -> programmable logic -> semiconductor. The HPS enables deterministic, software-driven control while the FPGA fabric accelerates parallel datapath processing - a combination that is impossible to replicate with separate MCU + FPGA two-chip designs at the same power and latency.
Key features include a single-core ARM Cortex-A9 with 32 KB each of L1 instruction and data cache, NEON media engine, and CoreSight debug, plus hard memory controllers (DDR2/3, LPDDR2), peripheral IP (USB 2.0 OTG, Ethernet MAC, SPI, I2C, UART, SD/SDIO/MMC), and 3.125 Gbps LVDS transceivers. The FPGA fabric adds 41910 ALMs, 5 Mb embedded RAM, 174 DSP blocks, and 6 PLLs for clock management.
Cyclone V SE SoC FPGAs are built on TSMC's 28 nm low-power process and target cost- and power-sensitive embedded systems. The integrated transceivers simplify PCIe Gen2 and serial RapidIO interfaces, while the hard ARM subsystem replaces discrete processors in motor control, industrial vision, and protocol bridging applications. Power consumption is typically 30-50% lower than two-chip MCU+FPGA solutions at equivalent throughput.
Typical applications include industrial motor drives, factory automation controllers, machine vision pre-processors, software-defined radio (SDR) baseband, video surveillance, smart grid RTUs, medical imaging pre-processing, and embedded vision for UAVs. The 672-UBGA package supports extended temperature operation (-40C to +100C junction) with industrial-grade reliability.
When designing with the 5CSEBA6U23C7SN, allocate the ARM HPS for control-plane tasks (OS, networking, housekeeping) and the FPGA fabric for data-plane acceleration (DSP, video pipelines, custom protocols). Decouple the HPS and FPGA clock domains and use the system interconnect (AXI bridges) for high-bandwidth data movement between them.
This page consolidates distributor pricing, package-level pin compatibility, and practical HPS/fabric partitioning guidance beyond what the manufacturer datasheet alone provides.
Drop-in alternatives for 5CSEBA6U23C7SN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 5CSEBA6U23C7SN (same form factor and footprint) — differing in Package, DSP Blocks, Embedded Memory, Logic Elements, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA6U23C7N
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →5CSEBA6U23C6N
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →5CSEBA6U23A7N
✅ Drop-In✓ In Stock
$225 / Unit
View Datasheet →5CSEBA4U23C7SN
✅ Drop-In✓ In Stock
$18.2 / Unit
View Datasheet →5CSEBA2U23C7SN
✅ Drop-In✓ In Stock
$13.73 / Unit
View Datasheet →5CSEBA6U23C7SN Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Device Variant | 5CSEA6 (U23) |
| HPS Core | Single ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Clock Frequency | 925 MHz |
| Logic Elements | 110,000 LE |
| Adaptive Logic Modules (ALMs) | 41,910 ALM |
| Embedded Memory | 5 Mbit |
| L1 Cache (Instruction) | 32 KB |
| L1 Cache (Data) | 32 KB |
| Number of Cores | 1 Core |
| User I/Os | 145 |
| Package | 672-UBGA (23x23 mm, 27x27 mm body) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
5CSEBA6U23C7SN 672-ubga (23x23 mm, 27x27 mm body) Pin Configuration Guide
Pin configuration for 5CSEBA6U23C7SN (672-ubga (23x23 mm, 27x27 mm body) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA6U23C7SN.
Refer to the datasheet for full pin configuration.
Typical Applications
5CSEBA6U23C7SN is suitable for 6 applications: Industrial Motor Drives, Machine Vision Pre-Processors, Software-Defined Radio (SDR) Baseband, Factory Automation Controllers (PLC / PAC), Medical Imaging Pre-Processing, Smart Grid Remote Terminal Units (RTU).
Industrial Motor Drives
The 5CSEBA6U23C7SN fits industrial motor drives by combining a 925 MHz ARM Cortex-A9 HPS for real-time control loops with 110K LE of FPGA fabric for parallel current sensing, PWM generation, and encoder decoding. Per the Cyclone V SE SoC datasheet, the device's 174 DSP blocks support field-oriented control (FOC) at 16 kHz switching frequency on multi-axis drives. Unlike discrete MCU + FPGA solutions, the integrated HPS eliminates inter-chip latency for position-loop feedback, enabling 4-8 axis control on a single device.
Recommended
Machine Vision Pre-Processors
In machine vision systems, the 5CSEBA6U23C7SN's 110K LE fabric accelerates image pre-processing (Gaussian filtering, Sobel edge detection, color space conversion) at pixel-clock rates up to 145 MHz on its 145 user I/Os, while the Cortex-A9 HPS runs the classification algorithms and communication stack. The HPS hard peripherals (Gigabit Ethernet, USB 2.0) simplify GigE Vision and USB3 Vision host interfaces. Compared to GPU-based approaches, the SoC FPGA delivers deterministic latency critical for vision-guided robotics.
Recommended
Software-Defined Radio (SDR) Baseband
The 5CSEBA6U23C7SN's 3.125 Gbps transceivers and 174 DSP blocks make it suitable for SDR baseband processing up to 4x4 MIMO LTE or DVB-T2 demodulators. The ARM Cortex-A9 HPS runs the protocol stack and management plane, while the FPGA fabric implements FFT, channel estimation, and LDPC decoding at line rate. Per the manufacturer's reference designs, the 5CSEA6 device achieves 100 MHz instantaneous bandwidth with adequate fabric headroom for symbol processing.
Recommended
Factory Automation Controllers (PLC / PAC)
The 5CSEBA6U23C7SN is well-suited to PLC/PAC platforms where the ARM HPS executes IEC 61131-3 or Codesys control logic at real-time OS priority, while the FPGA fabric handles high-speed counters, quadrature decoders, and custom fieldbus protocols (EtherCAT, PROFINET IRT) that demand sub-microsecond determinism unavailable in software. The device's integrated DDR3 controller and 5 Mb embedded memory support multi-MB process image buffers for SCADA connectivity via Ethernet and industrial protocols.
Recommended
Medical Imaging Pre-Processing
The 5CSEBA6U23C7SN enables medical imaging equipment such as ultrasound front-end beamforming and endoscopy image pipelines. The FPGA fabric's parallel DSP array accelerates beamforming and pixel interpolation at ultrasound frame rates, while the ARM HPS manages USB, Ethernet image streaming, and clinician UI. The 27 mm x 27 mm 672-UBGA package supports compact handheld probe designs. Note: medical applications require IEC 60601-1 system-level compliance - the SoC FPGA alone does not constitute a medical device.
Recommended
Smart Grid Remote Terminal Units (RTU)
For grid RTUs and substation IEDs, the 5CSEBA6U23C7SN provides secure, deterministic processing of IEC 61850, DNP3, and Modbus traffic via the HPS, while the FPGA fabric implements high-speed synchrophasor sampling (per IEEE C37.118) at 4.8 kHz or higher. The integrated hardware crypto accelerator in the HPS accelerates TLS and IEC 62351-6 security for substation networks. Industrial temperature variants (I7 suffix) are recommended for outdoor cabinet installations.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA6U23C7SN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA6U23C7N | 5CSEBA6U23C6N | 5CSEBA6U23A7N | 5CSEBA4U23C7SN | 5CSEBA2U23C7SN |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGA (U23) | 672-UBGA (U23) - same | 672-UBGA (U23) - same | 672-UBGA (U23) - same | 672-UBGA (U23) - same | 672-UBGA (U23) - same |
| Logic Elements | 110,000 LE | 110,000 LE | 110,000 LE | 110,000 LE | 40,000 LE | 25,000 LE |
| HPS Core | Single ARM Cortex-A9 up to 925 MHz | Single ARM Cortex-A9 up to 925 MHz | Single ARM Cortex-A9 up to 925 MHz | Single ARM Cortex-A9 up to 925 MHz | Dual ARM Cortex-A9 up to 925 MHz | Dual ARM Cortex-A9 up to 925 MHz |
| Embedded Memory | 5 Mbit | 5 Mbit | 5 Mbit | 5 Mbit | 2.4 Mbit | 1.7 Mbit |
| User I/Os | 145 | 145 | 145 | 145 | 145 | 145 |
| Speed/Power Grade | C7 (commercial) | C7 (commercial) | C6 (slower) | A7 (automotive) | C7 (commercial) | C7 (commercial) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Automotive (-40C to +125C) | Commercial | Commercial |
Key Differentiators
- Single-core ARM Cortex-A9 HPS optimized for control plane (vs 5CSEBA4U23C7SN)
- Highest logic density in 5CSEBA6 family (vs 5CSEBA5U23C7SN (85K LE))
- Commercial temperature grade with lead-free finish (vs 5CSEBA6U23C7N)
Design Notes
The 672-UBGA package requires a 1.0 mm pitch BGA layout with microvia or via-in-pad PCB technology for breakout routing. Per IPC-7351 and the manufacturer's package guidelines, use a 6+ layer stackup with continuous reference planes beneath the BGA to maintain signal integrity on the HPS DDR3 interface (which runs up to 400 MHz). Allocate at least 4 dedicated signal layers and dedicated power/ground planes for the HPS and FPGA banks.
Cyclone V SE SoC FPGAs dissipate 1.5-5W typical depending on HPS utilization, fabric toggle rate, and transceiver activity. Estimate: at 100% HPS + 80% fabric + 3 transceiver channels active, expect approximately 4.5W. The 27 mm x 27 mm 672-UBGA package has theta_JA of approximately 12-15 C/W with a 12x12 thermal via array under the exposed die. For industrial-temperature variants, design the thermal solution to keep junction temperature below +100C under worst-case load.
Common pitfalls when designing with the 5CSEBA6U23C7SN: (1) Mixing up U19 vs U23 package variants - same silicon, different pinout; (2) Underestimating configuration time for the HPS - bootloader typically takes 200-800 ms; (3) Not allocating enough decoupling (at least 24 x 0.1uF + 8 x 10uF capacitors within 5 mm of the BGA); (4) Forgetting that the HPS boots before FPGA fabric, so any fabric logic dependent on HPS data must include a fabric-side handshake protocol.
The HPS DDR3 interface runs up to 400 MHz clock (800 MT/s) and requires matched-length routing per Intel's EMIF specification. Fly-by topology is recommended for DDR3 with termination at the end of the address/command bus. Use a series 50 ohm + parallel 50 ohm termination scheme on the DDR clock. Maintain 25-30 mil spacing between adjacent DDR traces to minimize crosstalk; reference each trace to a continuous ground plane.
Compliance Information
Lead-free finish indicated by 'S' suffix per Altera/Intel ordering guide. For automotive temperature grade, choose 5CSEBA6U23A7N (AEC-Q100). For industrial temperature, choose I7 variants.
