5CSEBA6U23C6N - Cyclone V SE SoC FPGA, 110K LE, Dual ARM Cortex-A9, 672-UBGA | Intel
MPN: 5CSEBA6U23C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $272.2 | $272.20 |
| 10 | $245 | $2,450.00 |
| 100 | $215 | $21,500.00 |
| 250 | $199 | $49,750.00 |
| 500 | $185 | $92,500.00 |
Drop-in alternatives for 5CSEBA6U23C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5CSEBA6U23C6N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 110,000 |
| HPS Processor | Dual ARM Cortex-A9 MPCore with NEON and FPU |
| HPS Maximum Clock Frequency | 925 MHz |
| DSP Blocks (18x18 multipliers) | 224 |
| Embedded Memory (M10K + MLAB) | approximately 5.7 Mbits |
| Maximum User I/O | 145 |
| HPS Hard Memory Controller | DDR3, DDR3L, LPDDR2 |
| HPS Peripherals | USB 2.0 OTG, Gigabit Ethernet MAC, CAN, SPI, I2C, UART, NAND/NOR flash controller |
| Core Voltage | 1.1 V |
| Process Technology | TSMC 28 nm low-power |
| Package | 672-UBGA (23x23 mm) |
| Mounting Type | Surface Mount (BGA) |
| Operating Junction Temperature | 0 C to +85 C (commercial, C6 ordering code) |
| Speed Grade | C6 (commercial) |
| RoHS Status | Compliant |
5CSEBA6U23C6N 672-ubga (23x23 mm) Pin Configuration Guide
Complete pinout information for 5CSEBA6U23C6N (672-ubga (23x23 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA6U23C6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA6U23C6N is suitable for 6 applications: Industrial Machine Vision Systems, Video Surveillance and Broadcast Processing, Motor Control and Factory Automation, Medical Imaging Equipment, Embedded Computing with Linux and FPGA Acceleration, Low-Power Industrial IoT Gateways.
Industrial Machine Vision Systems
The 5CSEBA6U23C6N is well suited to industrial machine vision because its 110K logic elements and 224 18x18 hardware multipliers provide the DSP throughput required for image preprocessing, edge detection, and convolutional pipelines running alongside the dual ARM Cortex-A9 HPS at 925 MHz. The HPS runs Linux with the OpenCV stack while the FPGA fabric handles sensor interface aggregation (MIPI, LVDS, GigE Vision) and hardware-accelerated filtering. This split keeps the CPU free for higher-level inspection algorithms while achieving deterministic frame rates; the 145 user I/Os and DDR3 controller comfortably support multi-stream GigE Vision cameras.
Recommended
Video Surveillance and Broadcast Processing
For video surveillance and broadcast video processing, the 5CSEBA6U23C6N's combination of 5.7 Mbits embedded memory and 224 DSP blocks enables real-time H.264/H.265 encode/decode pipelines and multi-channel scaling. The dual Cortex-A9 with NEON SIMD handles network stacks, ONVIF/RTSP, and analytics code while the FPGA fabric implements video pre-processing (deinterlacing, color space conversion). The 672-UBGA exposes enough LVDS pairs to drive HDMI/SDI bridge chips; thermal performance is comfortable inside an indoor surveillance enclosure thanks to the 1.1 V core.
Recommended
Motor Control and Factory Automation
Industrial motor drives and PLC platforms leverage the 5CSEBA6U23C6N's deterministic HPS-FPGA AXI bridges to implement field-oriented control (FOC) loops with sub-microsecond latency while the Cortex-A9 runs the EtherCAT or PROFINET master and the operator HMI. The 28 nm low-power process keeps dissipation under 5 W typical, allowing fanless DIN-rail mounting. Industrial peripherals (CAN, SPI, I2C, UART) integrated in the HPS eliminate companion interface ICs, and the 145 user I/Os comfortably accommodate multi-axis encoder and resolver inputs.
Recommended
Medical Imaging Equipment
In medical imaging platforms such as ultrasound and endoscopy systems, the 5CSEBA6U23C6N delivers the parallel processing fabric required for beamforming and real-time image reconstruction while the Cortex-A9 HPS manages the user interface, DICOM network stack, and patient data encryption. Hardware multipliers enable FIR/IIR filtering for noise suppression on incoming analog front-end channels; embedded M10K memory blocks store scan-line buffers close to the logic. The 1.1 V core voltage and commercial 0-85 C junction range suit controlled-environment hospital deployments; for portable instruments an industrial I7 variant is recommended.
Recommended
Embedded Computing with Linux and FPGA Acceleration
The 5CSEBA6U23C6N targets embedded computing boards that need to run a full operating system with hardware acceleration. The dual Cortex-A9 boots Linux via the on-chip NAND/NOR flash controller, while user logic added to the FPGA fabric implements accelerators (cryptographic engines, packet processors, custom DSP). The 128-bit AXI HPS-to-FPGA bridge offers high-bandwidth DMA for accelerator offload. A 672-UBGA package integrates the HPS peripherals (USB OTG, Gigabit Ethernet, DDR3) without needing companion power management ICs beyond the standard Cyclone V sequencing circuit.
Recommended
Low-Power Industrial IoT Gateways
For industrial IoT gateways consolidating Modbus, CAN, and EtherCAT fieldbuses, the 5CSEBA6U23C6N provides the HPS to run an MQTT broker plus on-board analytics, and the FPGA to implement protocol conversion and deterministic timestamping. The 28 nm low-power process and 1.1 V core keep the gateway below 5 W typical, allowing fanless DIN-rail mounting in cabinets. Integrated USB 2.0 OTG and Gigabit Ethernet MAC eliminate external PHY chips in many designs, reducing BOM cost. Industrial C6 ordering code supports indoor cabinet deployments up to 85 C junction temperature.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA6U23C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA6U23C7N | 5CSEBA6U23C8N | 5CSEBA6U23A7N | 5CSEBA5U23C6N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same |
| Logic Elements | 110,000 | 110,000 | 110,000 | 110,000 | approximately 85,000 |
| HPS Processor | Dual ARM Cortex-A9 @ 925 MHz | Dual ARM Cortex-A9 @ 925 MHz | Dual ARM Cortex-A9 @ 925 MHz | Dual ARM Cortex-A9 @ 925 MHz | Dual ARM Cortex-A9 @ 925 MHz |
| DSP Blocks (18x18) | 224 | 224 | 224 | 224 | approximately 174 |
| Speed Grade | C6 (commercial) | C7 (slower Fmax tier) | C8 (slowest Fmax tier) | A7 (automotive ordering code) | C6 (commercial) |
| Junction Temperature | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | -40 C to +125 C (automotive) | 0 C to +85 C |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Approximate Unit Price (1 pc) | $272.20 (Heisener) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest-density 5CSEBA6 member in the U23 commercial speed grade (vs 5CSEBA5U23C6N)
- Integrated dual ARM Cortex-A9 HPS eliminates companion processor (vs Cyclone V E (5CE) sub-family)
- Drop-in speed-grade alternatives on the same die/package (vs 5CSEBA6U23C7N / 5CSEBA6U23C8N)
Design Notes
The Cyclone V SE SoC requires separate HPS and FPGA power rails per Intel's Cyclone V Device Datasheet power management guidelines. Typical rails include VCC_HPS (1.1 V), VCC_FPGA (1.1 V), VCCIO_HPS (1.5 V/1.8 V/3.3 V for HPS banks), VCCIO_FPGA (per-bank voltage), and VCCPD (3.0 V/2.5 V for configuration). Use a sequencer such as the LM3880 or Intel's recommended controller; Estimated: total board power at 925 MHz HPS plus 60% FPGA utilization is approximately 3-5 W, dominated by FPGA core and DDR3 terminations.
Follow Intel's EMIF guidelines for the HPS DDR3 controller: match-length address/command traces within +/-25 mil, route byte-lane DQS to clock within +/-10 mil, use 100 ohm differential impedance for clock, and provide solid GND reference planes on adjacent layers. Place the 672-UBGA on a board with at least 6 layers to accommodate HPS and FPGA decoupling without compromising signal-integrity on the 1.5 V DDR3 interface.
Estimated: at 925 MHz HPS plus 60% FPGA utilization and 1.1 V core, total dissipation is roughly 3-5 W. The 672-UBGA package has a typical theta_JA near 12 C/W with adequate PCB thermal vias under the exposed pad area; for sealed enclosures, provision a small aluminum heat spreader or thermal interface to keep junction below 85 C. For deployments exceeding 85 C junction, select the A7 automotive or I7 industrial ordering variant.
Compliance Information
RoHS and lead-free compliance per Intel Altera Cyclone V product page. C6 ordering code is commercial grade; AEC-Q100 qualification applies only to A7 automotive ordering codes. REACH compliance status confirmed via Intel product declaration.
