5CSEBA5U23C8N - Cyclone V SE SoC FPGA, 85K LE, Dual ARM Cortex-A9 | Altera
MPN: 5CSEBA5U23C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $125.3 | $125.30 |
| 10 | $118.5 | $1,185.00 |
| 100 | $105.2 | $10,520.00 |
| 500 | $95.4 | $47,700.00 |
| 1,000 | $88.75 | $88,750.00 |
Drop-in alternatives for 5CSEBA5U23C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA5U23C7SN
✅ Drop-In✓ In Stock
$175.2 / Unit
View Datasheet →5CSEBA5U23I7N
✅ Drop-In✓ In Stock
$132.1 / Unit
View Datasheet →5CSEBA5U19C8N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →5CSEBA4U23C8N
✅ Drop-In✓ In Stock
$138.2 / Unit
View Datasheet →5CSEBA2U23C8N
✅ Drop-In✓ In Stock
$55.5 / Unit
View Datasheet →5CSEBA5U23C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 85,000 |
| HPS Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 600 MHz |
| DSP Blocks | 87 variable-precision DSP blocks |
| Embedded Memory | Approx. 3.97 Mbits |
| Maximum User I/O | 145 |
| Transceivers | 3.125 Gbps (SE variant) |
| Process Node | 28 nm TSMC low-power |
| Core Voltage (VCC) | 1.1 V |
| Memory Interface | DDR3 / DDR3L / LPDDR2 (HPS + FPGA) |
| Operating Temperature | 0 °C to +85 °C (commercial 'C' grade) |
| Package | 672-pin UBG / UFBGA, 23 x 23 mm |
| Speed Grade | 8 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
5CSEBA5U23C8N 672-pin ubg / ufbga, 23 x 23 mm Pin Configuration Guide
Complete pinout information for 5CSEBA5U23C8N (672-pin ubg / ufbga, 23 x 23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA5U23C8N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA5U23C8N is suitable for 7 applications: Industrial Machine Vision and Inspection, Industrial Motor Control and PLC, Broadcast Video Processing and Pro-AV, Automotive Infotainment and ADAS Prototyping, Military and Aerospace Ruggedized Embedded Computing, Medical Imaging and Diagnostic Equipment, IoT Edge Gateways and Protocol Conversion.
Industrial Machine Vision and Inspection
The 5CSEBA5U23C8N fits machine-vision pipelines because its 85K logic elements can absorb multiple parallel image-processing cores (filtering, blob detection, FFT) while the dual ARM Cortex-A9 HPS at 600 MHz runs the OpenCV host stack, GigE Vision acquisition, and decision logic. The 87 DSP blocks accelerate convolutional filtering at line rates beyond what a software-only ARM pipeline achieves. Designers place the FPGA fabric on the camera-side pre-processing path (debayer, color correction, thresholding) and the HPS on the classification/networking side, sharing data via the on-chip AXI bus without external memory round-trips. This topology reduces end-to-end latency by 40-60% compared to a discrete CPU+FPGA design.
Recommended
Industrial Motor Control and PLC
The 5CSEBA5U23C8N serves multi-axis motor drives and PLCs where its HPS runs the EtherCAT master, CiA 402 servo state machine, and IEC 61131-3 runtime while the FPGA fabric implements deterministic current-control loops, PWM generation, and encoder capture with sub-microsecond jitter. The integrated HPS eliminates an external ARM host, cutting BOM by $15-25 per axis and shrinking PCB area. The 3.125 Gbps transceivers support EtherCAT, Profinet, and SERCOS III industrial Ethernet without external PHYs. Designers typically pair the device with the Altera SoC EDS toolchain and use the lightweight HPS-to-FPGA AXI bridge for control-variable exchange.
Recommended
Broadcast Video Processing and Pro-AV
The 5CSEBA5U23C8N handles 1080p60 and 4K broadcast video workflows because its FPGA fabric can implement parallel color-space conversion, scaling, de-interlacing, and overlay composition at line rate, while the ARM Cortex-A9 HPS runs the control plane (network management, JSON-RPC API, web UI). The 3.97 Mbits of embedded memory buffers several scanlines of 1080p60 data without external SRAM. The 3.125 Gbps transceivers accept SDI, HDMI, and DisplayPort inputs through serializer-deserializer PHYs, eliminating separate input bridges. Compared to CPU-only broadcast encoders, this SoC FPGA achieves 3-5x lower latency on real-time HEVC/H.264 preview pipelines.
Recommended
Automotive Infotainment and ADAS Prototyping
The 5CSEBA5U23C8N is used in pre-production automotive infotainment and ADAS prototypes where its HPS runs Linux/Android automotive stacks (GENIVI, AOSP) and the FPGA fabric accelerates surround-view camera stitching, lane-detection, and driver-monitoring pipelines. While the device itself is not AEC-Q100 qualified, its 28 nm low-power process, integrated Cortex-A9 with NEON media engine, and the U23 package footprint make it ideal for proof-of-concept builds before migrating to AEC-Q100-qualified Cyclone V SoC variants. The DDR3 controller supports the bandwidth required by 4-channel camera aggregation at 30 fps.
Recommended
Military and Aerospace Ruggedized Embedded Computing
The 5CSEBA5U23C8N is selected for ruggedized military and aerospace embedded computing because the Cyclone V SE SoC family is offered in industrial and military temperature grades (5CSEBA5U23I7N) with the same U23 package, simplifying conduction-cooled and conformal-coated designs. The HPS runs secure boot via the ARM TrustZone extension while the FPGA fabric implements MIL-STD-1553, ARINC 429, and SpaceWire interfaces without external protocol chips. The 3.125 Gbps transceivers support high-speed serial backplane links. The integrated HPS eliminates the need for a separate secure processor, reducing the attack surface and PCB area in size-, weight-, and power-constrained (SWaP) platforms.
Recommended
Medical Imaging and Diagnostic Equipment
The 5CSEBA5U23C8N powers medical imaging front-ends (ultrasound beamformers, endoscopy processors, patient-monitoring hubs) where its FPGA fabric implements real-time signal processing (FFT-based Doppler, speckle reduction, image enhancement) at deterministic latency while the ARM Cortex-A9 HPS runs the DICOM stack, touch-screen UI, and network interfaces. The on-chip ARM TrustZone enables secure storage of patient data, and the integrated DDR3 controller eliminates an external memory bridge. Compared to a discrete CPU+FPGA architecture, the SoC integration reduces BOM by $20-40 and shrinks PCB area by 30%, which is critical for handheld and cart-based medical devices.
Recommended
IoT Edge Gateways and Protocol Conversion
The 5CSEBA5U23C8N is used in industrial IoT edge gateways where its dual ARM Cortex-A9 HPS runs containerized workloads (Docker, OpenWRT) at the edge while the FPGA fabric implements deterministic protocol bridging between legacy fieldbuses (Modbus RTU, Profibus, CAN) and modern MQTT/OPC-UA publish-subscribe layers. The 145 user I/Os accommodate multiple isolated RS-485, CAN, and digital I/O channels directly. The 3.125 Gbps transceivers support redundant Gigabit Ethernet uplinks. By consolidating protocol processing, encryption (AES via FPGA fabric), and Linux networking on one chip, the device replaces a $40-60 multi-chip SBC+microcontroller architecture.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA5U23C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA5U23C7SN | 5CSEBA5U23I7N | 5CSEBA4U23C8N | 5CSEBA2U23C8N |
|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 672-UBGA (U23) 23x23 mm | 672-UBGA (U23) 23x23 mm - same | 672-UBGA (U23) 23x23 mm - same | 672-UBGA (U23) 23x23 mm - same | 672-UBGA (U23) 23x23 mm - same |
| Logic Elements | 85,000 | 85,000 | 85,000 | ~40,000 | ~25,000 |
| HPS Cores | Dual ARM Cortex-A9 @ 600 MHz | Dual ARM Cortex-A9 @ 600 MHz | Dual ARM Cortex-A9 @ 600 MHz | Dual ARM Cortex-A9 @ 600 MHz | Dual ARM Cortex-A9 @ 600 MHz |
| Speed Grade | C8 | C7 | I7 | C8 | C8 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| DSP Blocks | 87 | 87 | 87 | 66 | 36 |
| Transceivers | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
| User I/O | 145 | 145 | 145 | 145 | 145 |
| Unit Price (qty 1, as of 2026-09-06) | $125.30 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest logic density in the U23 package footprint within the Cyclone V SE SoC family (vs 5CSEBA4U23C8N / 5CSEBA2U23C8N)
- Speed grade 8 provides faster FPGA fabric Fmax than the C7 variant (vs 5CSEBA5U23C7SN)
- Commercial temperature grade with full 0 to +85C operating range (vs 5CSEBA5U23I7N)
- Integrated dual ARM Cortex-A9 HPS eliminates external processor (vs 5CEBA4F23C8N (Cyclone V E non-SoC))
Design Notes
Estimated: The 672-pin UBG (UFBGA) package has a 1.0 mm ball pitch with 23 x 23 mm body. PCB design requires high-density interconnect (HDI) with microvia stack-ups - a minimum 6-layer board with via-in-pad is recommended for the BGA breakout. Use 50 ohm controlled impedance for the 3.125 Gbps transceiver lanes and length-match within 150 mils across each transceiver group per the Cyclone V device handbook. Decouple each power rail with 0.1 µF + 10 µF ceramic capacitors placed within 100 mils of the package balls.
The Cyclone V SE SoC FPGA in the U23 package has a typical junction-to-ambient thermal resistance (θJA) of approximately 8-12 C/W with a properly designed 6-layer PCB and thermal via array under the exposed pads. At maximum HPS + FPGA utilization with both cores active and transceivers running at 3.125 Gbps, total power can reach 6-8 W; a thermal pad or heat-spreader is recommended for closed enclosures above 60 °C ambient. The 'C8' commercial speed grade is rated to 85 °C junction temperature, while 'I7' industrial is rated to 100 °C.
Do not assume the UBG and UBG-LF package variants are footprint-compatible - LF variants have different ball finishes and slight pad-stack differences that can cause solder-joint reliability issues. Also, do not mix the U23 (672-pin) package with the U19 (484-pin) variant on the same PCB layout - although both are Cyclone V SE SoC devices, the U19 has fewer I/O and missing transceiver channels. Always cross-reference the Altera/Intel PSG ordering part number decoder in the Cyclone V device handbook before committing the PCB layout.
The DDR3 memory interface from the HPS and FPGA fabric requires 2T timing on the address/control bus and fly-by topology for the clock. Use the Altera External Memory Interface Toolkit (EMIF Toolkit) to validate write/read margin across voltage and temperature corners. The 3.125 Gbps transceiver reference clock must have a jitter below 350 fs RMS (12 kHz-20 MHz) per the Cyclone V device handbook; a jitter-cleaner PLL is recommended if the upstream oscillator is shared with Ethernet PHYs.
Compliance Information
RoHS and REACH compliant per Altera/Intel PSG product page. Not AEC-Q100 qualified - not intended for under-the-hood automotive use. Lead-free reflow compatible to 260C peak per JEDEC J-STD-020.
