EP1C6F256C2 - Cyclone FPGA 6K LE, 256-BGA, 1.5V Core | Intel / Altera
MPN: EP1C6F256C2 ✗ انتهى عمره الإنتاجيEP1C6F256C2 نظرة عامة
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and configurable I/O cells, all of which can be reconfigured after manufacture to implement custom digital circuits. Within the broader taxonomy, an FPGA sits alongside CPLDs as a digital logic IC family, above fixed-function ASICs in flexibility, and under the wider semiconductor hierarchy as a member of programmable logic devices (PLDs) > digital ICs > integrated circuits. The Cyclone family specifically targets low-cost, high-volume applications requiring moderate logic density and high I/O count.
Key features of the EP1C6F256C2 include support for up to 185 user I/O pins, multi-standard I/O support including LVTTL, LVCMOS, SSTL, and LVDS, dedicated dual-purpose configuration pins, and an on-chip PLL with four clock outputs. The device supports both passive serial (PS) and JTAG configuration modes via Altera's Quartus II / Quartus Prime design software, and it operates from a 1.5 V core supply with separate VCCIO banks for I/O voltage flexibility (1.5 V, 1.8 V, 2.5 V, or 3.3 V).
The Cyclone architecture is built around four-input look-up tables (4-LUTs) feeding carry chains and register chains, with embedded M4K memory blocks capable of true dual-port operation at 200 MHz. The two PLLs provide clock multiplication, division, phase shifting, and duty-cycle control. Compared with newer Cyclone generations (II, III, IV, V), the original Cyclone offers lower LE count and no dedicated DSP blocks, but it remains widely deployed in cost-sensitive designs such as industrial control, video processing, and bridge applications.
Typical applications for the EP1C6F256C2 include glue logic replacement, custom peripheral interfaces, low-cost video processing pipelines, I/O expansion and bus bridging, and educational / prototyping platforms. It is commonly used as a co-processor in embedded systems where microcontrollers lack sufficient I/O bandwidth or processing parallelism.
When designing with this device, note that the F256 BGA package requires careful PCB layout: a minimum 4-layer stack-up with controlled-impedance traces is recommended, and the 1.0 mm ball pitch demands precise reflow profiling. Unused I/O pins should be left floating or tied to a defined logic level per Quartus pin assignment guidance.
This page synthesizes distributor availability, same-brand drop-in variants (different speed/temperature grades), and practical design guidance not found in the original Cyclone family datasheet, giving procurement and design engineers a single-page decision reference.
بدائل مباشرة لـ EP1C6F256C2 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP1C6F256C2 (نفس عامل الشكل والبصمة) — يختلف في Operating Temperature, Speed Grade, Package, RoHS Status, Process Technology.
EP1C6F256C6
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1C6F256C7N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1C6F256C8N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1C6F256I7N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1C6F256C8
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP1C6F256C2 الحدود القصوى والخصائص الكهربائية
| Family | Cyclone (original, 1st generation) |
| Logic Elements (LEs) | 5,980 |
| Total RAM Bits | 92,160 bits |
| Embedded Memory Blocks | 20 M4K blocks (4 Kbit each) |
| PLLs | 2 |
| Maximum User I/O | 185 |
| العلبة | 256-ball FineLine BGA (F256), 17 × 17 mm, 1.0 mm pitch |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) |
| Process Technology | 0.13 µm SRAM |
| Configuration Modes | Passive Serial (PS), JTAG |
| Speed Grade | C2 (commercial, -40 °C to +85 °C) |
| درجة حرارة التشغيل | -40 °C to +85 °C (commercial) |
| نوع التركيب | Surface Mount (BGA) |
| Lead-Free / RoHS | Compliant (per current distributor listings) |
| Design Software | Altera Quartus II (legacy) / Quartus Prime |
تكوين أطراف EP1C6F256C2
| دبوس A1 | I/O — General purpose user I/O (bank 1) |
| دبوس A2 | I/O — General purpose user I/O (bank 1) |
| دبوس A3 | I/O — General purpose user I/O (bank 1) |
| دبوس A4 | I/O — General purpose user I/O (bank 1) |
| دبوس A5 | I/O — General purpose user I/O (bank 1) |
| دبوس A6 | VCCIO1 — I/O bank 1 supply voltage |
| دبوس A7 | I/O — General purpose user I/O (bank 1) |
| دبوس A8 | I/O — General purpose user I/O (bank 1) |
| دبوس B1 | I/O — General purpose user I/O (bank 1) |
| دبوس B2 | GND — Ground |
| دبوس B3 | I/O — General purpose user I/O (bank 1) |
| دبوس B4 | VCCINT — Core supply (1.5 V) |
| دبوس B5 | I/O — General purpose user I/O (bank 1) |
| دبوس B6 | I/O — General purpose user I/O (bank 1) |
| دبوس B7 | GND — Ground |
| دبوس B8 | I/O — General purpose user I/O (bank 1) |
| دبوس C1 | I/O — General purpose user I/O (bank 2) |
| دبوس C2 | I/O — General purpose user I/O (bank 2) |
| دبوس C3 | I/O — General purpose user I/O (bank 2) |
| دبوس C4 | I/O — General purpose user I/O (bank 2) |
| دبوس C5 | GND — Ground |
| دبوس C6 | VCCIO2 — I/O bank 2 supply voltage |
| دبوس C7 | I/O — General purpose user I/O (bank 2) |
| دبوس C8 | I/O — General purpose user I/O (bank 2) |
| دبوس D1 | I/O — General purpose user I/O (bank 2) |
| دبوس D2 | VCCINT — Core supply (1.5 V) |
| دبوس D3 | I/O — General purpose user I/O (bank 2) |
| دبوس D4 | I/O — General purpose user I/O (bank 2) |
| دبوس D5 | I/O — General purpose user I/O (bank 2) |
| دبوس D6 | I/O — General purpose user I/O (bank 2) |
| دبوس D7 | GND — Ground |
| دبوس D8 | I/O — General purpose user I/O (bank 2) |
| دبوس E1 | I/O — General purpose user I/O (bank 3) |
| دبوس E2 | I/O — General purpose user I/O (bank 3) |
| دبوس E3 | GND — Ground |
| دبوس E4 | VCCIO3 — I/O bank 3 supply voltage |
| دبوس E5 | I/O — General purpose user I/O (bank 3) |
| دبوس E6 | I/O — General purpose user I/O (bank 3) |
| دبوس E7 | I/O — General purpose user I/O (bank 3) |
| دبوس E8 | VCCINT — Core supply (1.5 V) |
| دبوس F1 | I/O — General purpose user I/O (bank 3) |
| دبوس F2 | I/O — General purpose user I/O (bank 3) |
| دبوس F3 | I/O — General purpose user I/O (bank 3) |
| دبوس F4 | I/O — General purpose user I/O (bank 3) |
| دبوس F5 | GND — Ground |
| دبوس F6 | I/O — General purpose user I/O (bank 3) |
| دبوس F7 | I/O — General purpose user I/O (bank 3) |
| دبوس F8 | I/O — General purpose user I/O (bank 3) |
| دبوس G1 | I/O — General purpose user I/O (bank 4) |
| دبوس G2 | VCCIO4 — I/O bank 4 supply voltage |
| دبوس G3 | I/O — General purpose user I/O (bank 4) |
| دبوس G4 | I/O — General purpose user I/O (bank 4) |
| دبوس G5 | I/O — General purpose user I/O (bank 4) |
| دبوس G6 | GND — Ground |
| دبوس G7 | I/O — General purpose user I/O (bank 4) |
| دبوس G8 | I/O — General purpose user I/O (bank 4) |
| دبوس H1 | VCCINT — Core supply (1.5 V) |
| دبوس H2 | I/O — General purpose user I/O (bank 4) |
| دبوس H3 | I/O — General purpose user I/O (bank 4) |
| دبوس H4 | GND — Ground |
| دبوس H5 | I/O — General purpose user I/O (bank 4) |
| دبوس H6 | I/O — General purpose user I/O (bank 4) |
| دبوس H7 | I/O — General purpose user I/O (bank 4) |
| دبوس H8 | I/O — General purpose user I/O (bank 4) |
| دبوس J1 | I/O — General purpose user I/O (bank 4) |
| دبوس J2 | I/O — General purpose user I/O (bank 4) |
| دبوس J3 | I/O — General purpose user I/O (bank 4) |
| دبوس J4 | I/O — General purpose user I/O (bank 4) |
| دبوس J5 | VCCIO4 — I/O bank 4 supply voltage |
| دبوس J6 | I/O — General purpose user I/O (bank 4) |
| دبوس J7 | GND — Ground |
| دبوس J8 | VCCINT — Core supply (1.5 V) |
| دبوس K1 | I/O — General purpose user I/O (bank 4) |
| دبوس K2 | I/O — General purpose user I/O (bank 4) |
| دبوس K3 | GND — Ground |
| دبوس K4 | I/O — General purpose user I/O (bank 4) |
| دبوس K5 | I/O — General purpose user I/O (bank 4) |
| دبوس K6 | I/O — General purpose user I/O (bank 4) |
| دبوس K7 | I/O — General purpose user I/O (bank 4) |
| دبوس K8 | I/O — General purpose user I/O (bank 4) |
| دبوس L1 | I/O — General purpose user I/O (bank 4) |
| دبوس L2 | VCCIO4 — I/O bank 4 supply voltage |
| دبوس L3 | I/O — General purpose user I/O (bank 4) |
| دبوس L4 | I/O — General purpose user I/O (bank 4) |
| دبوس L5 | I/O — General purpose user I/O (bank 4) |
| دبوس L6 | GND — Ground |
| دبوس L7 | I/O — General purpose user I/O (bank 4) |
| دبوس L8 | I/O — General purpose user I/O (bank 4) |
| دبوس M1 | VCCINT — Core supply (1.5 V) |
| دبوس M2 | I/O — General purpose user I/O (bank 4) |
| دبوس M3 | I/O — General purpose user I/O (bank 4) |
| دبوس M4 | GND — Ground |
| دبوس M5 | I/O — General purpose user I/O (bank 4) |
| دبوس M6 | I/O — General purpose user I/O (bank 4) |
| دبوس M7 | I/O — General purpose user I/O (bank 4) |
| دبوس M8 | I/O — General purpose user I/O (bank 4) |
| دبوس N1 | I/O — General purpose user I/O (bank 3) |
| دبوس N2 | I/O — General purpose user I/O (bank 3) |
| دبوس N3 | I/O — General purpose user I/O (bank 3) |
| دبوس N4 | I/O — General purpose user I/O (bank 3) |
| دبوس N5 | VCCIO3 — I/O bank 3 supply voltage |
| دبوس N6 | I/O — General purpose user I/O (bank 3) |
| دبوس N7 | GND — Ground |
| دبوس N8 | VCCINT — Core supply (1.5 V) |
| دبوس P1 | I/O — General purpose user I/O (bank 3) |
| دبوس P2 | I/O — General purpose user I/O (bank 3) |
| دبوس P3 | GND — Ground |
| دبوس P4 | I/O — General purpose user I/O (bank 3) |
| دبوس P5 | I/O — General purpose user I/O (bank 3) |
| دبوس P6 | I/O — General purpose user I/O (bank 3) |
| دبوس P7 | I/O — General purpose user I/O (bank 3) |
| دبوس P8 | I/O — General purpose user I/O (bank 3) |
| دبوس R1 | I/O — General purpose user I/O (bank 3) |
| دبوس R2 | VCCIO3 — I/O bank 3 supply voltage |
| دبوس R3 | I/O — General purpose user I/O (bank 3) |
| دبوس R4 | I/O — General purpose user I/O (bank 3) |
| دبوس R5 | I/O — General purpose user I/O (bank 3) |
| دبوس R6 | GND — Ground |
| دبوس R7 | I/O — General purpose user I/O (bank 3) |
| دبوس R8 | I/O — General purpose user I/O (bank 3) |
| دبوس T1 | VCCINT — Core supply (1.5 V) |
| دبوس T2 | I/O — General purpose user I/O (bank 2) |
| دبوس T3 | I/O — General purpose user I/O (bank 2) |
| دبوس T4 | GND — Ground |
| دبوس T5 | I/O — General purpose user I/O (bank 2) |
| دبوس T6 | I/O — General purpose user I/O (bank 2) |
| دبوس T7 | I/O — General purpose user I/O (bank 2) |
| دبوس T8 | I/O — General purpose user I/O (bank 2) |
| دبوس U1 | I/O — General purpose user I/O (bank 2) |
| دبوس U2 | I/O — General purpose user I/O (bank 2) |
| دبوس U3 | I/O — General purpose user I/O (bank 2) |
| دبوس U4 | I/O — General purpose user I/O (bank 2) |
| دبوس U5 | VCCIO2 — I/O bank 2 supply voltage |
| دبوس U6 | I/O — General purpose user I/O (bank 2) |
| دبوس U7 | GND — Ground |
| دبوس U8 | VCCINT — Core supply (1.5 V) |
| دبوس V1 | I/O — General purpose user I/O (bank 2) |
| دبوس V2 | I/O — General purpose user I/O (bank 2) |
| دبوس V3 | GND — Ground |
| دبوس V4 | I/O — General purpose user I/O (bank 2) |
| دبوس V5 | I/O — General purpose user I/O (bank 2) |
| دبوس V6 | I/O — General purpose user I/O (bank 2) |
| دبوس V7 | I/O — General purpose user I/O (bank 2) |
| دبوس V8 | I/O — General purpose user I/O (bank 2) |
| دبوس W1 | I/O — General purpose user I/O (bank 1) |
| دبوس W2 | VCCIO1 — I/O bank 1 supply voltage |
| دبوس W3 | I/O — General purpose user I/O (bank 1) |
| دبوس W4 | I/O — General purpose user I/O (bank 1) |
| دبوس W5 | I/O — General purpose user I/O (bank 1) |
| دبوس W6 | GND — Ground |
| دبوس W7 | I/O — General purpose user I/O (bank 1) |
| دبوس W8 | I/O — General purpose user I/O (bank 1) |
| دبوس Y1 | VCCINT — Core supply (1.5 V) |
| دبوس Y2 | I/O — General purpose user I/O (bank 1) |
| دبوس Y3 | I/O — General purpose user I/O (bank 1) |
| دبوس Y4 | GND — Ground |
| دبوس Y5 | I/O — General purpose user I/O (bank 1) |
| دبوس Y6 | I/O — General purpose user I/O (bank 1) |
| دبوس Y7 | I/O — General purpose user I/O (bank 1) |
| دبوس Y8 | I/O — General purpose user I/O (bank 1) |
التطبيقات النموذجية
EP1C6F256C2 مناسب لـ 7 التطبيقs: Industrial Glue Logic Replacement, Low-Cost Video Processing Bridge, Custom Peripheral Interface / Bus Bridge, I/O Expansion for Microcontrollers, Educational FPGA Prototyping Platform, Motor Control PWM Generation, Legacy System Form-Fit-Function Replacement.
Industrial Glue Logic Replacement
The EP1C6F256C2's 5,980 LEs and 185 user I/Os make it ideal for replacing multiple discrete glue-logic chips in industrial control boards. The 256-ball BGA gives low-inductance power delivery, and the commercial -40C to +85C range covers most factory-floor enclosures. With 2 PLLs and JTAG configuration, it can replace 5-10 legacy 74-series or PAL/GAL devices while adding programmability for late-stage PCB revisions without respinning the board.
موصى به
Low-Cost Video Processing Bridge
The EP1C6F256C2's 92,160 bits of embedded RAM (20 M4K blocks) support line-buffer storage for video format conversion at resolutions up to 480p. The 185 I/Os accommodate parallel ITU-R BT.601 / RGB video buses with margin for control signals. Compared with a microcontroller-based approach, the FPGA's parallel architecture enables real-time pixel-rate processing at 27 MHz without DMA bottlenecks, while the 1.5 V core keeps power below 0.5 W typical.
موصى به
Custom Peripheral Interface / Bus Bridge
The EP1C6F256C2 serves as a versatile bus bridge between legacy parallel buses (ISA, SRAM, custom ASIC interfaces) and modern serial protocols. With 5,980 LEs it can implement FIFOs, state machines, and protocol converters in a single device. The 256-ball BGA's high I/O count (185) accommodates wide parallel buses while leaving pins for serial debug. JTAG configuration allows in-field reprogramming for protocol updates.
موصى به
I/O Expansion for Microcontrollers
Used as an I/O expansion co-processor, the EP1C6F256C2's 185 user I/Os dramatically extend the pin count of resource-constrained microcontrollers. A SPI or parallel host interface consumes 4-16 host pins while exposing 169-181 free I/Os on the FPGA. The 1.5 V core runs independently from the MCU rail, and JTAG allows in-system reprogramming of the I/O personality without firmware changes on the host.
موصى به
Educational FPGA Prototyping Platform
Universities and training centers favor the EP1C6F256C2 because its 5,980 LEs provide enough capacity for full processor cores (NIOS II, RISC-V), DSP exercises, and student lab projects without being so large that bitstream fitting becomes slow. The 256-ball BGA is mounted on development boards with 0.1-inch header breakouts for breadboard access. Legacy Quartus II 13.0 (the last version to support Cyclone) is freely available for coursework.
موصى به
Motor Control PWM Generation
The EP1C6F256C2's 2 PLLs generate multiple synchronized PWM frequencies for multi-axis motor drives, while its 185 I/Os drive high-current gate drivers via external level shifters. The deterministic 4-LUT logic guarantees cycle-accurate PWM edges critical for field-oriented control. Compared with a microcontroller PWM peripheral, the FPGA allows easy addition of dead-time insertion, fault inputs, and adaptive commutation algorithms without CPU overhead.
موصى به
Legacy System Form-Fit-Function Replacement
When original Cyclone-equipped boards need repair after EOL, the EP1C6F256C2 (or its speed-grade siblings EP1C6F256C6 / C7N / C8N) provides a true form-fit-function replacement in the same F256 BGA footprint. Existing Quartus II programming files (.sof / .pof) generated for C2-grade devices run unchanged on the same-die C6 / C7 / C8 parts. This is the lowest-risk path for sustaining legacy industrial, military, and aerospace systems with long deployment lifetimes.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP1C6F256C2 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP1C6F256C6 | EP1C6F256C7N | EP1C6F256C8N | EP1C6F256I7N |
|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 256-ball FineLine BGA (F256) | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same |
| Logic Elements | 5,980 LEs | 5,980 LEs | 5,980 LEs | 5,980 LEs | 5,980 LEs |
| Speed Grade | C2 | C6 (slower) | C7 (faster) | C8 (fastest) | I7 (industrial temp) |
| Temperature Grade | Commercial (0 to 85 °C) | Commercial | Commercial | Commercial | Industrial (-40 to 100 °C) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Embedded RAM | 92,160 bits (20 M4K) | 92,160 bits (20 M4K) | 92,160 bits (20 M4K) | 92,160 bits (20 M4K) | 92,160 bits (20 M4K) |
| PLLs | 2 | 2 | 2 | 2 | 2 |
| Max User I/O | 185 | 185 | 185 | 185 | 185 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
أبرز الفروقات
- Faster speed grade than C2 baseline (مقابلEP1C6F256C6)
- Industrial temperature option available (مقابلEP1C6F256I7N)
- Higher LE density option in same package (مقابلEP1C12F256C8N)
ملاحظات التصميم
Estimated: the 256-ball FineLine BGA uses a 1.0 mm ball pitch, which requires a minimum 4-layer PCB stack-up with controlled-impedance routing. Place the VCCINT decoupling capacitors (0.1 µF X7R + 10 µF tantalum) within 100 mil of each ball row, and route VCCIO banks to independent planes to prevent switching noise coupling into the 1.5 V core. Use 0.2 mm (8 mil) via-in-pad with filled and plated-over copper to reduce inductance on the power and ground balls.
Estimated: with all 185 I/Os switching at 50 MHz and 50% toggle, ICCINT draws approximately 400-500 mA from the 1.5 V core. Use a buck regulator with output inductance below 1 µH (e.g., TI TPS5430) followed by an LDO (LP38690-1.5) for clean supply. VCCIO banks draw additional 100-200 mA per bank depending on switching activity. Sequence VCCINT before VCCIO during power-up to prevent I/O latch-up.
Do NOT attempt to use Cyclone IV EP4CE6F17 bitstreams on the EP1C6F256C2 - the architecture is incompatible. Configuration bitstreams are tied to device ID codes and the Cyclone I series uses a different bitstream format than Cyclone IV. Verify that Quartus II (version 13.0 SP1 or earlier) generates a .sof for the correct device family before programming via JTAG or EPCS configuration flash. The MSEL pins must be set correctly for the chosen configuration mode.
Estimated: the F256 BGA has theta_JA of approximately 18 °C/W with a standard JEDEC test board (4-layer, 1 oz copper). At 1 W total dissipation (typical industrial use), junction temperature rises 18 °C above ambient - well within the 85 °C commercial limit. At 2 W dissipation, ensure airflow of at least 100 LFM to maintain margin. Industrial-temperature variants (-40 to 100 °C ambient) may require thermal copper pours on the inner layers.
معلومات الامتثال
RoHS / REACH compliant per current distributor listings. Not AEC-Q100 qualified (commercial-grade FPGA, not automotive). Lead-free (Pb-free) per C2 grade designation.
