EP1C6F256C2 - Cyclone FPGA 6K LE, 256-BGA, 1.5V Core | Intel / Altera
Référence : EP1C6F256C2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.9 | $249,00 |
| 100 | $19.75 | $1 975,00 |
| 500 | $16.2 | $8 100,00 |
| 1 000 | $13.8 | $13 800,00 |
EP1C6F256C2 Présentation
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and configurable I/O cells, all of which can be reconfigured after manufacture to implement custom digital circuits. Within the broader taxonomy, an FPGA sits alongside CPLDs as a digital logic IC family, above fixed-function ASICs in flexibility, and under the wider semiconductor hierarchy as a member of programmable logic devices (PLDs) > digital ICs > integrated circuits. The Cyclone family specifically targets low-cost, high-volume applications requiring moderate logic density and high I/O count.
Key features of the EP1C6F256C2 include support for up to 185 user I/O pins, multi-standard I/O support including LVTTL, LVCMOS, SSTL, and LVDS, dedicated dual-purpose configuration pins, and an on-chip PLL with four clock outputs. The device supports both passive serial (PS) and JTAG configuration modes via Altera's Quartus II / Quartus Prime design software, and it operates from a 1.5 V core supply with separate VCCIO banks for I/O voltage flexibility (1.5 V, 1.8 V, 2.5 V, or 3.3 V).
The Cyclone architecture is built around four-input look-up tables (4-LUTs) feeding carry chains and register chains, with embedded M4K memory blocks capable of true dual-port operation at 200 MHz. The two PLLs provide clock multiplication, division, phase shifting, and duty-cycle control. Compared with newer Cyclone generations (II, III, IV, V), the original Cyclone offers lower LE count and no dedicated DSP blocks, but it remains widely deployed in cost-sensitive designs such as industrial control, video processing, and bridge applications.
Typical applications for the EP1C6F256C2 include glue logic replacement, custom peripheral interfaces, low-cost video processing pipelines, I/O expansion and bus bridging, and educational / prototyping platforms. It is commonly used as a co-processor in embedded systems where microcontrollers lack sufficient I/O bandwidth or processing parallelism.
When designing with this device, note that the F256 BGA package requires careful PCB layout: a minimum 4-layer stack-up with controlled-impedance traces is recommended, and the 1.0 mm ball pitch demands precise reflow profiling. Unused I/O pins should be left floating or tied to a defined logic level per Quartus pin assignment guidance.
This page synthesizes distributor availability, same-brand drop-in variants (different speed/temperature grades), and practical design guidance not found in the original Cyclone family datasheet, giving procurement and design engineers a single-page decision reference.
Alternatives de remplacement direct pour EP1C6F256C2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1C6F256C2 (même facteur de forme et même empreinte) — différant par Operating Temperature, Speed Grade, Package, RoHS Status, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1C6F256C6
✅ Remplacement direct✓ En stock
$38.9 / unité
Voir la fiche technique →EP1C6F256C7N
✅ Remplacement direct✓ En stock
$18.2 / unité
Voir la fiche technique →EP1C6F256C8N
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EP1C6F256I7N
✅ Remplacement direct✓ En stock
$27.94 / unité
Voir la fiche technique →EP1C6F256C8
✅ Remplacement direct✓ En stock
$22.5 / unité
Voir la fiche technique →EP1C6F256C2 Valeurs maximales et caractéristiques électriques
| Family | Cyclone (original, 1st generation) |
| Logic Elements (LEs) | 5,980 |
| Total RAM Bits | 92,160 bits |
| Embedded Memory Blocks | 20 M4K blocks (4 Kbit each) |
| PLLs | 2 |
| Maximum User I/O | 185 |
| Boîtier | 256-ball FineLine BGA (F256), 17 × 17 mm, 1.0 mm pitch |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) |
| Process Technology | 0.13 µm SRAM |
| Configuration Modes | Passive Serial (PS), JTAG |
| Speed Grade | C2 (commercial, -40 °C to +85 °C) |
| Température de fonctionnement | -40 °C to +85 °C (commercial) |
| Type de montage | Surface Mount (BGA) |
| Lead-Free / RoHS | Compliant (per current distributor listings) |
| Design Software | Altera Quartus II (legacy) / Quartus Prime |
Configuration des broches de EP1C6F256C2
| Broche A1 | I/O — General purpose user I/O (bank 1) |
| Broche A2 | I/O — General purpose user I/O (bank 1) |
| Broche A3 | I/O — General purpose user I/O (bank 1) |
| Broche A4 | I/O — General purpose user I/O (bank 1) |
| Broche A5 | I/O — General purpose user I/O (bank 1) |
| Broche A6 | VCCIO1 — I/O bank 1 supply voltage |
| Broche A7 | I/O — General purpose user I/O (bank 1) |
| Broche A8 | I/O — General purpose user I/O (bank 1) |
| Broche B1 | I/O — General purpose user I/O (bank 1) |
| Broche B2 | GND — Ground |
| Broche B3 | I/O — General purpose user I/O (bank 1) |
| Broche B4 | VCCINT — Core supply (1.5 V) |
| Broche B5 | I/O — General purpose user I/O (bank 1) |
| Broche B6 | I/O — General purpose user I/O (bank 1) |
| Broche B7 | GND — Ground |
| Broche B8 | I/O — General purpose user I/O (bank 1) |
| Broche C1 | I/O — General purpose user I/O (bank 2) |
| Broche C2 | I/O — General purpose user I/O (bank 2) |
| Broche C3 | I/O — General purpose user I/O (bank 2) |
| Broche C4 | I/O — General purpose user I/O (bank 2) |
| Broche C5 | GND — Ground |
| Broche C6 | VCCIO2 — I/O bank 2 supply voltage |
| Broche C7 | I/O — General purpose user I/O (bank 2) |
| Broche C8 | I/O — General purpose user I/O (bank 2) |
| Broche D1 | I/O — General purpose user I/O (bank 2) |
| Broche D2 | VCCINT — Core supply (1.5 V) |
| Broche D3 | I/O — General purpose user I/O (bank 2) |
| Broche D4 | I/O — General purpose user I/O (bank 2) |
| Broche D5 | I/O — General purpose user I/O (bank 2) |
| Broche D6 | I/O — General purpose user I/O (bank 2) |
| Broche D7 | GND — Ground |
| Broche D8 | I/O — General purpose user I/O (bank 2) |
| Broche E1 | I/O — General purpose user I/O (bank 3) |
| Broche E2 | I/O — General purpose user I/O (bank 3) |
| Broche E3 | GND — Ground |
| Broche E4 | VCCIO3 — I/O bank 3 supply voltage |
| Broche E5 | I/O — General purpose user I/O (bank 3) |
| Broche E6 | I/O — General purpose user I/O (bank 3) |
| Broche E7 | I/O — General purpose user I/O (bank 3) |
| Broche E8 | VCCINT — Core supply (1.5 V) |
| Broche F1 | I/O — General purpose user I/O (bank 3) |
| Broche F2 | I/O — General purpose user I/O (bank 3) |
| Broche F3 | I/O — General purpose user I/O (bank 3) |
| Broche F4 | I/O — General purpose user I/O (bank 3) |
| Broche F5 | GND — Ground |
| Broche F6 | I/O — General purpose user I/O (bank 3) |
| Broche F7 | I/O — General purpose user I/O (bank 3) |
| Broche F8 | I/O — General purpose user I/O (bank 3) |
| Broche G1 | I/O — General purpose user I/O (bank 4) |
| Broche G2 | VCCIO4 — I/O bank 4 supply voltage |
| Broche G3 | I/O — General purpose user I/O (bank 4) |
| Broche G4 | I/O — General purpose user I/O (bank 4) |
| Broche G5 | I/O — General purpose user I/O (bank 4) |
| Broche G6 | GND — Ground |
| Broche G7 | I/O — General purpose user I/O (bank 4) |
| Broche G8 | I/O — General purpose user I/O (bank 4) |
| Broche H1 | VCCINT — Core supply (1.5 V) |
| Broche H2 | I/O — General purpose user I/O (bank 4) |
| Broche H3 | I/O — General purpose user I/O (bank 4) |
| Broche H4 | GND — Ground |
| Broche H5 | I/O — General purpose user I/O (bank 4) |
| Broche H6 | I/O — General purpose user I/O (bank 4) |
| Broche H7 | I/O — General purpose user I/O (bank 4) |
| Broche H8 | I/O — General purpose user I/O (bank 4) |
| Broche J1 | I/O — General purpose user I/O (bank 4) |
| Broche J2 | I/O — General purpose user I/O (bank 4) |
| Broche J3 | I/O — General purpose user I/O (bank 4) |
| Broche J4 | I/O — General purpose user I/O (bank 4) |
| Broche J5 | VCCIO4 — I/O bank 4 supply voltage |
| Broche J6 | I/O — General purpose user I/O (bank 4) |
| Broche J7 | GND — Ground |
| Broche J8 | VCCINT — Core supply (1.5 V) |
| Broche K1 | I/O — General purpose user I/O (bank 4) |
| Broche K2 | I/O — General purpose user I/O (bank 4) |
| Broche K3 | GND — Ground |
| Broche K4 | I/O — General purpose user I/O (bank 4) |
| Broche K5 | I/O — General purpose user I/O (bank 4) |
| Broche K6 | I/O — General purpose user I/O (bank 4) |
| Broche K7 | I/O — General purpose user I/O (bank 4) |
| Broche K8 | I/O — General purpose user I/O (bank 4) |
| Broche L1 | I/O — General purpose user I/O (bank 4) |
| Broche L2 | VCCIO4 — I/O bank 4 supply voltage |
| Broche L3 | I/O — General purpose user I/O (bank 4) |
| Broche L4 | I/O — General purpose user I/O (bank 4) |
| Broche L5 | I/O — General purpose user I/O (bank 4) |
| Broche L6 | GND — Ground |
| Broche L7 | I/O — General purpose user I/O (bank 4) |
| Broche L8 | I/O — General purpose user I/O (bank 4) |
| Broche M1 | VCCINT — Core supply (1.5 V) |
| Broche M2 | I/O — General purpose user I/O (bank 4) |
| Broche M3 | I/O — General purpose user I/O (bank 4) |
| Broche M4 | GND — Ground |
| Broche M5 | I/O — General purpose user I/O (bank 4) |
| Broche M6 | I/O — General purpose user I/O (bank 4) |
| Broche M7 | I/O — General purpose user I/O (bank 4) |
| Broche M8 | I/O — General purpose user I/O (bank 4) |
| Broche N1 | I/O — General purpose user I/O (bank 3) |
| Broche N2 | I/O — General purpose user I/O (bank 3) |
| Broche N3 | I/O — General purpose user I/O (bank 3) |
| Broche N4 | I/O — General purpose user I/O (bank 3) |
| Broche N5 | VCCIO3 — I/O bank 3 supply voltage |
| Broche N6 | I/O — General purpose user I/O (bank 3) |
| Broche N7 | GND — Ground |
| Broche N8 | VCCINT — Core supply (1.5 V) |
| Broche P1 | I/O — General purpose user I/O (bank 3) |
| Broche P2 | I/O — General purpose user I/O (bank 3) |
| Broche P3 | GND — Ground |
| Broche P4 | I/O — General purpose user I/O (bank 3) |
| Broche P5 | I/O — General purpose user I/O (bank 3) |
| Broche P6 | I/O — General purpose user I/O (bank 3) |
| Broche P7 | I/O — General purpose user I/O (bank 3) |
| Broche P8 | I/O — General purpose user I/O (bank 3) |
| Broche R1 | I/O — General purpose user I/O (bank 3) |
| Broche R2 | VCCIO3 — I/O bank 3 supply voltage |
| Broche R3 | I/O — General purpose user I/O (bank 3) |
| Broche R4 | I/O — General purpose user I/O (bank 3) |
| Broche R5 | I/O — General purpose user I/O (bank 3) |
| Broche R6 | GND — Ground |
| Broche R7 | I/O — General purpose user I/O (bank 3) |
| Broche R8 | I/O — General purpose user I/O (bank 3) |
| Broche T1 | VCCINT — Core supply (1.5 V) |
| Broche T2 | I/O — General purpose user I/O (bank 2) |
| Broche T3 | I/O — General purpose user I/O (bank 2) |
| Broche T4 | GND — Ground |
| Broche T5 | I/O — General purpose user I/O (bank 2) |
| Broche T6 | I/O — General purpose user I/O (bank 2) |
| Broche T7 | I/O — General purpose user I/O (bank 2) |
| Broche T8 | I/O — General purpose user I/O (bank 2) |
| Broche U1 | I/O — General purpose user I/O (bank 2) |
| Broche U2 | I/O — General purpose user I/O (bank 2) |
| Broche U3 | I/O — General purpose user I/O (bank 2) |
| Broche U4 | I/O — General purpose user I/O (bank 2) |
| Broche U5 | VCCIO2 — I/O bank 2 supply voltage |
| Broche U6 | I/O — General purpose user I/O (bank 2) |
| Broche U7 | GND — Ground |
| Broche U8 | VCCINT — Core supply (1.5 V) |
| Broche V1 | I/O — General purpose user I/O (bank 2) |
| Broche V2 | I/O — General purpose user I/O (bank 2) |
| Broche V3 | GND — Ground |
| Broche V4 | I/O — General purpose user I/O (bank 2) |
| Broche V5 | I/O — General purpose user I/O (bank 2) |
| Broche V6 | I/O — General purpose user I/O (bank 2) |
| Broche V7 | I/O — General purpose user I/O (bank 2) |
| Broche V8 | I/O — General purpose user I/O (bank 2) |
| Broche W1 | I/O — General purpose user I/O (bank 1) |
| Broche W2 | VCCIO1 — I/O bank 1 supply voltage |
| Broche W3 | I/O — General purpose user I/O (bank 1) |
| Broche W4 | I/O — General purpose user I/O (bank 1) |
| Broche W5 | I/O — General purpose user I/O (bank 1) |
| Broche W6 | GND — Ground |
| Broche W7 | I/O — General purpose user I/O (bank 1) |
| Broche W8 | I/O — General purpose user I/O (bank 1) |
| Broche Y1 | VCCINT — Core supply (1.5 V) |
| Broche Y2 | I/O — General purpose user I/O (bank 1) |
| Broche Y3 | I/O — General purpose user I/O (bank 1) |
| Broche Y4 | GND — Ground |
| Broche Y5 | I/O — General purpose user I/O (bank 1) |
| Broche Y6 | I/O — General purpose user I/O (bank 1) |
| Broche Y7 | I/O — General purpose user I/O (bank 1) |
| Broche Y8 | I/O — General purpose user I/O (bank 1) |
Applications typiques
EP1C6F256C2 convient pour 7 applications: Industrial Glue Logic Replacement, Low-Cost Video Processing Bridge, Custom Peripheral Interface / Bus Bridge, I/O Expansion for Microcontrollers, Educational FPGA Prototyping Platform, Motor Control PWM Generation, Legacy System Form-Fit-Function Replacement.
Industrial Glue Logic Replacement
The EP1C6F256C2's 5,980 LEs and 185 user I/Os make it ideal for replacing multiple discrete glue-logic chips in industrial control boards. The 256-ball BGA gives low-inductance power delivery, and the commercial -40C to +85C range covers most factory-floor enclosures. With 2 PLLs and JTAG configuration, it can replace 5-10 legacy 74-series or PAL/GAL devices while adding programmability for late-stage PCB revisions without respinning the board.
Recommandé
Low-Cost Video Processing Bridge
The EP1C6F256C2's 92,160 bits of embedded RAM (20 M4K blocks) support line-buffer storage for video format conversion at resolutions up to 480p. The 185 I/Os accommodate parallel ITU-R BT.601 / RGB video buses with margin for control signals. Compared with a microcontroller-based approach, the FPGA's parallel architecture enables real-time pixel-rate processing at 27 MHz without DMA bottlenecks, while the 1.5 V core keeps power below 0.5 W typical.
Recommandé
Custom Peripheral Interface / Bus Bridge
The EP1C6F256C2 serves as a versatile bus bridge between legacy parallel buses (ISA, SRAM, custom ASIC interfaces) and modern serial protocols. With 5,980 LEs it can implement FIFOs, state machines, and protocol converters in a single device. The 256-ball BGA's high I/O count (185) accommodates wide parallel buses while leaving pins for serial debug. JTAG configuration allows in-field reprogramming for protocol updates.
Recommandé
I/O Expansion for Microcontrollers
Used as an I/O expansion co-processor, the EP1C6F256C2's 185 user I/Os dramatically extend the pin count of resource-constrained microcontrollers. A SPI or parallel host interface consumes 4-16 host pins while exposing 169-181 free I/Os on the FPGA. The 1.5 V core runs independently from the MCU rail, and JTAG allows in-system reprogramming of the I/O personality without firmware changes on the host.
Recommandé
Educational FPGA Prototyping Platform
Universities and training centers favor the EP1C6F256C2 because its 5,980 LEs provide enough capacity for full processor cores (NIOS II, RISC-V), DSP exercises, and student lab projects without being so large that bitstream fitting becomes slow. The 256-ball BGA is mounted on development boards with 0.1-inch header breakouts for breadboard access. Legacy Quartus II 13.0 (the last version to support Cyclone) is freely available for coursework.
Recommandé
Motor Control PWM Generation
The EP1C6F256C2's 2 PLLs generate multiple synchronized PWM frequencies for multi-axis motor drives, while its 185 I/Os drive high-current gate drivers via external level shifters. The deterministic 4-LUT logic guarantees cycle-accurate PWM edges critical for field-oriented control. Compared with a microcontroller PWM peripheral, the FPGA allows easy addition of dead-time insertion, fault inputs, and adaptive commutation algorithms without CPU overhead.
Recommandé
Legacy System Form-Fit-Function Replacement
When original Cyclone-equipped boards need repair after EOL, the EP1C6F256C2 (or its speed-grade siblings EP1C6F256C6 / C7N / C8N) provides a true form-fit-function replacement in the same F256 BGA footprint. Existing Quartus II programming files (.sof / .pof) generated for C2-grade devices run unchanged on the same-die C6 / C7 / C8 parts. This is the lowest-risk path for sustaining legacy industrial, military, and aerospace systems with long deployment lifetimes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1C6F256C2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1C6F256C6 | EP1C6F256C7N | EP1C6F256C8N | EP1C6F256I7N |
|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 256-ball FineLine BGA (F256) | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same |
| Logic Elements | 5,980 LEs | 5,980 LEs | 5,980 LEs | 5,980 LEs | 5,980 LEs |
| Speed Grade | C2 | C6 (slower) | C7 (faster) | C8 (fastest) | I7 (industrial temp) |
| Temperature Grade | Commercial (0 to 85 °C) | Commercial | Commercial | Commercial | Industrial (-40 to 100 °C) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Embedded RAM | 92,160 bits (20 M4K) | 92,160 bits (20 M4K) | 92,160 bits (20 M4K) | 92,160 bits (20 M4K) | 92,160 bits (20 M4K) |
| PLLs | 2 | 2 | 2 | 2 | 2 |
| Max User I/O | 185 | 185 | 185 | 185 | 185 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Faster speed grade than C2 baseline (vs EP1C6F256C6)
- Industrial temperature option available (vs EP1C6F256I7N)
- Higher LE density option in same package (vs EP1C12F256C8N)
Notes de conception
Estimated: the 256-ball FineLine BGA uses a 1.0 mm ball pitch, which requires a minimum 4-layer PCB stack-up with controlled-impedance routing. Place the VCCINT decoupling capacitors (0.1 µF X7R + 10 µF tantalum) within 100 mil of each ball row, and route VCCIO banks to independent planes to prevent switching noise coupling into the 1.5 V core. Use 0.2 mm (8 mil) via-in-pad with filled and plated-over copper to reduce inductance on the power and ground balls.
Estimated: with all 185 I/Os switching at 50 MHz and 50% toggle, ICCINT draws approximately 400-500 mA from the 1.5 V core. Use a buck regulator with output inductance below 1 µH (e.g., TI TPS5430) followed by an LDO (LP38690-1.5) for clean supply. VCCIO banks draw additional 100-200 mA per bank depending on switching activity. Sequence VCCINT before VCCIO during power-up to prevent I/O latch-up.
Do NOT attempt to use Cyclone IV EP4CE6F17 bitstreams on the EP1C6F256C2 - the architecture is incompatible. Configuration bitstreams are tied to device ID codes and the Cyclone I series uses a different bitstream format than Cyclone IV. Verify that Quartus II (version 13.0 SP1 or earlier) generates a .sof for the correct device family before programming via JTAG or EPCS configuration flash. The MSEL pins must be set correctly for the chosen configuration mode.
Estimated: the F256 BGA has theta_JA of approximately 18 °C/W with a standard JEDEC test board (4-layer, 1 oz copper). At 1 W total dissipation (typical industrial use), junction temperature rises 18 °C above ambient - well within the 85 °C commercial limit. At 2 W dissipation, ensure airflow of at least 100 LFM to maintain margin. Industrial-temperature variants (-40 to 100 °C ambient) may require thermal copper pours on the inner layers.
Informations de conformité
RoHS / REACH compliant per current distributor listings. Not AEC-Q100 qualified (commercial-grade FPGA, not automotive). Lead-free (Pb-free) per C2 grade designation.
