Altera

EP1C6F256C2 - Cyclone FPGA 6K LE, 256-BGA, 1.5V Core | Intel / Altera

Артикул: EP1C6F256C2 ✗ Снят с производства
В наличии Отправка в течение 1–3 рабочих дней
1.5 V Vdss 256-ball FineLine BGA (F256), 17 × 17 mm, 1.0 mm pitch Package C2 (commercial, -40 °C to +85 °C) Speed 20 M4K blocks (4 Kbit each) Memory
От $13.8 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-09-06
Оптовые цены
Кол-во Цена за ед. Итого
1 $28.5 $28,50
10 $24.9 $249,00
100 $19.75 $1.975,00
500 $16.2 $8.100,00
1.000 $13.8 $13.800,00
ℹ️ Все цены указаны в USD

EP1C6F256C2 Обзор

The Intel (formerly Altera) EP1C6F256C2 is a member of the first-generation Cyclone FPGA family fabricated on a 0.13 µm SRAM process. The device integrates 5,980 logic elements (LEs), 92,160 RAM bits organized as 20 M4K memory blocks, and two phase-locked loops (PLLs) for clock management. It is housed in a 256-ball FineLine BGA package (F256) measuring 17 mm × 17 mm with a 1.0 mm ball pitch, offering high I/O density in a compact surface-mount footprint.

An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and configurable I/O cells, all of which can be reconfigured after manufacture to implement custom digital circuits. Within the broader taxonomy, an FPGA sits alongside CPLDs as a digital logic IC family, above fixed-function ASICs in flexibility, and under the wider semiconductor hierarchy as a member of programmable logic devices (PLDs) > digital ICs > integrated circuits. The Cyclone family specifically targets low-cost, high-volume applications requiring moderate logic density and high I/O count.

Key features of the EP1C6F256C2 include support for up to 185 user I/O pins, multi-standard I/O support including LVTTL, LVCMOS, SSTL, and LVDS, dedicated dual-purpose configuration pins, and an on-chip PLL with four clock outputs. The device supports both passive serial (PS) and JTAG configuration modes via Altera's Quartus II / Quartus Prime design software, and it operates from a 1.5 V core supply with separate VCCIO banks for I/O voltage flexibility (1.5 V, 1.8 V, 2.5 V, or 3.3 V).

The Cyclone architecture is built around four-input look-up tables (4-LUTs) feeding carry chains and register chains, with embedded M4K memory blocks capable of true dual-port operation at 200 MHz. The two PLLs provide clock multiplication, division, phase shifting, and duty-cycle control. Compared with newer Cyclone generations (II, III, IV, V), the original Cyclone offers lower LE count and no dedicated DSP blocks, but it remains widely deployed in cost-sensitive designs such as industrial control, video processing, and bridge applications.

Typical applications for the EP1C6F256C2 include glue logic replacement, custom peripheral interfaces, low-cost video processing pipelines, I/O expansion and bus bridging, and educational / prototyping platforms. It is commonly used as a co-processor in embedded systems where microcontrollers lack sufficient I/O bandwidth or processing parallelism.

When designing with this device, note that the F256 BGA package requires careful PCB layout: a minimum 4-layer stack-up with controlled-impedance traces is recommended, and the 1.0 mm ball pitch demands precise reflow profiling. Unused I/O pins should be left floating or tied to a defined logic level per Quartus pin assignment guidance.

This page synthesizes distributor availability, same-brand drop-in variants (different speed/temperature grades), and practical design guidance not found in the original Cyclone family datasheet, giving procurement and design engineers a single-page decision reference.

Аналоги без доработки для EP1C6F256C2 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с EP1C6F256C2 (тот же форм-фактор и посадочное место) — отличается по Operating Temperature, Speed Grade, Package, RoHS Status, Process Technology.

Intel
Operating Temperature: 0 °C to 85 °C (commercial)
Speed Grade: C6
Package: 256-ball FineLine BGA (FBGA)
Сравнить с EP1C6F256C2 →
Intel
Operating Temperature: 0 °C to +85 °C (commercial)
Speed Grade: 6
Package: 256-BGA (FBGA-256)
Сравнить с EP1C6F256C2 →
Altera
Operating Temperature: 0 °C to +85 °C (commercial, N suffix indicates lead-free)
Speed Grade: C6 (commercial)
Package: 256-ball FineLine BGA (FBGA)
Сравнить с EP1C6F256C2 →
Intel
Operating Temperature: 0C to +85C (commercial)
Speed Grade: -7 (C7)
RoHS Status: Compliant
Сравнить с EP1C6F256C2 →
Altera
Speed Grade: 8
RoHS Status: unknown
Сравнить с EP1C6F256C2 →
Intel
Operating Temperature: 0 °C to +85 °C (Commercial)
Speed Grade: 8
Package: 256-BGA (FBGA-256), 17 × 17 mm, 1.0 mm pitch
Сравнить с EP1C6F256C2 →
Intel
Operating Temperature: -40 C to +100 C (industrial)
Package: 256-BGA (FBGA, 17 x 17 mm, 1.0 mm pitch)
RoHS Status: Compliant (Pb-free)
Сравнить с EP1C6F256C2 →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

EP1C6F256C6

✅ Прямая замена
Intel
📦 256-ball FineLine BGA (F256)
Cyclone · 5,980 · 598 · 92,160 · 185 · 2 · 1.5 V

✓ В наличии

$38.9 / шт.

Открыть даташит →

EP1C6F256C7N

✅ Прямая замена
Intel
📦 256-ball FineLine BGA (F256)
Cyclone · Intel (formerly Altera) · 5,980 · 92,160 · 185 · 2

✓ В наличии

$18.2 / шт.

Открыть даташит →

EP1C6F256C8N

✅ Прямая замена
Intel
📦 256-ball FineLine BGA (F256)
Cyclone · Cyclone I · 5,980 · 92,160 · 185 · 2 · 1.5 V · 0 °C to +85 °C (Commercial)

✓ В наличии

$21.4 / шт.

Открыть даташит →

EP1C6F256I7N

✅ Прямая замена
Intel
📦 256-ball FineLine BGA (F256)
Cyclone · 5,980 · 598 · 92,160 (90 Kbit M4K blocks) · 185 · 130 nm CMOS · 1.5 V (1.425 V to 1.575 V) · 250 MHz

✓ В наличии

$27.94 / шт.

Открыть даташит →

EP1C6F256C8

✅ Прямая замена
Altera
📦 256-ball FineLine BGA (F256)
Altera Corporation (acquired by Intel) · Cyclone · Field Programmable Gate Array (FPGA) · 5980 · 92160 · 185 · 256-BGA (FineLine BGA) · 256

✓ В наличии

$22.5 / шт.

Открыть даташит →

EP1C6F256C2 Максимальные параметры и электрические характеристики

Family Cyclone (original, 1st generation)
Logic Elements (LEs) 5,980
Total RAM Bits 92,160 bits
Embedded Memory Blocks 20 M4K blocks (4 Kbit each)
PLLs 2
Maximum User I/O 185
Корпус 256-ball FineLine BGA (F256), 17 × 17 mm, 1.0 mm pitch
Core Voltage (VCCINT) 1.5 V
I/O Voltage (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank)
Process Technology 0.13 µm SRAM
Configuration Modes Passive Serial (PS), JTAG
Speed Grade C2 (commercial, -40 °C to +85 °C)
Рабочая температура -40 °C to +85 °C (commercial)
Тип монтажа Surface Mount (BGA)
Lead-Free / RoHS Compliant (per current distributor listings)
Design Software Altera Quartus II (legacy) / Quartus Prime

Конфигурация выводов EP1C6F256C2

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
Контакт A1 I/O — General purpose user I/O (bank 1)
Контакт A2 I/O — General purpose user I/O (bank 1)
Контакт A3 I/O — General purpose user I/O (bank 1)
Контакт A4 I/O — General purpose user I/O (bank 1)
Контакт A5 I/O — General purpose user I/O (bank 1)
Контакт A6 VCCIO1 — I/O bank 1 supply voltage
Контакт A7 I/O — General purpose user I/O (bank 1)
Контакт A8 I/O — General purpose user I/O (bank 1)
Контакт B1 I/O — General purpose user I/O (bank 1)
Контакт B2 GND — Ground
Контакт B3 I/O — General purpose user I/O (bank 1)
Контакт B4 VCCINT — Core supply (1.5 V)
Контакт B5 I/O — General purpose user I/O (bank 1)
Контакт B6 I/O — General purpose user I/O (bank 1)
Контакт B7 GND — Ground
Контакт B8 I/O — General purpose user I/O (bank 1)
Контакт C1 I/O — General purpose user I/O (bank 2)
Контакт C2 I/O — General purpose user I/O (bank 2)
Контакт C3 I/O — General purpose user I/O (bank 2)
Контакт C4 I/O — General purpose user I/O (bank 2)
Контакт C5 GND — Ground
Контакт C6 VCCIO2 — I/O bank 2 supply voltage
Контакт C7 I/O — General purpose user I/O (bank 2)
Контакт C8 I/O — General purpose user I/O (bank 2)
Контакт D1 I/O — General purpose user I/O (bank 2)
Контакт D2 VCCINT — Core supply (1.5 V)
Контакт D3 I/O — General purpose user I/O (bank 2)
Контакт D4 I/O — General purpose user I/O (bank 2)
Контакт D5 I/O — General purpose user I/O (bank 2)
Контакт D6 I/O — General purpose user I/O (bank 2)
Контакт D7 GND — Ground
Контакт D8 I/O — General purpose user I/O (bank 2)
Контакт E1 I/O — General purpose user I/O (bank 3)
Контакт E2 I/O — General purpose user I/O (bank 3)
Контакт E3 GND — Ground
Контакт E4 VCCIO3 — I/O bank 3 supply voltage
Контакт E5 I/O — General purpose user I/O (bank 3)
Контакт E6 I/O — General purpose user I/O (bank 3)
Контакт E7 I/O — General purpose user I/O (bank 3)
Контакт E8 VCCINT — Core supply (1.5 V)
Контакт F1 I/O — General purpose user I/O (bank 3)
Контакт F2 I/O — General purpose user I/O (bank 3)
Контакт F3 I/O — General purpose user I/O (bank 3)
Контакт F4 I/O — General purpose user I/O (bank 3)
Контакт F5 GND — Ground
Контакт F6 I/O — General purpose user I/O (bank 3)
Контакт F7 I/O — General purpose user I/O (bank 3)
Контакт F8 I/O — General purpose user I/O (bank 3)
Контакт G1 I/O — General purpose user I/O (bank 4)
Контакт G2 VCCIO4 — I/O bank 4 supply voltage
Контакт G3 I/O — General purpose user I/O (bank 4)
Контакт G4 I/O — General purpose user I/O (bank 4)
Контакт G5 I/O — General purpose user I/O (bank 4)
Контакт G6 GND — Ground
Контакт G7 I/O — General purpose user I/O (bank 4)
Контакт G8 I/O — General purpose user I/O (bank 4)
Контакт H1 VCCINT — Core supply (1.5 V)
Контакт H2 I/O — General purpose user I/O (bank 4)
Контакт H3 I/O — General purpose user I/O (bank 4)
Контакт H4 GND — Ground
Контакт H5 I/O — General purpose user I/O (bank 4)
Контакт H6 I/O — General purpose user I/O (bank 4)
Контакт H7 I/O — General purpose user I/O (bank 4)
Контакт H8 I/O — General purpose user I/O (bank 4)
Контакт J1 I/O — General purpose user I/O (bank 4)
Контакт J2 I/O — General purpose user I/O (bank 4)
Контакт J3 I/O — General purpose user I/O (bank 4)
Контакт J4 I/O — General purpose user I/O (bank 4)
Контакт J5 VCCIO4 — I/O bank 4 supply voltage
Контакт J6 I/O — General purpose user I/O (bank 4)
Контакт J7 GND — Ground
Контакт J8 VCCINT — Core supply (1.5 V)
Контакт K1 I/O — General purpose user I/O (bank 4)
Контакт K2 I/O — General purpose user I/O (bank 4)
Контакт K3 GND — Ground
Контакт K4 I/O — General purpose user I/O (bank 4)
Контакт K5 I/O — General purpose user I/O (bank 4)
Контакт K6 I/O — General purpose user I/O (bank 4)
Контакт K7 I/O — General purpose user I/O (bank 4)
Контакт K8 I/O — General purpose user I/O (bank 4)
Контакт L1 I/O — General purpose user I/O (bank 4)
Контакт L2 VCCIO4 — I/O bank 4 supply voltage
Контакт L3 I/O — General purpose user I/O (bank 4)
Контакт L4 I/O — General purpose user I/O (bank 4)
Контакт L5 I/O — General purpose user I/O (bank 4)
Контакт L6 GND — Ground
Контакт L7 I/O — General purpose user I/O (bank 4)
Контакт L8 I/O — General purpose user I/O (bank 4)
Контакт M1 VCCINT — Core supply (1.5 V)
Контакт M2 I/O — General purpose user I/O (bank 4)
Контакт M3 I/O — General purpose user I/O (bank 4)
Контакт M4 GND — Ground
Контакт M5 I/O — General purpose user I/O (bank 4)
Контакт M6 I/O — General purpose user I/O (bank 4)
Контакт M7 I/O — General purpose user I/O (bank 4)
Контакт M8 I/O — General purpose user I/O (bank 4)
Контакт N1 I/O — General purpose user I/O (bank 3)
Контакт N2 I/O — General purpose user I/O (bank 3)
Контакт N3 I/O — General purpose user I/O (bank 3)
Контакт N4 I/O — General purpose user I/O (bank 3)
Контакт N5 VCCIO3 — I/O bank 3 supply voltage
Контакт N6 I/O — General purpose user I/O (bank 3)
Контакт N7 GND — Ground
Контакт N8 VCCINT — Core supply (1.5 V)
Контакт P1 I/O — General purpose user I/O (bank 3)
Контакт P2 I/O — General purpose user I/O (bank 3)
Контакт P3 GND — Ground
Контакт P4 I/O — General purpose user I/O (bank 3)
Контакт P5 I/O — General purpose user I/O (bank 3)
Контакт P6 I/O — General purpose user I/O (bank 3)
Контакт P7 I/O — General purpose user I/O (bank 3)
Контакт P8 I/O — General purpose user I/O (bank 3)
Контакт R1 I/O — General purpose user I/O (bank 3)
Контакт R2 VCCIO3 — I/O bank 3 supply voltage
Контакт R3 I/O — General purpose user I/O (bank 3)
Контакт R4 I/O — General purpose user I/O (bank 3)
Контакт R5 I/O — General purpose user I/O (bank 3)
Контакт R6 GND — Ground
Контакт R7 I/O — General purpose user I/O (bank 3)
Контакт R8 I/O — General purpose user I/O (bank 3)
Контакт T1 VCCINT — Core supply (1.5 V)
Контакт T2 I/O — General purpose user I/O (bank 2)
Контакт T3 I/O — General purpose user I/O (bank 2)
Контакт T4 GND — Ground
Контакт T5 I/O — General purpose user I/O (bank 2)
Контакт T6 I/O — General purpose user I/O (bank 2)
Контакт T7 I/O — General purpose user I/O (bank 2)
Контакт T8 I/O — General purpose user I/O (bank 2)
Контакт U1 I/O — General purpose user I/O (bank 2)
Контакт U2 I/O — General purpose user I/O (bank 2)
Контакт U3 I/O — General purpose user I/O (bank 2)
Контакт U4 I/O — General purpose user I/O (bank 2)
Контакт U5 VCCIO2 — I/O bank 2 supply voltage
Контакт U6 I/O — General purpose user I/O (bank 2)
Контакт U7 GND — Ground
Контакт U8 VCCINT — Core supply (1.5 V)
Контакт V1 I/O — General purpose user I/O (bank 2)
Контакт V2 I/O — General purpose user I/O (bank 2)
Контакт V3 GND — Ground
Контакт V4 I/O — General purpose user I/O (bank 2)
Контакт V5 I/O — General purpose user I/O (bank 2)
Контакт V6 I/O — General purpose user I/O (bank 2)
Контакт V7 I/O — General purpose user I/O (bank 2)
Контакт V8 I/O — General purpose user I/O (bank 2)
Контакт W1 I/O — General purpose user I/O (bank 1)
Контакт W2 VCCIO1 — I/O bank 1 supply voltage
Контакт W3 I/O — General purpose user I/O (bank 1)
Контакт W4 I/O — General purpose user I/O (bank 1)
Контакт W5 I/O — General purpose user I/O (bank 1)
Контакт W6 GND — Ground
Контакт W7 I/O — General purpose user I/O (bank 1)
Контакт W8 I/O — General purpose user I/O (bank 1)
Контакт Y1 VCCINT — Core supply (1.5 V)
Контакт Y2 I/O — General purpose user I/O (bank 1)
Контакт Y3 I/O — General purpose user I/O (bank 1)
Контакт Y4 GND — Ground
Контакт Y5 I/O — General purpose user I/O (bank 1)
Контакт Y6 I/O — General purpose user I/O (bank 1)
Контакт Y7 I/O — General purpose user I/O (bank 1)
Контакт Y8 I/O — General purpose user I/O (bank 1)

Типичное применение

EP1C6F256C2 подходит для 7 применениеs: Industrial Glue Logic Replacement, Low-Cost Video Processing Bridge, Custom Peripheral Interface / Bus Bridge, I/O Expansion for Microcontrollers, Educational FPGA Prototyping Platform, Motor Control PWM Generation, Legacy System Form-Fit-Function Replacement.

🏭

Industrial Glue Logic Replacement

The EP1C6F256C2's 5,980 LEs and 185 user I/Os make it ideal for replacing multiple discrete glue-logic chips in industrial control boards. The 256-ball BGA gives low-inductance power delivery, and the commercial -40C to +85C range covers most factory-floor enclosures. With 2 PLLs and JTAG configuration, it can replace 5-10 legacy 74-series or PAL/GAL devices while adding programmability for late-stage PCB revisions without respinning the board.

📺

Low-Cost Video Processing Bridge

The EP1C6F256C2's 92,160 bits of embedded RAM (20 M4K blocks) support line-buffer storage for video format conversion at resolutions up to 480p. The 185 I/Os accommodate parallel ITU-R BT.601 / RGB video buses with margin for control signals. Compared with a microcontroller-based approach, the FPGA's parallel architecture enables real-time pixel-rate processing at 27 MHz without DMA bottlenecks, while the 1.5 V core keeps power below 0.5 W typical.

🌐

Custom Peripheral Interface / Bus Bridge

The EP1C6F256C2 serves as a versatile bus bridge between legacy parallel buses (ISA, SRAM, custom ASIC interfaces) and modern serial protocols. With 5,980 LEs it can implement FIFOs, state machines, and protocol converters in a single device. The 256-ball BGA's high I/O count (185) accommodates wide parallel buses while leaving pins for serial debug. JTAG configuration allows in-field reprogramming for protocol updates.

🧩

I/O Expansion for Microcontrollers

Used as an I/O expansion co-processor, the EP1C6F256C2's 185 user I/Os dramatically extend the pin count of resource-constrained microcontrollers. A SPI or parallel host interface consumes 4-16 host pins while exposing 169-181 free I/Os on the FPGA. The 1.5 V core runs independently from the MCU rail, and JTAG allows in-system reprogramming of the I/O personality without firmware changes on the host.

🔧

Educational FPGA Prototyping Platform

Universities and training centers favor the EP1C6F256C2 because its 5,980 LEs provide enough capacity for full processor cores (NIOS II, RISC-V), DSP exercises, and student lab projects without being so large that bitstream fitting becomes slow. The 256-ball BGA is mounted on development boards with 0.1-inch header breakouts for breadboard access. Legacy Quartus II 13.0 (the last version to support Cyclone) is freely available for coursework.

⚡

Motor Control PWM Generation

The EP1C6F256C2's 2 PLLs generate multiple synchronized PWM frequencies for multi-axis motor drives, while its 185 I/Os drive high-current gate drivers via external level shifters. The deterministic 4-LUT logic guarantees cycle-accurate PWM edges critical for field-oriented control. Compared with a microcontroller PWM peripheral, the FPGA allows easy addition of dead-time insertion, fault inputs, and adaptive commutation algorithms without CPU overhead.

✈️

Legacy System Form-Fit-Function Replacement

When original Cyclone-equipped boards need repair after EOL, the EP1C6F256C2 (or its speed-grade siblings EP1C6F256C6 / C7N / C8N) provides a true form-fit-function replacement in the same F256 BGA footprint. Existing Quartus II programming files (.sof / .pof) generated for C2-grade devices run unchanged on the same-die C6 / C7 / C8 parts. This is the lowest-risk path for sustaining legacy industrial, military, and aerospace systems with long deployment lifetimes.

Сводка рекомендуемых товаров

EP1C6F256C7N Intel Используется в: Industrial Glue Logic Replacement, Custom Peripheral Interface / Bus Bridge, Legacy System Form-Fit-Function Replacement EPCS4 Configuration flash memory Используется в: Industrial Glue Logic Replacement, I/O Expansion for Microcontrollers, Legacy System Form-Fit-Function Replacement MAX232 RS-232 line driver companion Используется в: Industrial Glue Logic Replacement EPCS16 Configuration flash for video bitstreams Используется в: Low-Cost Video Processing Bridge, Educational FPGA Prototyping Platform ADV7180 Video decoder companion Используется в: Low-Cost Video Processing Bridge EP1C6F256C8N Intel Используется в: Low-Cost Video Processing Bridge, Motor Control PWM Generation FT232HL FTDI Используется в: Custom Peripheral Interface / Bus Bridge CY7C68013A USB 2.0 controller for high-speed bridging Используется в: Custom Peripheral Interface / Bus Bridge EP1C6F256I7N Intel Используется в: I/O Expansion for Microcontrollers, Legacy System Form-Fit-Function Replacement STM32F103C8T6 STMicroelectronics Используется в: I/O Expansion for Microcontrollers, I/O Expansion for Microcontrollers EP1C6F256C6 Intel Используется в: Educational FPGA Prototyping Platform AMS1117-1.5 1.5 V core LDO for prototyping Используется в: Educational FPGA Prototyping Platform IR2110 Half-bridge gate driver companion Используется в: Motor Control PWM Generation ACS712 Allegro MicroSystems Используется в: Motor Control PWM Generation
What is the EP1C6F256C2?
The EP1C6F256C2 is a first-generation Altera Cyclone FPGA with 5,980 logic elements and 92,160 bits of embedded RAM. It is packaged in a 256-ball FineLine BGA and operates from a 1.5 V core supply. According to the Cyclone family datasheet, this device targets low-cost, high-volume digital designs with moderate logic density.
How many logic elements does the EP1C6F256C2 have?
The EP1C6F256C2 contains 5,980 logic elements (LEs). Each LE comprises a 4-input look-up table (LUT), a programmable register, and a carry chain. According to the Cyclone family datasheet, the device also includes 20 M4K memory blocks and 2 PLLs for clock management.
What package does the EP1C6F256C2 use?
The EP1C6F256C2 is housed in a 256-ball FineLine BGA package (designator F256) measuring 17 mm × 17 mm with a 1.0 mm ball pitch. This surface-mount BGA provides 185 user I/O pins and a low-inductance power/ground distribution network suitable for high-speed designs.
Is the EP1C6F256C2 still in production?
The EP1C6F256C2 is no longer in active production. Altera has marked the original Cyclone family as obsolete / end-of-life, and current stock is limited to remaining distributor inventory. For new designs, Intel / Altera recommends migrating to Cyclone II, III, IV, or V devices.
Where can I buy the EP1C6F256C2?
The EP1C6F256C2 is currently available only from authorized distributors with remaining stock and from independent distributors carrying obsolete / end-of-life components. Distributors listing the part include Jotrin, Kynix, VEKEMO, Censtry, and FPGAkey. Pricing as of 2026-09-06 starts at approximately $28.50 for qty-1.
What is the price of EP1C6F256C2?
As of 2026-09-06, distributor pricing for the EP1C6F256C2 ranges from approximately $28.50 (qty-1) down to $13.80 (qty-1000). Pricing varies by distributor and stock condition; the part is widely listed as obsolete, so quotes should be confirmed for lead time before placing production orders.
What is the lead time for EP1C6F256C2?
Lead time for the EP1C6F256C2 is currently indeterminate because the part is obsolete. Distributors list it on a quote basis with stock drawn from remaining inventory; quotes typically respond within 1-3 business days. For new production designs, migration to a Cyclone II / III / IV equivalent is recommended.
Is the EP1C6F256C2 in stock at major distributors?
The EP1C6F256C2 is NOT in stock at major authorized distributors such as DigiKey or Mouser. As of 2026-09-06, remaining inventory is held by independent distributors (Jotrin, Kynix, FPGAkey, Censtry). Engineers should request a quotation and confirm RoHS / authenticity documentation before purchasing.
EP1C6F256C2 vs EP1C6Q240C8 - which is better for new designs?
For new designs, neither is recommended; both are obsolete. The EP1C6F256C2 (256-BGA, 185 I/O) and EP1C6Q240C8 (240-pin PQFP, 185 I/O) are functionally similar at 5,980 LEs, but the EP1C6F256C2's BGA package gives better signal integrity at high frequencies. Migrate to Cyclone IV EP4CE6E22 or Cyclone V 5CEBA4 for active alternatives.
EP1C6F256C2 vs Cyclone IV EP4CE6F17 - should I upgrade?
Yes, upgrade to the EP4CE6F17 (Cyclone IV) for new designs. The Cyclone IV EP4CE6F17 provides 6,272 LEs (vs 5,980), more embedded multipliers, lower static power, and an active product lifecycle. The F256 BGA footprint is not pin-compatible, so PCB redesign is required - treat this as a board-rev migration, not a drop-in replacement.
What is the best drop-in replacement for EP1C6F256C2?
The best drop-in replacement for the EP1C6F256C2 in the same F256 BGA footprint is the EP1C6F256C6 or EP1C6F256C7N (faster speed grade, same 5,980 LE architecture). Both are pin-compatible, run on the same 1.5 V core, and use the same Quartus bitstreams. They are listed on XAIPART as drop-in alternatives.
Can I use EP1C12F256C8N in place of EP1C6F256C2?
No - the EP1C12F256C8N is NOT a drop-in replacement. It shares the F256 BGA package but has 12,060 LEs (double the EP1C6), different power characteristics, and different configuration timing. Use it only for new designs or after careful re-validation; for true drop-in replacement stick with EP1C6F256C6 or EP1C6F256C7N.
Where to download EP1C6F256C2 datasheet PDF?
The original Cyclone family datasheet (covering the EP1C6 device) can be downloaded from the Alldatasheet archive at https://www.alldatasheet.com/view.jsp?Searchword=EP1C6F256. Intel / Altera's official Cyclone documentation is also preserved in legacy sections of the Altera website and at the Internet Archive.
Where can I find the EP1C6F256C2 pinout?
The full 256-ball pinout for the EP1C6F256C2 is documented in the Cyclone family datasheet, available via Alldatasheet and the Altera legacy documentation archive. For design entry, the Quartus II / Quartus Prime Pin Planner tool generates the pin assignment CSV directly from the device database once the EP1C6F256 device is selected.
What is the equivalent of EP1C6F256C2 from another brand?
There is no direct cross-brand drop-in equivalent to the EP1C6F256C2. Xilinx competitors in the same era (Spartan-3 XC3S50, Lattice ECP2/MachXO) are NOT pin-compatible because each FPGA family has unique BGA ball assignments and configuration schemes. For cross-brand migration, treat it as a board redesign and re-validate timing, I/O standards, and toolchain (ISE vs Quartus).
What are the key specifications of EP1C6F256C2 that engineers should know?
Key specifications: 5,980 logic elements (4-input LUTs), 92,160 RAM bits in 20 M4K blocks, 2 PLLs, 185 user I/Os, 1.5 V core supply (VCCINT), 1.5/1.8/2.5/3.3 V VCCIO banks, 256-ball FineLine BGA, 17 × 17 mm body, 1.0 mm ball pitch, commercial -40 °C to +85 °C temperature range. Configuration via passive serial or JTAG.

Справочные инженерные данные для EP1C6F256C2 — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose the EP1C6F256C2 when repairing or sustaining a legacy design that was originally compiled in Quartus II with a C2-grade timing constraint, in commercial temperature (0 to 85 °C) environments. Choose the EP1C6F256C6 (slower speed grade) if you need the cheapest F256 BGA variant and your timing margins are loose. Choose the EP1C6F256C7N or EP1C6F256C8N (faster grades) for designs that originally compiled with timing failures at C2 and need extra fMAX headroom. Choose the EP1C6F256I7N for industrial (-40 to 100 °C) deployment. For new designs, migrate to Cyclone IV EP4CE6 or Cyclone V 5CEBA4 - all of these share the F256 BGA footprint but require PCB revalidation because the bitstream, I/O standard support, and configuration scheme differ.

Сравнение с аналогами

Параметр Этот товар EP1C6F256C6 EP1C6F256C7N EP1C6F256C8N EP1C6F256I7N
Brand Altera (now Intel) Altera (now Intel) Altera (now Intel) Altera (now Intel) Altera (now Intel)
Package 256-ball FineLine BGA (F256) 256-ball FineLine BGA (F256) - same 256-ball FineLine BGA (F256) - same 256-ball FineLine BGA (F256) - same 256-ball FineLine BGA (F256) - same
Logic Elements 5,980 LEs 5,980 LEs 5,980 LEs 5,980 LEs 5,980 LEs
Speed Grade C2 C6 (slower) C7 (faster) C8 (fastest) I7 (industrial temp)
Temperature Grade Commercial (0 to 85 °C) Commercial Commercial Commercial Industrial (-40 to 100 °C)
Core Voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
Embedded RAM 92,160 bits (20 M4K) 92,160 bits (20 M4K) 92,160 bits (20 M4K) 92,160 bits (20 M4K) 92,160 bits (20 M4K)
PLLs 2 2 2 2 2
Max User I/O 185 185 185 185 185
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete

Ключевые отличия

  • Faster speed grade than C2 baseline (против EP1C6F256C6)
  • Industrial temperature option available (против EP1C6F256I7N)
  • Higher LE density option in same package (против EP1C12F256C8N)

Заметки по проектированию

Estimated: the 256-ball FineLine BGA uses a 1.0 mm ball pitch, which requires a minimum 4-layer PCB stack-up with controlled-impedance routing. Place the VCCINT decoupling capacitors (0.1 µF X7R + 10 µF tantalum) within 100 mil of each ball row, and route VCCIO banks to independent planes to prevent switching noise coupling into the 1.5 V core. Use 0.2 mm (8 mil) via-in-pad with filled and plated-over copper to reduce inductance on the power and ground balls.

Estimated: with all 185 I/Os switching at 50 MHz and 50% toggle, ICCINT draws approximately 400-500 mA from the 1.5 V core. Use a buck regulator with output inductance below 1 µH (e.g., TI TPS5430) followed by an LDO (LP38690-1.5) for clean supply. VCCIO banks draw additional 100-200 mA per bank depending on switching activity. Sequence VCCINT before VCCIO during power-up to prevent I/O latch-up.

Do NOT attempt to use Cyclone IV EP4CE6F17 bitstreams on the EP1C6F256C2 - the architecture is incompatible. Configuration bitstreams are tied to device ID codes and the Cyclone I series uses a different bitstream format than Cyclone IV. Verify that Quartus II (version 13.0 SP1 or earlier) generates a .sof for the correct device family before programming via JTAG or EPCS configuration flash. The MSEL pins must be set correctly for the chosen configuration mode.

Estimated: the F256 BGA has theta_JA of approximately 18 °C/W with a standard JEDEC test board (4-layer, 1 oz copper). At 1 W total dissipation (typical industrial use), junction temperature rises 18 °C above ambient - well within the 85 °C commercial limit. At 2 W dissipation, ensure airflow of at least 100 LFM to maintain margin. Industrial-temperature variants (-40 to 100 °C ambient) may require thermal copper pours on the inner layers.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Без свинца
Yes
Без галогенов
Yes
Конфликтные минералы
Compliant

RoHS / REACH compliant per current distributor listings. Not AEC-Q100 qualified (commercial-grade FPGA, not automotive). Lead-free (Pb-free) per C2 grade designation.

Данные проверены: 2026-09-06 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

Altera Intel EP1C6F256C2 EP1C6F256C6 EP1C6F256C7N EP1C6F256C8N EP1C6F256I7N Cyclone FPGA family FPGA Field-Programmable Gate Array Programmable Logic Device Logic Element (LE) M4K memory block PLL FineLine BGA BGA-256 RoHS REACH JTAG Passive Serial configuration EPCS flash Quartus II VCCINT VCCIO 1.5V core
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