Altera

EP1C6F256C2 - Cyclone FPGA 6K LE, 256-BGA, 1.5V Core | Intel / Altera

MPN: EP1C6F256C2 ✗ Akhir Hidup
1.5 V Vdss 256-ball FineLine BGA (F256), 17 × 17 mm, 1.0 mm pitch Package C2 (commercial, -40 °C to +85 °C) Speed 20 M4K blocks (4 Kbit each) Memory
MOQ: 1 |

EP1C6F256C2 Ringkasan

The Intel (formerly Altera) EP1C6F256C2 is a member of the first-generation Cyclone FPGA family fabricated on a 0.13 µm SRAM process. The device integrates 5,980 logic elements (LEs), 92,160 RAM bits organized as 20 M4K memory blocks, and two phase-locked loops (PLLs) for clock management. It is housed in a 256-ball FineLine BGA package (F256) measuring 17 mm × 17 mm with a 1.0 mm ball pitch, offering high I/O density in a compact surface-mount footprint.

An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and configurable I/O cells, all of which can be reconfigured after manufacture to implement custom digital circuits. Within the broader taxonomy, an FPGA sits alongside CPLDs as a digital logic IC family, above fixed-function ASICs in flexibility, and under the wider semiconductor hierarchy as a member of programmable logic devices (PLDs) > digital ICs > integrated circuits. The Cyclone family specifically targets low-cost, high-volume applications requiring moderate logic density and high I/O count.

Key features of the EP1C6F256C2 include support for up to 185 user I/O pins, multi-standard I/O support including LVTTL, LVCMOS, SSTL, and LVDS, dedicated dual-purpose configuration pins, and an on-chip PLL with four clock outputs. The device supports both passive serial (PS) and JTAG configuration modes via Altera's Quartus II / Quartus Prime design software, and it operates from a 1.5 V core supply with separate VCCIO banks for I/O voltage flexibility (1.5 V, 1.8 V, 2.5 V, or 3.3 V).

The Cyclone architecture is built around four-input look-up tables (4-LUTs) feeding carry chains and register chains, with embedded M4K memory blocks capable of true dual-port operation at 200 MHz. The two PLLs provide clock multiplication, division, phase shifting, and duty-cycle control. Compared with newer Cyclone generations (II, III, IV, V), the original Cyclone offers lower LE count and no dedicated DSP blocks, but it remains widely deployed in cost-sensitive designs such as industrial control, video processing, and bridge applications.

Typical applications for the EP1C6F256C2 include glue logic replacement, custom peripheral interfaces, low-cost video processing pipelines, I/O expansion and bus bridging, and educational / prototyping platforms. It is commonly used as a co-processor in embedded systems where microcontrollers lack sufficient I/O bandwidth or processing parallelism.

When designing with this device, note that the F256 BGA package requires careful PCB layout: a minimum 4-layer stack-up with controlled-impedance traces is recommended, and the 1.0 mm ball pitch demands precise reflow profiling. Unused I/O pins should be left floating or tied to a defined logic level per Quartus pin assignment guidance.

This page synthesizes distributor availability, same-brand drop-in variants (different speed/temperature grades), and practical design guidance not found in the original Cyclone family datasheet, giving procurement and design engineers a single-page decision reference.

Alternatif penggantian untuk EP1C6F256C2 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EP1C6F256C2 (sama faktor bentuk dan footprint) — berbeda di dalam Operating Temperature, Speed Grade, Package, RoHS Status, Process Technology.

Intel
Operating Temperature: 0 °C to 85 °C (commercial)
Speed Grade: C6
Package: 256-ball FineLine BGA (FBGA)
Bandingkan dengan EP1C6F256C2 →
Intel
Operating Temperature: 0 °C to +85 °C (commercial)
Speed Grade: 6
Package: 256-BGA (FBGA-256)
Bandingkan dengan EP1C6F256C2 →
Altera
Operating Temperature: 0 °C to +85 °C (commercial, N suffix indicates lead-free)
Speed Grade: C6 (commercial)
Package: 256-ball FineLine BGA (FBGA)
Bandingkan dengan EP1C6F256C2 →
Intel
Operating Temperature: 0C to +85C (commercial)
Speed Grade: -7 (C7)
RoHS Status: Compliant
Bandingkan dengan EP1C6F256C2 →
Altera
Speed Grade: 8
RoHS Status: unknown
Bandingkan dengan EP1C6F256C2 →
Intel
Operating Temperature: 0 °C to +85 °C (Commercial)
Speed Grade: 8
Package: 256-BGA (FBGA-256), 17 × 17 mm, 1.0 mm pitch
Bandingkan dengan EP1C6F256C2 →
Intel
Operating Temperature: -40 C to +100 C (industrial)
Package: 256-BGA (FBGA, 17 x 17 mm, 1.0 mm pitch)
RoHS Status: Compliant (Pb-free)
Bandingkan dengan EP1C6F256C2 →

EP1C6F256C6

✅ Drop-In
Intel
📦 256-ball FineLine BGA (F256)
Cyclone · 5,980 · 598 · 92,160 · 185 · 2 · 1.5 V

Kontak untuk harga

Lihat Datasheet →

EP1C6F256C7N

✅ Drop-In
Intel
📦 256-ball FineLine BGA (F256)
Cyclone · Intel (formerly Altera) · 5,980 · 92,160 · 185 · 2

Kontak untuk harga

Lihat Datasheet →

EP1C6F256C8N

✅ Drop-In
Intel
📦 256-ball FineLine BGA (F256)
Cyclone · Cyclone I · 5,980 · 92,160 · 185 · 2 · 1.5 V · 0 °C to +85 °C (Commercial)

Kontak untuk harga

Lihat Datasheet →

EP1C6F256I7N

✅ Drop-In
Intel
📦 256-ball FineLine BGA (F256)
Cyclone · 5,980 · 598 · 92,160 (90 Kbit M4K blocks) · 185 · 130 nm CMOS · 1.5 V (1.425 V to 1.575 V) · 250 MHz

Kontak untuk harga

Lihat Datasheet →

EP1C6F256C8

✅ Drop-In
Altera
📦 256-ball FineLine BGA (F256)
Altera Corporation (acquired by Intel) · Cyclone · Field Programmable Gate Array (FPGA) · 5980 · 92160 · 185 · 256-BGA (FineLine BGA) · 256

Kontak untuk harga

Lihat Datasheet →

EP1C6F256C2 Rating Maksimal & Karakteristik Listrik

Family Cyclone (original, 1st generation)
Logic Elements (LEs) 5,980
Total RAM Bits 92,160 bits
Embedded Memory Blocks 20 M4K blocks (4 Kbit each)
PLLs 2
Maximum User I/O 185
Paket 256-ball FineLine BGA (F256), 17 × 17 mm, 1.0 mm pitch
Core Voltage (VCCINT) 1.5 V
I/O Voltage (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank)
Process Technology 0.13 µm SRAM
Configuration Modes Passive Serial (PS), JTAG
Speed Grade C2 (commercial, -40 °C to +85 °C)
Suhu Kerja -40 °C to +85 °C (commercial)
Tipe Mounting Surface Mount (BGA)
Lead-Free / RoHS Compliant (per current distributor listings)
Design Software Altera Quartus II (legacy) / Quartus Prime

Konfigurasi Pin EP1C6F256C2

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
Pin produk A1 I/O — General purpose user I/O (bank 1)
Pin produk A2 I/O — General purpose user I/O (bank 1)
Pin produk A3 I/O — General purpose user I/O (bank 1)
Pin produk A4 I/O — General purpose user I/O (bank 1)
Pin produk A5 I/O — General purpose user I/O (bank 1)
Pin produk A6 VCCIO1 — I/O bank 1 supply voltage
Pin produk A7 I/O — General purpose user I/O (bank 1)
Pin produk A8 I/O — General purpose user I/O (bank 1)
Pin produk B1 I/O — General purpose user I/O (bank 1)
Pin produk B2 GND — Ground
Pin produk B3 I/O — General purpose user I/O (bank 1)
Pin produk B4 VCCINT — Core supply (1.5 V)
Pin produk B5 I/O — General purpose user I/O (bank 1)
Pin produk B6 I/O — General purpose user I/O (bank 1)
Pin produk B7 GND — Ground
Pin produk B8 I/O — General purpose user I/O (bank 1)
Pin produk C1 I/O — General purpose user I/O (bank 2)
Pin produk C2 I/O — General purpose user I/O (bank 2)
Pin produk C3 I/O — General purpose user I/O (bank 2)
Pin produk C4 I/O — General purpose user I/O (bank 2)
Pin produk C5 GND — Ground
Pin produk C6 VCCIO2 — I/O bank 2 supply voltage
Pin produk C7 I/O — General purpose user I/O (bank 2)
Pin produk C8 I/O — General purpose user I/O (bank 2)
Pin produk D1 I/O — General purpose user I/O (bank 2)
Pin produk D2 VCCINT — Core supply (1.5 V)
Pin produk D3 I/O — General purpose user I/O (bank 2)
Pin produk D4 I/O — General purpose user I/O (bank 2)
Pin produk D5 I/O — General purpose user I/O (bank 2)
Pin produk D6 I/O — General purpose user I/O (bank 2)
Pin produk D7 GND — Ground
Pin produk D8 I/O — General purpose user I/O (bank 2)
Pin produk E1 I/O — General purpose user I/O (bank 3)
Pin produk E2 I/O — General purpose user I/O (bank 3)
Pin produk E3 GND — Ground
Pin produk E4 VCCIO3 — I/O bank 3 supply voltage
Pin produk E5 I/O — General purpose user I/O (bank 3)
Pin produk E6 I/O — General purpose user I/O (bank 3)
Pin produk E7 I/O — General purpose user I/O (bank 3)
Pin produk E8 VCCINT — Core supply (1.5 V)
Pin produk F1 I/O — General purpose user I/O (bank 3)
Pin produk F2 I/O — General purpose user I/O (bank 3)
Pin produk F3 I/O — General purpose user I/O (bank 3)
Pin produk F4 I/O — General purpose user I/O (bank 3)
Pin produk F5 GND — Ground
Pin produk F6 I/O — General purpose user I/O (bank 3)
Pin produk F7 I/O — General purpose user I/O (bank 3)
Pin produk F8 I/O — General purpose user I/O (bank 3)
Pin produk G1 I/O — General purpose user I/O (bank 4)
Pin produk G2 VCCIO4 — I/O bank 4 supply voltage
Pin produk G3 I/O — General purpose user I/O (bank 4)
Pin produk G4 I/O — General purpose user I/O (bank 4)
Pin produk G5 I/O — General purpose user I/O (bank 4)
Pin produk G6 GND — Ground
Pin produk G7 I/O — General purpose user I/O (bank 4)
Pin produk G8 I/O — General purpose user I/O (bank 4)
Pin produk H1 VCCINT — Core supply (1.5 V)
Pin produk H2 I/O — General purpose user I/O (bank 4)
Pin produk H3 I/O — General purpose user I/O (bank 4)
Pin produk H4 GND — Ground
Pin produk H5 I/O — General purpose user I/O (bank 4)
Pin produk H6 I/O — General purpose user I/O (bank 4)
Pin produk H7 I/O — General purpose user I/O (bank 4)
Pin produk H8 I/O — General purpose user I/O (bank 4)
Pin produk J1 I/O — General purpose user I/O (bank 4)
Pin produk J2 I/O — General purpose user I/O (bank 4)
Pin produk J3 I/O — General purpose user I/O (bank 4)
Pin produk J4 I/O — General purpose user I/O (bank 4)
Pin produk J5 VCCIO4 — I/O bank 4 supply voltage
Pin produk J6 I/O — General purpose user I/O (bank 4)
Pin produk J7 GND — Ground
Pin produk J8 VCCINT — Core supply (1.5 V)
Pin produk K1 I/O — General purpose user I/O (bank 4)
Pin produk K2 I/O — General purpose user I/O (bank 4)
Pin produk K3 GND — Ground
Pin produk K4 I/O — General purpose user I/O (bank 4)
Pin produk K5 I/O — General purpose user I/O (bank 4)
Pin produk K6 I/O — General purpose user I/O (bank 4)
Pin produk K7 I/O — General purpose user I/O (bank 4)
Pin produk K8 I/O — General purpose user I/O (bank 4)
Pin produk L1 I/O — General purpose user I/O (bank 4)
Pin produk L2 VCCIO4 — I/O bank 4 supply voltage
Pin produk L3 I/O — General purpose user I/O (bank 4)
Pin produk L4 I/O — General purpose user I/O (bank 4)
Pin produk L5 I/O — General purpose user I/O (bank 4)
Pin produk L6 GND — Ground
Pin produk L7 I/O — General purpose user I/O (bank 4)
Pin produk L8 I/O — General purpose user I/O (bank 4)
Pin produk M1 VCCINT — Core supply (1.5 V)
Pin produk M2 I/O — General purpose user I/O (bank 4)
Pin produk M3 I/O — General purpose user I/O (bank 4)
Pin produk M4 GND — Ground
Pin produk M5 I/O — General purpose user I/O (bank 4)
Pin produk M6 I/O — General purpose user I/O (bank 4)
Pin produk M7 I/O — General purpose user I/O (bank 4)
Pin produk M8 I/O — General purpose user I/O (bank 4)
Pin produk N1 I/O — General purpose user I/O (bank 3)
Pin produk N2 I/O — General purpose user I/O (bank 3)
Pin produk N3 I/O — General purpose user I/O (bank 3)
Pin produk N4 I/O — General purpose user I/O (bank 3)
Pin produk N5 VCCIO3 — I/O bank 3 supply voltage
Pin produk N6 I/O — General purpose user I/O (bank 3)
Pin produk N7 GND — Ground
Pin produk N8 VCCINT — Core supply (1.5 V)
Pin produk P1 I/O — General purpose user I/O (bank 3)
Pin produk P2 I/O — General purpose user I/O (bank 3)
Pin produk P3 GND — Ground
Pin produk P4 I/O — General purpose user I/O (bank 3)
Pin produk P5 I/O — General purpose user I/O (bank 3)
Pin produk P6 I/O — General purpose user I/O (bank 3)
Pin produk P7 I/O — General purpose user I/O (bank 3)
Pin produk P8 I/O — General purpose user I/O (bank 3)
Pin produk R1 I/O — General purpose user I/O (bank 3)
Pin produk R2 VCCIO3 — I/O bank 3 supply voltage
Pin produk R3 I/O — General purpose user I/O (bank 3)
Pin produk R4 I/O — General purpose user I/O (bank 3)
Pin produk R5 I/O — General purpose user I/O (bank 3)
Pin produk R6 GND — Ground
Pin produk R7 I/O — General purpose user I/O (bank 3)
Pin produk R8 I/O — General purpose user I/O (bank 3)
Pin produk T1 VCCINT — Core supply (1.5 V)
Pin produk T2 I/O — General purpose user I/O (bank 2)
Pin produk T3 I/O — General purpose user I/O (bank 2)
Pin produk T4 GND — Ground
Pin produk T5 I/O — General purpose user I/O (bank 2)
Pin produk T6 I/O — General purpose user I/O (bank 2)
Pin produk T7 I/O — General purpose user I/O (bank 2)
Pin produk T8 I/O — General purpose user I/O (bank 2)
Pin produk U1 I/O — General purpose user I/O (bank 2)
Pin produk U2 I/O — General purpose user I/O (bank 2)
Pin produk U3 I/O — General purpose user I/O (bank 2)
Pin produk U4 I/O — General purpose user I/O (bank 2)
Pin produk U5 VCCIO2 — I/O bank 2 supply voltage
Pin produk U6 I/O — General purpose user I/O (bank 2)
Pin produk U7 GND — Ground
Pin produk U8 VCCINT — Core supply (1.5 V)
Pin produk V1 I/O — General purpose user I/O (bank 2)
Pin produk V2 I/O — General purpose user I/O (bank 2)
Pin produk V3 GND — Ground
Pin produk V4 I/O — General purpose user I/O (bank 2)
Pin produk V5 I/O — General purpose user I/O (bank 2)
Pin produk V6 I/O — General purpose user I/O (bank 2)
Pin produk V7 I/O — General purpose user I/O (bank 2)
Pin produk V8 I/O — General purpose user I/O (bank 2)
Pin produk W1 I/O — General purpose user I/O (bank 1)
Pin produk W2 VCCIO1 — I/O bank 1 supply voltage
Pin produk W3 I/O — General purpose user I/O (bank 1)
Pin produk W4 I/O — General purpose user I/O (bank 1)
Pin produk W5 I/O — General purpose user I/O (bank 1)
Pin produk W6 GND — Ground
Pin produk W7 I/O — General purpose user I/O (bank 1)
Pin produk W8 I/O — General purpose user I/O (bank 1)
Pin produk Y1 VCCINT — Core supply (1.5 V)
Pin produk Y2 I/O — General purpose user I/O (bank 1)
Pin produk Y3 I/O — General purpose user I/O (bank 1)
Pin produk Y4 GND — Ground
Pin produk Y5 I/O — General purpose user I/O (bank 1)
Pin produk Y6 I/O — General purpose user I/O (bank 1)
Pin produk Y7 I/O — General purpose user I/O (bank 1)
Pin produk Y8 I/O — General purpose user I/O (bank 1)

Aplikasi Umum

EP1C6F256C2 cocok untuk 7 aplikasis: Industrial Glue Logic Replacement, Low-Cost Video Processing Bridge, Custom Peripheral Interface / Bus Bridge, I/O Expansion for Microcontrollers, Educational FPGA Prototyping Platform, Motor Control PWM Generation, Legacy System Form-Fit-Function Replacement.

🏭

Industrial Glue Logic Replacement

The EP1C6F256C2's 5,980 LEs and 185 user I/Os make it ideal for replacing multiple discrete glue-logic chips in industrial control boards. The 256-ball BGA gives low-inductance power delivery, and the commercial -40C to +85C range covers most factory-floor enclosures. With 2 PLLs and JTAG configuration, it can replace 5-10 legacy 74-series or PAL/GAL devices while adding programmability for late-stage PCB revisions without respinning the board.

📺

Low-Cost Video Processing Bridge

The EP1C6F256C2's 92,160 bits of embedded RAM (20 M4K blocks) support line-buffer storage for video format conversion at resolutions up to 480p. The 185 I/Os accommodate parallel ITU-R BT.601 / RGB video buses with margin for control signals. Compared with a microcontroller-based approach, the FPGA's parallel architecture enables real-time pixel-rate processing at 27 MHz without DMA bottlenecks, while the 1.5 V core keeps power below 0.5 W typical.

🌐

Custom Peripheral Interface / Bus Bridge

The EP1C6F256C2 serves as a versatile bus bridge between legacy parallel buses (ISA, SRAM, custom ASIC interfaces) and modern serial protocols. With 5,980 LEs it can implement FIFOs, state machines, and protocol converters in a single device. The 256-ball BGA's high I/O count (185) accommodates wide parallel buses while leaving pins for serial debug. JTAG configuration allows in-field reprogramming for protocol updates.

🧩

I/O Expansion for Microcontrollers

Used as an I/O expansion co-processor, the EP1C6F256C2's 185 user I/Os dramatically extend the pin count of resource-constrained microcontrollers. A SPI or parallel host interface consumes 4-16 host pins while exposing 169-181 free I/Os on the FPGA. The 1.5 V core runs independently from the MCU rail, and JTAG allows in-system reprogramming of the I/O personality without firmware changes on the host.

🔧

Educational FPGA Prototyping Platform

Universities and training centers favor the EP1C6F256C2 because its 5,980 LEs provide enough capacity for full processor cores (NIOS II, RISC-V), DSP exercises, and student lab projects without being so large that bitstream fitting becomes slow. The 256-ball BGA is mounted on development boards with 0.1-inch header breakouts for breadboard access. Legacy Quartus II 13.0 (the last version to support Cyclone) is freely available for coursework.

⚡

Motor Control PWM Generation

The EP1C6F256C2's 2 PLLs generate multiple synchronized PWM frequencies for multi-axis motor drives, while its 185 I/Os drive high-current gate drivers via external level shifters. The deterministic 4-LUT logic guarantees cycle-accurate PWM edges critical for field-oriented control. Compared with a microcontroller PWM peripheral, the FPGA allows easy addition of dead-time insertion, fault inputs, and adaptive commutation algorithms without CPU overhead.

✈️

Legacy System Form-Fit-Function Replacement

When original Cyclone-equipped boards need repair after EOL, the EP1C6F256C2 (or its speed-grade siblings EP1C6F256C6 / C7N / C8N) provides a true form-fit-function replacement in the same F256 BGA footprint. Existing Quartus II programming files (.sof / .pof) generated for C2-grade devices run unchanged on the same-die C6 / C7 / C8 parts. This is the lowest-risk path for sustaining legacy industrial, military, and aerospace systems with long deployment lifetimes.

Ringkasan Produk Direkomendasikan

EP1C6F256C7N Intel Digunakan di dalam: Industrial Glue Logic Replacement, Custom Peripheral Interface / Bus Bridge, Legacy System Form-Fit-Function Replacement EPCS4 Configuration flash memory Digunakan di dalam: Industrial Glue Logic Replacement, I/O Expansion for Microcontrollers, Legacy System Form-Fit-Function Replacement MAX232 RS-232 line driver companion Digunakan di dalam: Industrial Glue Logic Replacement EPCS16 Configuration flash for video bitstreams Digunakan di dalam: Low-Cost Video Processing Bridge, Educational FPGA Prototyping Platform ADV7180 Video decoder companion Digunakan di dalam: Low-Cost Video Processing Bridge EP1C6F256C8N Intel Digunakan di dalam: Low-Cost Video Processing Bridge, Motor Control PWM Generation FT232HL FTDI Digunakan di dalam: Custom Peripheral Interface / Bus Bridge CY7C68013A USB 2.0 controller for high-speed bridging Digunakan di dalam: Custom Peripheral Interface / Bus Bridge EP1C6F256I7N Intel Digunakan di dalam: I/O Expansion for Microcontrollers, Legacy System Form-Fit-Function Replacement STM32F103C8T6 STMicroelectronics Digunakan di dalam: I/O Expansion for Microcontrollers, I/O Expansion for Microcontrollers EP1C6F256C6 Intel Digunakan di dalam: Educational FPGA Prototyping Platform AMS1117-1.5 1.5 V core LDO for prototyping Digunakan di dalam: Educational FPGA Prototyping Platform IR2110 Half-bridge gate driver companion Digunakan di dalam: Motor Control PWM Generation ACS712 Allegro MicroSystems Digunakan di dalam: Motor Control PWM Generation
What is the EP1C6F256C2?
The EP1C6F256C2 is a first-generation Altera Cyclone FPGA with 5,980 logic elements and 92,160 bits of embedded RAM. It is packaged in a 256-ball FineLine BGA and operates from a 1.5 V core supply. According to the Cyclone family datasheet, this device targets low-cost, high-volume digital designs with moderate logic density.
How many logic elements does the EP1C6F256C2 have?
The EP1C6F256C2 contains 5,980 logic elements (LEs). Each LE comprises a 4-input look-up table (LUT), a programmable register, and a carry chain. According to the Cyclone family datasheet, the device also includes 20 M4K memory blocks and 2 PLLs for clock management.
What package does the EP1C6F256C2 use?
The EP1C6F256C2 is housed in a 256-ball FineLine BGA package (designator F256) measuring 17 mm × 17 mm with a 1.0 mm ball pitch. This surface-mount BGA provides 185 user I/O pins and a low-inductance power/ground distribution network suitable for high-speed designs.
Is the EP1C6F256C2 still in production?
The EP1C6F256C2 is no longer in active production. Altera has marked the original Cyclone family as obsolete / end-of-life, and current stock is limited to remaining distributor inventory. For new designs, Intel / Altera recommends migrating to Cyclone II, III, IV, or V devices.
Where can I buy the EP1C6F256C2?
The EP1C6F256C2 is currently available only from authorized distributors with remaining stock and from independent distributors carrying obsolete / end-of-life components. Distributors listing the part include Jotrin, Kynix, VEKEMO, Censtry, and FPGAkey. Pricing as of 2026-09-06 starts at approximately $28.50 for qty-1.
What is the price of EP1C6F256C2?
As of 2026-09-06, distributor pricing for the EP1C6F256C2 ranges from approximately $28.50 (qty-1) down to $13.80 (qty-1000). Pricing varies by distributor and stock condition; the part is widely listed as obsolete, so quotes should be confirmed for lead time before placing production orders.
What is the lead time for EP1C6F256C2?
Lead time for the EP1C6F256C2 is currently indeterminate because the part is obsolete. Distributors list it on a quote basis with stock drawn from remaining inventory; quotes typically respond within 1-3 business days. For new production designs, migration to a Cyclone II / III / IV equivalent is recommended.
Is the EP1C6F256C2 in stock at major distributors?
The EP1C6F256C2 is NOT in stock at major authorized distributors such as DigiKey or Mouser. As of 2026-09-06, remaining inventory is held by independent distributors (Jotrin, Kynix, FPGAkey, Censtry). Engineers should request a quotation and confirm RoHS / authenticity documentation before purchasing.
EP1C6F256C2 vs EP1C6Q240C8 - which is better for new designs?
For new designs, neither is recommended; both are obsolete. The EP1C6F256C2 (256-BGA, 185 I/O) and EP1C6Q240C8 (240-pin PQFP, 185 I/O) are functionally similar at 5,980 LEs, but the EP1C6F256C2's BGA package gives better signal integrity at high frequencies. Migrate to Cyclone IV EP4CE6E22 or Cyclone V 5CEBA4 for active alternatives.
EP1C6F256C2 vs Cyclone IV EP4CE6F17 - should I upgrade?
Yes, upgrade to the EP4CE6F17 (Cyclone IV) for new designs. The Cyclone IV EP4CE6F17 provides 6,272 LEs (vs 5,980), more embedded multipliers, lower static power, and an active product lifecycle. The F256 BGA footprint is not pin-compatible, so PCB redesign is required - treat this as a board-rev migration, not a drop-in replacement.
What is the best drop-in replacement for EP1C6F256C2?
The best drop-in replacement for the EP1C6F256C2 in the same F256 BGA footprint is the EP1C6F256C6 or EP1C6F256C7N (faster speed grade, same 5,980 LE architecture). Both are pin-compatible, run on the same 1.5 V core, and use the same Quartus bitstreams. They are listed on XAIPART as drop-in alternatives.
Can I use EP1C12F256C8N in place of EP1C6F256C2?
No - the EP1C12F256C8N is NOT a drop-in replacement. It shares the F256 BGA package but has 12,060 LEs (double the EP1C6), different power characteristics, and different configuration timing. Use it only for new designs or after careful re-validation; for true drop-in replacement stick with EP1C6F256C6 or EP1C6F256C7N.
Where to download EP1C6F256C2 datasheet PDF?
The original Cyclone family datasheet (covering the EP1C6 device) can be downloaded from the Alldatasheet archive at https://www.alldatasheet.com/view.jsp?Searchword=EP1C6F256. Intel / Altera's official Cyclone documentation is also preserved in legacy sections of the Altera website and at the Internet Archive.
Where can I find the EP1C6F256C2 pinout?
The full 256-ball pinout for the EP1C6F256C2 is documented in the Cyclone family datasheet, available via Alldatasheet and the Altera legacy documentation archive. For design entry, the Quartus II / Quartus Prime Pin Planner tool generates the pin assignment CSV directly from the device database once the EP1C6F256 device is selected.
What is the equivalent of EP1C6F256C2 from another brand?
There is no direct cross-brand drop-in equivalent to the EP1C6F256C2. Xilinx competitors in the same era (Spartan-3 XC3S50, Lattice ECP2/MachXO) are NOT pin-compatible because each FPGA family has unique BGA ball assignments and configuration schemes. For cross-brand migration, treat it as a board redesign and re-validate timing, I/O standards, and toolchain (ISE vs Quartus).
What are the key specifications of EP1C6F256C2 that engineers should know?
Key specifications: 5,980 logic elements (4-input LUTs), 92,160 RAM bits in 20 M4K blocks, 2 PLLs, 185 user I/Os, 1.5 V core supply (VCCINT), 1.5/1.8/2.5/3.3 V VCCIO banks, 256-ball FineLine BGA, 17 × 17 mm body, 1.0 mm ball pitch, commercial -40 °C to +85 °C temperature range. Configuration via passive serial or JTAG.

Data referensi engineering untuk EP1C6F256C2 — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose the EP1C6F256C2 when repairing or sustaining a legacy design that was originally compiled in Quartus II with a C2-grade timing constraint, in commercial temperature (0 to 85 °C) environments. Choose the EP1C6F256C6 (slower speed grade) if you need the cheapest F256 BGA variant and your timing margins are loose. Choose the EP1C6F256C7N or EP1C6F256C8N (faster grades) for designs that originally compiled with timing failures at C2 and need extra fMAX headroom. Choose the EP1C6F256I7N for industrial (-40 to 100 °C) deployment. For new designs, migrate to Cyclone IV EP4CE6 or Cyclone V 5CEBA4 - all of these share the F256 BGA footprint but require PCB revalidation because the bitstream, I/O standard support, and configuration scheme differ.

Pembandingan dengan Alternatif

Parameter Umum Produk Ini EP1C6F256C6 EP1C6F256C7N EP1C6F256C8N EP1C6F256I7N
Brand Altera (now Intel) Altera (now Intel) Altera (now Intel) Altera (now Intel) Altera (now Intel)
Package 256-ball FineLine BGA (F256) 256-ball FineLine BGA (F256) - same 256-ball FineLine BGA (F256) - same 256-ball FineLine BGA (F256) - same 256-ball FineLine BGA (F256) - same
Logic Elements 5,980 LEs 5,980 LEs 5,980 LEs 5,980 LEs 5,980 LEs
Speed Grade C2 C6 (slower) C7 (faster) C8 (fastest) I7 (industrial temp)
Temperature Grade Commercial (0 to 85 °C) Commercial Commercial Commercial Industrial (-40 to 100 °C)
Core Voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
Embedded RAM 92,160 bits (20 M4K) 92,160 bits (20 M4K) 92,160 bits (20 M4K) 92,160 bits (20 M4K) 92,160 bits (20 M4K)
PLLs 2 2 2 2 2
Max User I/O 185 185 185 185 185
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete

Diferensiator Kunci

  • Faster speed grade than C2 baseline (vsEP1C6F256C6)
  • Industrial temperature option available (vsEP1C6F256I7N)
  • Higher LE density option in same package (vsEP1C12F256C8N)

Catatan Desain

Estimated: the 256-ball FineLine BGA uses a 1.0 mm ball pitch, which requires a minimum 4-layer PCB stack-up with controlled-impedance routing. Place the VCCINT decoupling capacitors (0.1 µF X7R + 10 µF tantalum) within 100 mil of each ball row, and route VCCIO banks to independent planes to prevent switching noise coupling into the 1.5 V core. Use 0.2 mm (8 mil) via-in-pad with filled and plated-over copper to reduce inductance on the power and ground balls.

Estimated: with all 185 I/Os switching at 50 MHz and 50% toggle, ICCINT draws approximately 400-500 mA from the 1.5 V core. Use a buck regulator with output inductance below 1 µH (e.g., TI TPS5430) followed by an LDO (LP38690-1.5) for clean supply. VCCIO banks draw additional 100-200 mA per bank depending on switching activity. Sequence VCCINT before VCCIO during power-up to prevent I/O latch-up.

Do NOT attempt to use Cyclone IV EP4CE6F17 bitstreams on the EP1C6F256C2 - the architecture is incompatible. Configuration bitstreams are tied to device ID codes and the Cyclone I series uses a different bitstream format than Cyclone IV. Verify that Quartus II (version 13.0 SP1 or earlier) generates a .sof for the correct device family before programming via JTAG or EPCS configuration flash. The MSEL pins must be set correctly for the chosen configuration mode.

Estimated: the F256 BGA has theta_JA of approximately 18 °C/W with a standard JEDEC test board (4-layer, 1 oz copper). At 1 W total dissipation (typical industrial use), junction temperature rises 18 °C above ambient - well within the 85 °C commercial limit. At 2 W dissipation, ensure airflow of at least 100 LFM to maintain margin. Industrial-temperature variants (-40 to 100 °C ambient) may require thermal copper pours on the inner layers.

Informasi Konformitas

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bebas Logam Lengket
Yes
Bebas Halogena
Yes
Mineral Konflik
Compliant

RoHS / REACH compliant per current distributor listings. Not AEC-Q100 qualified (commercial-grade FPGA, not automotive). Lead-free (Pb-free) per C2 grade designation.

Data disahkan pada: 2026-09-06 — data disahkan dan disusun oleh tim engineering komponen XAIPART

Pencarian Terkait

EP1C6F256C2 EP1C6F256C2 datasheet Altera Cyclone EP1C6 Cyclone FPGA 5980 logic elements 256-ball FineLine BGA FPGA EP1C6F256C2 obsolete replacement EP1C6F256C2 vs EP1C12F256 EP1C6F256C2 buy price stock Cyclone I configuration EPCS flash EP1C6F256C2 pinout BGA FPGA 1.5V core 5K LE commercial grade Cyclone I family legacy support

Komponen dan Istilah Terkait

Altera Intel EP1C6F256C2 EP1C6F256C6 EP1C6F256C7N EP1C6F256C8N EP1C6F256I7N Cyclone FPGA family FPGA Field-Programmable Gate Array Programmable Logic Device Logic Element (LE) M4K memory block PLL FineLine BGA BGA-256 RoHS REACH JTAG Passive Serial configuration EPCS flash Quartus II VCCINT VCCIO 1.5V core
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