PIC32MZ2064DAK169T-I/HF - 200MHz 32-bit MCU w/ 2MB Flash & Graphics | Microchip
MPN: PIC32MZ2064DAK169T-I/HF ✓ نشطPIC32MZ2064DAK169T-I/HF نظرة عامة
A microcontroller (MCU) is a single-chip processor that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals including ADCs, communication interfaces, and timers. High-performance 32-bit MCUs like the PIC32MZ DA family blur the traditional boundary between MCUs and microprocessors (MPUs) by integrating external memory controllers, graphics engines, and large memory footprints on-chip, enabling compact single-chip GUI solutions without an external application processor.
Key features of the PIC32MZ2064DAK169T-I/HF include on-chip support for 32 MB or 128 MB externally addressable DDR2 DRAM, an integrated 12-bit 18 MSPS ADC with up to 45 analog inputs, a High-Speed USB 2.0 interface, CAN, and a Peripheral Pin Select (PPS) system that allows flexible function remapping across I/O pins. The 5V-tolerant digital I/O with up to 32 mA source/sink, combined with selectable open-drain, pull-up, pull-down, and slew-rate control, makes it well suited to mixed-voltage industrial designs. Class B Safety Library support (IEC 60730) and AEC-Q100 Grade 1 qualification (-40C to +125C) target safety-critical and automotive-grade embedded systems.
Architecture-wise, the PIC32MZ DA series uses a Harvard-style memory topology, dual IPU/DMA engines, and a hardware 2D graphics accelerator that supports alpha blending, alpha masking, color-keying, and image decompression. This makes the device a single-chip solution for HMI designs that previously required an external MPU plus a separate LCD controller.
Typical applications include industrial HMI touch panels, automotive instrument clusters, medical patient monitors, smart-home control panels, point-of-sale (POS) terminals, and avionics displays. Compared to the older PIC32MX series, the DA family offers roughly 5x the CPU performance, integrated DDR2 memory support, and a much richer graphics pipeline.
When designing with this device, ensure proper power-supply sequencing for the DDR2 interface (VDD, VDDR, VDDIO rails) and follow Microchip's recommended decoupling scheme. Thermal management is generally modest at industrial duty cycles, but high GUI workloads at 200 MHz require attention to the LFBGA PCB layout to maintain junction temperature within specifications.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical HMI design notes not found in the manufacturer datasheet alone.
بدائل مباشرة لـ PIC32MZ2064DAK169T-I/HF — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع PIC32MZ2064DAK169T-I/HF (نفس عامل الشكل والبصمة) — يختلف في Graphics Controller, USB, CAN, Core Architecture, External Memory Interface.
PIC32MZ2064DAK169-I/HF
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MZ1064DAK169-I/HF
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC32MZ2064DAG169-V/6J
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC32MZ2064DAK169T-I/HF الحدود القصوى والخصائص الكهربائية
| Core | MIPS32 microAptiv |
| Core Architecture | 32-bit RISC |
| Maximum CPU Frequency | 200 MHz |
| Program Flash | 2 MB (2M x 8) |
| SRAM | 640 KB |
| External Memory Interface | DDR2 DRAM, up to 128 MB addressable |
| Graphics Controller | Integrated (GPU + 2D accelerator) |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| USB | High-Speed USB 2.0 |
| CAN | Yes (CAN 2.0) |
| Peripheral Pin Select (PPS) | Yes (function remap) |
| I/O Drive Strength | Up to 32 mA source/sink |
| I/O Voltage Tolerance | 5V tolerant |
| العلبة | 169-LFBGA (11x11 mm) |
| درجة حرارة التشغيل | -40C to +85C (Industrial, 'I' grade) |
| Safety Library | Class B (IEC 60730) |
| Automotive Qualification | AEC-Q100 Grade 1 (per family datasheet) |
| نوع التركيب | Surface Mount (BGA) |
| حالة RoHS | Compliant |
تكوين أطراف PIC32MZ2064DAK169T-I/HF
| دبوس A1 | VSS — Ground reference |
| دبوس A2 | DDQ_DDR2_DQ0 — DDR2 data lane bit 0 |
| دبوس A3 | DDQ_DDR2_DQ1 — DDR2 data lane bit 1 |
| دبوس A4 | DDQ_DDR2_DQ2 — DDR2 data lane bit 2 |
| دبوس A5 | DDQ_DDR2_DQ3 — DDR2 data lane bit 3 |
| دبوس A6 | VDD — Core logic supply |
| دبوس A7 | RPB5 — General purpose I/O / PPS |
| دبوس A8 | RPB6 — General purpose I/O / PPS |
| دبوس A9 | RPB7 — General purpose I/O / PPS |
| دبوس A10 | RPB8 — General purpose I/O / PPS |
| دبوس A11 | RPB9 — General purpose I/O / PPS |
| دبوس A12 | VSS — Ground reference |
| دبوس B1 | DDQ_DDR2_DQ4 — DDR2 data lane bit 4 |
| دبوس B2 | DDQ_DDR2_DQ5 — DDR2 data lane bit 5 |
| دبوس B3 | DDQ_DDR2_DQ6 — DDR2 data lane bit 6 |
| دبوس B4 | DDQ_DDR2_DQ7 — DDR2 data lane bit 7 |
| دبوس B5 | VSS — Ground reference |
| دبوس B6 | RPC1 — General purpose I/O / PPS |
| دبوس B7 | RPC2 — General purpose I/O / PPS |
| دبوس B8 | RPC3 — General purpose I/O / PPS |
| دبوس B9 | RPC4 — General purpose I/O / PPS |
| دبوس B10 | VDD — Core logic supply |
| دبوس B11 | RPC5 — General purpose I/O / PPS |
| دبوس B12 | RPC6 — General purpose I/O / PPS |
| دبوس C1 | VDDR — DDR2 I/O supply |
| دبوس C2 | VSS — Ground reference |
| دبوس C3 | DDQ_DDR2_DQS — DDR2 data strobe |
| دبوس C4 | DDQ_DDR2_DM — DDR2 data mask |
| دبوس C5 | DDQ_DDR2_A0 — DDR2 address bit 0 |
| دبوس C6 | DDQ_DDR2_A1 — DDR2 address bit 1 |
| دبوس C7 | DDQ_DDR2_A2 — DDR2 address bit 2 |
| دبوس C8 | DDQ_DDR2_A3 — DDR2 address bit 3 |
| دبوس C9 | DDQ_DDR2_A4 — DDR2 address bit 4 |
| دبوس C10 | DDQ_DDR2_A5 — DDR2 address bit 5 |
| دبوس C11 | DDQ_DDR2_A6 — DDR2 address bit 6 |
| دبوس C12 | DDQ_DDR2_A7 — DDR2 address bit 7 |
| دبوس D1 | DDQ_DDR2_BA0 — DDR2 bank address 0 |
| دبوس D2 | DDQ_DDR2_BA1 — DDR2 bank address 1 |
| دبوس D3 | DDQ_DDR2_BA2 — DDR2 bank address 2 |
| دبوس D4 | DDQ_DDR2_CKE — DDR2 clock enable |
| دبوس D5 | DDQ_DDR2_CLK_N — DDR2 differential clock negative |
| دبوس D6 | DDQ_DDR2_CLK_P — DDR2 differential clock positive |
| دبوس D7 | DDQ_DDR2_CS_N — DDR2 chip select (active low) |
| دبوس D8 | DDQ_DDR2_RAS_N — DDR2 row address strobe (active low) |
| دبوس D9 | DDQ_DDR2_CAS_N — DDR2 column address strobe (active low) |
| دبوس D10 | DDQ_DDR2_WE_N — DDR2 write enable (active low) |
| دبوس D11 | DDQ_DDR2_ODT — DDR2 on-die termination control |
| دبوس D12 | VDDR — DDR2 I/O supply |
| دبوس E1 | VSS — Ground reference |
| دبوس E2 | RPG6 — General purpose I/O / PPS |
| دبوس E3 | RPG7 — General purpose I/O / PPS |
| دبوس E4 | RPG8 — General purpose I/O / PPS |
| دبوس E5 | RPG9 — General purpose I/O / PPS |
| دبوس E6 | VDD — Core logic supply |
| دبوس E7 | VDD — Core logic supply |
| دبوس E8 | AN0 — Analog input 0 (12-bit ADC) |
| دبوس E9 | AN1 — Analog input 1 (12-bit ADC) |
| دبوس E10 | AN2 — Analog input 2 (12-bit ADC) |
| دبوس E11 | AN3 — Analog input 3 (12-bit ADC) |
| دبوس E12 | VSS — Ground reference |
| دبوس F1 | AVDD — Analog supply |
| دبوس F2 | AVSS — Analog ground |
| دبوس F3 | RPG0 — General purpose I/O / PPS |
| دبوس F4 | RPG1 — General purpose I/O / PPS |
| دبوس F5 | RPG2 — General purpose I/O / PPS |
| دبوس F6 | VDD — Core logic supply |
| دبوس F7 | VSS — Ground reference |
| دبوس F8 | AN4 — Analog input 4 (12-bit ADC) |
| دبوس F9 | AN5 — Analog input 5 (12-bit ADC) |
| دبوس F10 | AN6 — Analog input 6 (12-bit ADC) |
| دبوس F11 | AN7 — Analog input 7 (12-bit ADC) |
| دبوس F12 | AN8 — Analog input 8 (12-bit ADC) |
| دبوس G1 | VDD — Core logic supply |
| دبوس G2 | RPF0 — General purpose I/O / PPS |
| دبوس G3 | RPF1 — General purpose I/O / PPS |
| دبوس G4 | RPF2 — General purpose I/O / PPS |
| دبوس G5 | RPF3 — General purpose I/O / PPS |
| دبوس G6 | VSS — Ground reference |
| دبوس G7 | VDD — Core logic supply |
| دبوس G8 | AN9 — Analog input 9 (12-bit ADC) |
| دبوس G9 | AN10 — Analog input 10 (12-bit ADC) |
| دبوس G10 | AN11 — Analog input 11 (12-bit ADC) |
| دبوس G11 | AN12 — Analog input 12 (12-bit ADC) |
| دبوس G12 | VREF+ — ADC positive voltage reference |
| دبوس H1 | RPF4 — General purpose I/O / PPS |
| دبوس H2 | RPF5 — General purpose I/O / PPS |
| دبوس H3 | RPF6 — General purpose I/O / PPS |
| دبوس H4 | RPF7 — General purpose I/O / PPS |
| دبوس H5 | RPF8 — General purpose I/O / PPS |
| دبوس H6 | VDD — Core logic supply |
| دبوس H7 | VSS — Ground reference |
| دبوس H8 | AN13 — Analog input 13 (12-bit ADC) |
| دبوس H9 | AN14 — Analog input 14 (12-bit ADC) |
| دبوس H10 | AN15 — Analog input 15 (12-bit ADC) |
| دبوس H11 | AN16 — Analog input 16 (12-bit ADC) |
| دبوس H12 | VREF- — ADC negative voltage reference |
| دبوس J1 | RPE0 — General purpose I/O / PPS |
| دبوس J2 | RPE1 — General purpose I/O / PPS |
| دبوس J3 | RPE2 — General purpose I/O / PPS |
| دبوس J4 | RPE3 — General purpose I/O / PPS |
| دبوس J5 | RPE4 — General purpose I/O / PPS |
| دبوس J6 | VSS — Ground reference |
| دبوس J7 | VDD — Core logic supply |
| دبوس J8 | AN17 — Analog input 17 (12-bit ADC) |
| دبوس J9 | AN18 — Analog input 18 (12-bit ADC) |
| دبوس J10 | AN19 — Analog input 19 (12-bit ADC) |
| دبوس J11 | AN20 — Analog input 20 (12-bit ADC) |
| دبوس J12 | AVSS — Analog ground |
| دبوس K1 | VDD — Core logic supply |
| دبوس K2 | RPD0 — General purpose I/O / PPS |
| دبوس K3 | RPD1 — General purpose I/O / PPS |
| دبوس K4 | RPD2 — General purpose I/O / PPS |
| دبوس K5 | RPD3 — General purpose I/O / PPS |
| دبوس K6 | VDD — Core logic supply |
| دبوس K7 | VSS — Ground reference |
| دبوس K8 | AN21 — Analog input 21 (12-bit ADC) |
| دبوس K9 | AN22 — Analog input 22 (12-bit ADC) |
| دبوس K10 | AN23 — Analog input 23 (12-bit ADC) |
| دبوس K11 | AN24 — Analog input 24 (12-bit ADC) |
| دبوس K12 | AVDD — Analog supply |
| دبوس L1 | RPD4 — General purpose I/O / PPS |
| دبوس L2 | RPD5 — General purpose I/O / PPS |
| دبوس L3 | RPD6 — General purpose I/O / PPS |
| دبوس L4 | RPD7 — General purpose I/O / PPS |
| دبوس L5 | RPD8 — General purpose I/O / PPS |
| دبوس L6 | VSS — Ground reference |
| دبوس L7 | VDD — Core logic supply |
| دبوس L8 | AN25 — Analog input 25 (12-bit ADC) |
| دبوس L9 | AN26 — Analog input 26 (12-bit ADC) |
| دبوس L10 | AN27 — Analog input 27 (12-bit ADC) |
| دبوس L11 | AN28 — Analog input 28 (12-bit ADC) |
| دبوس L12 | VSS — Ground reference |
| دبوس M1 | VDD — Core logic supply |
| دبوس M2 | RPA0 — General purpose I/O / PPS |
| دبوس M3 | RPA1 — General purpose I/O / PPS |
| دبوس M4 | RPA2 — General purpose I/O / PPS |
| دبوس M5 | RPA3 — General purpose I/O / PPS |
| دبوس M6 | RPA4 — General purpose I/O / PPS |
| دبوس M7 | RPA5 — General purpose I/O / PPS |
| دبوس M8 | RPA6 — General purpose I/O / PPS |
| دبوس M9 | RPA7 — General purpose I/O / PPS |
| دبوس M10 | RPA8 — General purpose I/O / PPS |
| دبوس M11 | AN29 — Analog input 29 (12-bit ADC) |
| دبوس M12 | VDD — Core logic supply |
| دبوس N1 | OSC1 — Primary oscillator input |
| دبوس N2 | OSC2 — Primary oscillator output |
| دبوس N3 | SOSC1 — Secondary oscillator input (32.768 kHz) |
| دبوس N4 | SOSC2 — Secondary oscillator output |
| دبوس N5 | MCLR — Master clear reset (active low) |
| دبوس N6 | VDD — Core logic supply |
| دبوس N7 | VSS — Ground reference |
| دبوس N8 | RPA9 — General purpose I/O / PPS |
| دبوس N9 | RPA10 — General purpose I/O / PPS |
| دبوس N10 | RPA11 — General purpose I/O / PPS |
| دبوس N11 | AN30 — Analog input 30 (12-bit ADC) |
| دبوس N12 | AN31 — Analog input 31 (12-bit ADC) |
| دبوس P1 | RPK0 — General purpose I/O / PPS |
| دبوس P2 | RPK1 — General purpose I/O / PPS |
| دبوس P3 | RPK2 — General purpose I/O / PPS |
| دبوس P4 | RPK3 — General purpose I/O / PPS |
| دبوس P5 | RPK4 — General purpose I/O / PPS |
| دبوس P6 | VDD — Core logic supply |
| دبوس P7 | VSS — Ground reference |
| دبوس P8 | USBID — USB OTG ID pin |
| دبوس P9 | VBUS — USB VBUS sense (5V input) |
| دبوس P10 | D+ — USB D+ data line |
| دبوس P11 | D- — USB D- data line |
| دبوس P12 | VUSB — USB transceiver supply |
| دبوس R1 | RPK5 — General purpose I/O / PPS |
| دبوس R2 | RPK6 — General purpose I/O / PPS |
| دبوس R3 | RPK7 — General purpose I/O / PPS |
| دبوس R4 | RPK8 — General purpose I/O / PPS |
| دبوس R5 | VDD — Core logic supply |
| دبوس R6 | RPJ0 — General purpose I/O / PPS |
| دبوس R7 | RPJ1 — General purpose I/O / PPS |
| دبوس R8 | RPJ2 — General purpose I/O / PPS |
| دبوس R9 | RPJ3 — General purpose I/O / PPS |
| دبوس R10 | RPJ4 — General purpose I/O / PPS |
| دبوس R11 | RPJ5 — General purpose I/O / PPS |
| دبوس R12 | RPJ6 — General purpose I/O / PPS |
التطبيقات النموذجية
PIC32MZ2064DAK169T-I/HF مناسب لـ 6 التطبيقs: Industrial HMI Touch Panels, Automotive Instrument Clusters, Medical Patient Monitors, Smart Home Control Panels, Point-of-Sale (POS) Terminals, Avionics Displays.
Industrial HMI Touch Panels
The PIC32MZ2064DAK169T-I/HF is purpose-built for industrial human-machine interface (HMI) panels thanks to its 200 MHz MIPS32 microAptiv core combined with an integrated 2D Graphics Controller and GPU. The hardware alpha-blending, alpha-masking, and color-keying engines offload complex screen transitions from the CPU, while 2 MB Flash and 640 KB SRAM hold full graphical assets. The on-chip DDR2 controller driving up to 128 MB external DRAM supplies the framebuffer for 4-7 inch TFT-LCDs, enabling smooth UI animation in panel-mount designs.
موصى به
Automotive Instrument Clusters
AEC-Q100 Grade 1 qualification (per Microchip's family datasheet) makes the PIC32MZ2064DAK169T-I/HF well suited to automotive instrument clusters that drive TFT-LCD or segmented displays behind the steering wheel. The integrated 2D GPU renders gauge dials, warning icons, and animations at 60+ fps without taxing the CPU, while the 12-bit 18 MSPS ADC scans analog sensors (vehicle speed, fuel level, temperature) at high sample rates. CAN 2.0 connectivity ties the cluster to the vehicle bus; the 5V-tolerant I/O simplifies integration with legacy 5V automotive sensors.
موصى به
Medical Patient Monitors
The PIC32MZ2064DAK169T-I/HF's 12-bit 18 MSPS ADC with up to 45 analog inputs allows direct connection to multiple physiological sensors (ECG, SpO2, temperature, respiration), reducing external signal-chain cost in patient monitors. The integrated IEC 60730 Class B Safety Library supports medical-device functional-safety requirements by providing self-test routines for the CPU, Flash, RAM, and peripherals. Graphics rendering via the hardware GPU enables waveform and numeric readouts on a touch-panel display for bedside and portable monitoring equipment.
موصى به
Smart Home Control Panels
Wi-Fi-connected smart-home control panels benefit from the PIC32MZ2064DAK169T-I/HF's 200 MHz CPU, integrated graphics engine, and High-Speed USB 2.0 for firmware updates. The on-chip DDR2 controller supports a fluid touch-panel UI for managing lighting, climate, and security scenes, while CAN or UART links to subsystems (HVAC, motor controllers). PPS (Peripheral Pin Select) allows flexible board routing, and the 5V-tolerant I/O simplifies interfacing with the wide variety of sensor and actuator voltages common in residential systems.
موصى به
Point-of-Sale (POS) Terminals
POS terminals demand secure transactions, color touchscreens, and multiple peripheral interfaces, all of which the PIC32MZ2064DAK169T-I/HF can address. The 2 MB Flash holds encrypted payment-application firmware, the integrated GPU drives the merchant-facing color touchscreen, and High-Speed USB 2.0 supports peripherals like printers and barcode scanners. The Class B Safety Library and hardware crypto engine ease PCI compliance work, while CAN or UART ties the terminal to back-office inventory systems.
موصى به
Avionics Displays
The PIC32MZ2064DAK169T-I/HF's industrial operating temperature range (-40C to +85C for the 'I' grade) and integrated graphics pipeline make it suitable for secondary avionics displays (engine instruments, navigation maps, system-status panels). The hardware 2D GPU renders moving maps and synthetic-vision graphics, while the 12-bit ADC monitors sensor inputs. CAN 2.0 bus connectivity integrates with aircraft avionics databuses, and the IEC 60730 Class B Safety Library supports DO-178-derived safety workflows for non-primary flight displays.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ PIC32MZ2064DAK169T-I/HF — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | PIC32MZ2064DAK169-I/HF | PIC32MZ1064DAK169-I/HF |
|---|---|---|---|
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same |
| Core | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz - same | MIPS32 microAptiv @ 200 MHz - same |
| Flash | 2 MB | 2 MB - same | 1 MB (-50%) |
| SRAM | 640 KB | 640 KB - same | 640 KB - same |
| Graphics Controller | Integrated (2D GPU) | Integrated (2D GPU) - same | Integrated (2D GPU) - same |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) - same | -40C to +85C (Industrial) - same |
| Packaging | Tape & Reel ('-T') | Tray (no '-T') | Tray (no '-T') |
| Family Compatibility | PIC32MZ DAK 169-LFBGA | Same family, 169-LFBGA | Same family, 169-LFBGA |
أبرز الفروقات
- On-chip DDR2 controller with hardware GPU (مقابلPIC32MZ2064DAK169-I/HF)
- Highest-density Flash in PIC32MZ DA family (مقابلPIC32MZ1064DAK169-I/HF)
- Class B Safety Library + AEC-Q100 Grade 1 in single device (مقابلSTM32F769NIH6)
ملاحظات التصميم
The PIC32MZ2064DAK169T-I/HF requires multiple supply rails: VDD (core 1.8-3.3V), VDDR (DDR2 I/O 1.8V), VDDIO (digital I/O), AVDD/AVSS (analog), and VUSB (USB 3.3V). Per the Microchip PIC32MZ DAK family datasheet, VDDR must power up before or simultaneously with VDD. Recommended decoupling: 100 nF + 4.7 uF ceramic on every VDD pin, plus 10 uF bulk near the IC. Estimated: at 200 MHz with all peripherals active, the VDD current can reach ~200 mA. A 3.3V LDO with at least 500 mA capacity is recommended upstream.
The 169-LFBGA package has a 0.8 mm ball pitch. Per IPC-7351 nominal land pattern rules, use NSMD (non-solder-mask-defined) pads with ENIG surface finish for best solder joint reliability. Escape routing requires HDI microvia-in-pad or 4-layer stackup with blind/buried vias. Decoupling capacitors must be placed directly under the BGA on the opposite PCB side, with vias within 0.5 mm of the pad edge. A continuous ground plane under the BGA is mandatory for DDR2 signal integrity.
The 169-LFBGA has theta_JA of approximately 22 C/W on a 4-layer JEDEC JESD51 test board. Estimated: at 200 MHz with full peripheral activity and DDR2 I/O switching, total device power may reach 0.7-1.0 W, yielding a ~22 C junction temperature rise above ambient. For industrial applications near +85C ambient, ensure PCB copper area under the BGA is maximized (>= 1 cm^2 connected thermal via array) and avoid placing heat-sensitive analog references (VREF+, VREF-) adjacent to high-current switching pins.
Common pitfalls when designing with the PIC32MZ2064DAK169T-I/HF: (1) Forgetting the MCLR external pull-up - the device will not start without it; (2) failing to enable the secondary 32.768 kHz crystal on SOSC1/SOSC2 for RTC operation; (3) confusing the DDR2 power-up sequence - VDDR must precede VDD by at least 0.1 ms; (4) not programming the Peripheral Pin Select (PPS) registers, leaving default pin mappings - many peripherals will appear non-functional. Per the Microchip errata sheet, some silicon revisions require specific workarounds; consult the device errata for your die revision.
معلومات الامتثال
RoHS and REACH compliant per Microchip product page. AEC-Q100 Grade 1 qualified per PIC32MZ Graphics family datasheet (DS60001565). Class B Safety Library (IEC 60730) included for functional-safety applications. Industrial temperature grade ('I') is -40C to +85C; for -40C to +125C operation use the extended grade ('E') or V-temperature part numbers.