W634GU6RB11I - 4Gb DDR3L SDRAM x16 933MHz | Winbond
MPN: W634GU6RB11I ✓ نشطW634GU6RB11I نظرة عامة
DDR3L SDRAM (Double Data Rate 3 Low Voltage) is a type of synchronous dynamic random-access memory that transfers data on both edges of the clock signal, effectively doubling the data rate. It operates at a lower voltage (1.35V) than standard DDR3 (1.5V), offering improved energy efficiency. DDR3L is part of the DDR SDRAM family, which includes DDR, DDR2, DDR3, and DDR4, and is widely used in computing, networking, and embedded systems where high bandwidth and low power are critical.
Key features of the W634GU6RB11I include a parallel interface with a 16-bit data bus, support for industrial temperature range (-40°C to +95°C), and compatibility with JEDEC DDR3L standards. The device offers burst lengths of 8 and 4, on-die termination (ODT), and programmable CAS latency. Its low-voltage operation and high density make it suitable for applications requiring large memory capacity with minimal power draw.
The W634GU6RB11I utilizes advanced DRAM process technology, achieving high-speed data transfer while maintaining low power consumption. The 96-ball VFBGA package provides excellent thermal and electrical performance, with a compact footprint suitable for space-constrained designs. The device supports auto-refresh and self-refresh modes, ensuring data integrity with minimal power consumption during idle periods.
Typical applications include networking equipment (routers, switches), industrial automation, embedded computing, and consumer electronics such as set-top boxes and smart TVs. Its industrial temperature rating makes it suitable for harsh environments, while the low-voltage operation extends battery life in portable devices.
When designing with this component, ensure proper decoupling capacitors are placed near the power pins to minimize noise. The VFBGA package requires careful PCB layout to route the fine-pitch balls, and the DDR3L interface should be terminated according to JEDEC guidelines to maintain signal integrity.
بدائل مباشرة لـ W634GU6RB11I — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع W634GU6RB11I (نفس عامل الشكل والبصمة) — يختلف في Package, Supply Voltage, Operating Temperature, CAS Latency, Data Rate.
W634GU6RB-11
✅ بديل مباشر✗ غير متوفر
$13.5227 / وحدة
عرض ورقة البيانات ←W634GU6NB-11
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
MT41K256M16HA-125
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها✗ غير متوفر
$6.3636 / وحدة
عرض ورقة البيانات ←IS43TR16512B-125K
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
K4B4G1646E-BYMA
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها✗ غير متوفر
$14.3182 / وحدة
عرض ورقة البيانات ←W634GU6RB11I الحدود القصوى والخصائص الكهربائية
| نوع الذاكرة | DDR3L SDRAM |
| حجم الذاكرة | 4Gbit (256M x 16) |
| الواجهة | Parallel |
| Clock Frequency | 933 MHz |
| Access Time | 20 ns |
| جهد التغذية | 1.35V |
| العلبة | 96-VFBGA (7.5x13) |
| درجة حرارة التشغيل | -40°C to +95°C (Industrial) |
| عرض ناقل البيانات | 16 bit |
| نوع التركيب | Surface Mount |
| حالة RoHS | Compliant |
| خالٍ من الهالوجين | Yes |
| التنظيم | 256M x 16 |
| زمن الوصول CAS | 11 (at 933 MHz) |
| Refresh | Auto and Self Refresh |
تكوين أطراف W634GU6RB11I
| دبوس A1 | VDD — Power supply (1.35V) |
| دبوس A2 | DQ0 — Data input/output 0 |
| دبوس A3 | DQ1 — Data input/output 1 |
| دبوس B1 | VSS — Ground |
| دبوس B2 | DQ2 — Data input/output 2 |
| دبوس B3 | DQ3 — Data input/output 3 |
| دبوس C1 | VDDQ — I/O power supply |
| دبوس C2 | DQ4 — Data input/output 4 |
| دبوس C3 | DQ5 — Data input/output 5 |
| دبوس D1 | VSSQ — I/O ground |
| دبوس D2 | DQ6 — Data input/output 6 |
| دبوس D3 | DQ7 — Data input/output 7 |
| دبوس E1 | CK — Clock input |
| دبوس E2 | CK# — Complementary clock input |
| دبوس E3 | CKE — Clock enable |
التطبيقات النموذجية
W634GU6RB11I مناسب لـ 6 التطبيقs: Networking Equipment, Industrial Automation, Embedded Computing, Consumer Electronics, Automotive Infotainment, Medical Devices.
Networking Equipment
The W634GU6RB11I's 4Gb density and 933MHz speed provide ample buffering for routers and switches. Its low 1.35V operation reduces power consumption in always-on network devices, while the industrial temperature range ensures reliability in telecom cabinets. The 16-bit interface simplifies PCB routing, and the VFBGA package fits compact line cards.
موصى به
Industrial Automation
In industrial controllers and PLCs, the W634GU6RB11I provides reliable, high-speed memory for data logging and real-time processing. Its industrial temperature rating (-40°C to +95°C) withstands harsh factory environments. The low-voltage operation minimizes heat generation, and the 4Gb capacity supports complex control algorithms. The parallel interface integrates easily with industrial SoCs.
موصى به
Embedded Computing
For embedded systems like single-board computers and IoT gateways, the W634GU6RB11I offers a balance of capacity, speed, and power efficiency. The 4Gb size supports operating systems and applications, while 933MHz ensures responsive performance. The 1.35V supply extends battery life in portable embedded devices. The VFBGA package is ideal for compact designs.
موصى به
Consumer Electronics
In smart TVs, set-top boxes, and gaming consoles, the W634GU6RB11I provides the memory bandwidth needed for HD video streaming and multitasking. Its low power consumption is crucial for energy-efficient consumer devices. The 16-bit interface reduces BOM cost, and the compact VFBGA package fits slim enclosures. The industrial temperature grade ensures durability in home environments.
موصى به
Automotive Infotainment
The W634GU6RB11I is suitable for automotive infotainment systems, providing high-speed memory for navigation, audio, and video processing. Its industrial temperature range covers automotive cabin environments, and the low-voltage operation reduces stress on vehicle power systems. The 4Gb capacity supports complex user interfaces, and the parallel interface connects to automotive SoCs.
موصى به
Medical Devices
In medical imaging and patient monitoring equipment, the W634GU6RB11I offers reliable, high-speed memory for data acquisition and processing. Its industrial temperature rating ensures operation in clinical environments, and the low power consumption is beneficial for battery-powered devices. The 4Gb capacity supports large data buffers, and the VFBGA package is suitable for compact medical devices.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ W634GU6RB11I — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | W634GU6RB-11 | MT41K256M16HA-125 | IS43TR16512B-125K |
|---|---|---|---|---|
| Package | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | 96-FBGA (7.5x13) | 96-FBGA (7.5x13) |
| Brand | Winbond Electronics | Winbond Electronics | Micron Technology | ISSI |
| Memory Size | 4Gbit | 4Gbit | 4Gbit | 4Gbit |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Clock Frequency | 933 MHz | 933 MHz | 933 MHz | 933 MHz |
| Operating Temperature | -40°C to +95°C | -40°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant |
أبرز الفروقات
- Industrial temperature range (مقابلMT41K256M16HA-125)
- Low-voltage operation (مقابلIS43TR16512B-125K)
- Same-brand availability (مقابلK4B4G1646E-BYMA)
ملاحظات التصميم
For the 96-ball VFBGA package, ensure the PCB has adequate routing channels for the fine-pitch balls. Use micro-vias or blind vias to connect inner layers. Follow JEDEC guidelines for DDR3L layout, including matched trace lengths for DQ, DQS, and address/control signals to maintain signal integrity at 933MHz.
Decouple the VDD and VDDQ pins with 0.1uF and 1uF ceramic capacitors placed as close as possible to the balls. Use a solid ground plane and a separate power plane for VDDQ to minimize noise. The 1.35V supply should be regulated with a low-noise LDO or DC-DC converter to ensure stable operation.
The VFBGA package has a thermal resistance of approximately 20°C/W. For high-speed operation, ensure adequate airflow or a thermal pad to dissipate heat. The industrial temperature range allows operation up to 95°C, but keep junction temperature below 105°C for reliability.
معلومات الامتثال
RoHS compliant and halogen-free per Winbond product documentation. AEC-Q100 not applicable for DRAM.
