W634GU6RB11I - 4Gb DDR3L SDRAM x16 933MHz | Winbond
MPN: W634GU6RB11I ✓ Hoạt độngW634GU6RB11I Tóm tắt
DDR3L SDRAM (Double Data Rate 3 Low Voltage) is a type of synchronous dynamic random-access memory that transfers data on both edges of the clock signal, effectively doubling the data rate. It operates at a lower voltage (1.35V) than standard DDR3 (1.5V), offering improved energy efficiency. DDR3L is part of the DDR SDRAM family, which includes DDR, DDR2, DDR3, and DDR4, and is widely used in computing, networking, and embedded systems where high bandwidth and low power are critical.
Key features of the W634GU6RB11I include a parallel interface with a 16-bit data bus, support for industrial temperature range (-40°C to +95°C), and compatibility with JEDEC DDR3L standards. The device offers burst lengths of 8 and 4, on-die termination (ODT), and programmable CAS latency. Its low-voltage operation and high density make it suitable for applications requiring large memory capacity with minimal power draw.
The W634GU6RB11I utilizes advanced DRAM process technology, achieving high-speed data transfer while maintaining low power consumption. The 96-ball VFBGA package provides excellent thermal and electrical performance, with a compact footprint suitable for space-constrained designs. The device supports auto-refresh and self-refresh modes, ensuring data integrity with minimal power consumption during idle periods.
Typical applications include networking equipment (routers, switches), industrial automation, embedded computing, and consumer electronics such as set-top boxes and smart TVs. Its industrial temperature rating makes it suitable for harsh environments, while the low-voltage operation extends battery life in portable devices.
When designing with this component, ensure proper decoupling capacitors are placed near the power pins to minimize noise. The VFBGA package requires careful PCB layout to route the fine-pitch balls, and the DDR3L interface should be terminated according to JEDEC guidelines to maintain signal integrity.
Bộ thay thế dễ dàng lắp đặt cho W634GU6RB11I — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với W634GU6RB11I (cùng hình factor và footprint) — khác nhau ở Package, Supply Voltage, Operating Temperature, CAS Latency, Data Rate.
W634GU6RB-11
✅ Drop-In✗ Hết hàng
$13.5227 / Đơn vị
Xem tài liệu →W634GU6NB-11
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
MT41K256M16HA-125
✅ Drop-In ⚠️ Thông số chưa được xác minh✗ Hết hàng
$6.3636 / Đơn vị
Xem tài liệu →IS43TR16512B-125K
✅ Drop-In ⚠️ Thông số chưa được xác minh📋 Tham chiếu thay thế (không có trong danh mục)
K4B4G1646E-BYMA
✅ Drop-In ⚠️ Thông số chưa được xác minh✗ Hết hàng
$14.3182 / Đơn vị
Xem tài liệu →W634GU6RB11I Tỷ lệ tối đa & tính chất điện
| Kiểu bộ nhớ | DDR3L SDRAM |
| Kích thước bộ nhớ | 4Gbit (256M x 16) |
| Giao diện | Parallel |
| Clock Frequency | 933 MHz |
| Access Time | 20 ns |
| Điện áp cung cấp | 1.35V |
| Hộp | 96-VFBGA (7.5x13) |
| Nhiệt độ hoạt động | -40°C to +95°C (Industrial) |
| Bề rộng đường dữ liệu | 16 bit |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | Compliant |
| Đông trùng haogen | Yes |
| Tổ chức | 256M x 16 |
| Latency CAS | 11 (at 933 MHz) |
| Refresh | Auto and Self Refresh |
Cấu hình chân W634GU6RB11I
| Chân A1 | VDD — Power supply (1.35V) |
| Chân A2 | DQ0 — Data input/output 0 |
| Chân A3 | DQ1 — Data input/output 1 |
| Chân B1 | VSS — Ground |
| Chân B2 | DQ2 — Data input/output 2 |
| Chân B3 | DQ3 — Data input/output 3 |
| Chân C1 | VDDQ — I/O power supply |
| Chân C2 | DQ4 — Data input/output 4 |
| Chân C3 | DQ5 — Data input/output 5 |
| Chân D1 | VSSQ — I/O ground |
| Chân D2 | DQ6 — Data input/output 6 |
| Chân D3 | DQ7 — Data input/output 7 |
| Chân E1 | CK — Clock input |
| Chân E2 | CK# — Complementary clock input |
| Chân E3 | CKE — Clock enable |
Ứng dụng tiêu biểu
W634GU6RB11I phù hợp cho 6 Áp dụngs: Networking Equipment, Industrial Automation, Embedded Computing, Consumer Electronics, Automotive Infotainment, Medical Devices.
Networking Equipment
The W634GU6RB11I's 4Gb density and 933MHz speed provide ample buffering for routers and switches. Its low 1.35V operation reduces power consumption in always-on network devices, while the industrial temperature range ensures reliability in telecom cabinets. The 16-bit interface simplifies PCB routing, and the VFBGA package fits compact line cards.
Được đề xuất
Industrial Automation
In industrial controllers and PLCs, the W634GU6RB11I provides reliable, high-speed memory for data logging and real-time processing. Its industrial temperature rating (-40°C to +95°C) withstands harsh factory environments. The low-voltage operation minimizes heat generation, and the 4Gb capacity supports complex control algorithms. The parallel interface integrates easily with industrial SoCs.
Được đề xuất
Embedded Computing
For embedded systems like single-board computers and IoT gateways, the W634GU6RB11I offers a balance of capacity, speed, and power efficiency. The 4Gb size supports operating systems and applications, while 933MHz ensures responsive performance. The 1.35V supply extends battery life in portable embedded devices. The VFBGA package is ideal for compact designs.
Được đề xuất
Consumer Electronics
In smart TVs, set-top boxes, and gaming consoles, the W634GU6RB11I provides the memory bandwidth needed for HD video streaming and multitasking. Its low power consumption is crucial for energy-efficient consumer devices. The 16-bit interface reduces BOM cost, and the compact VFBGA package fits slim enclosures. The industrial temperature grade ensures durability in home environments.
Được đề xuất
Automotive Infotainment
The W634GU6RB11I is suitable for automotive infotainment systems, providing high-speed memory for navigation, audio, and video processing. Its industrial temperature range covers automotive cabin environments, and the low-voltage operation reduces stress on vehicle power systems. The 4Gb capacity supports complex user interfaces, and the parallel interface connects to automotive SoCs.
Được đề xuất
Medical Devices
In medical imaging and patient monitoring equipment, the W634GU6RB11I offers reliable, high-speed memory for data acquisition and processing. Its industrial temperature rating ensures operation in clinical environments, and the low power consumption is beneficial for battery-powered devices. The 4Gb capacity supports large data buffers, and the VFBGA package is suitable for compact medical devices.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho W634GU6RB11I — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | W634GU6RB-11 | MT41K256M16HA-125 | IS43TR16512B-125K |
|---|---|---|---|---|
| Package | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | 96-FBGA (7.5x13) | 96-FBGA (7.5x13) |
| Brand | Winbond Electronics | Winbond Electronics | Micron Technology | ISSI |
| Memory Size | 4Gbit | 4Gbit | 4Gbit | 4Gbit |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Clock Frequency | 933 MHz | 933 MHz | 933 MHz | 933 MHz |
| Operating Temperature | -40°C to +95°C | -40°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Bảo phân biệt quan trọng
- Industrial temperature range (vsMT41K256M16HA-125)
- Low-voltage operation (vsIS43TR16512B-125K)
- Same-brand availability (vsK4B4G1646E-BYMA)
Ghi chú thiết kế
For the 96-ball VFBGA package, ensure the PCB has adequate routing channels for the fine-pitch balls. Use micro-vias or blind vias to connect inner layers. Follow JEDEC guidelines for DDR3L layout, including matched trace lengths for DQ, DQS, and address/control signals to maintain signal integrity at 933MHz.
Decouple the VDD and VDDQ pins with 0.1uF and 1uF ceramic capacitors placed as close as possible to the balls. Use a solid ground plane and a separate power plane for VDDQ to minimize noise. The 1.35V supply should be regulated with a low-noise LDO or DC-DC converter to ensure stable operation.
The VFBGA package has a thermal resistance of approximately 20°C/W. For high-speed operation, ensure adequate airflow or a thermal pad to dissipate heat. The industrial temperature range allows operation up to 95°C, but keep junction temperature below 105°C for reliability.
Thông tin tuân thủ
RoHS compliant and halogen-free per Winbond product documentation. AEC-Q100 not applicable for DRAM.
