Semiconductor News · Sourcing brief

Intel Nova Lake-HX and -H die shots surface: six-tile mobile package mapped

Bare-die photos of Nova Lake-HX and -H lay out a six-tile mobile package using TSMC N2P, Intel 3-E and Intel 18A-P nodes, with new core counts and package sizes.

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TL;DR — three sentences

  • Nova Lake-HX pairs 8P+16E+4LPE cores on TSMC N2P with hub, peripheral, and graphics tiles on Intel 18A-P and Intel 3-E in a 360 mm² six-tile package (S1).
  • Nova Lake-H shares the same non-compute tiles as HX but ships a 4P+8E+4LPE compute die on TSMC N2P at 55 mm² inside a 276 mm² package (S1).
  • Graphics tile embeds 4 Xe cores on Intel 3-E at about 26 mm², with an 85 mm² passive die aiding structural and operational integrity on HX (S1).

Taken from key_takeaways (real field, max 3 entries). Fact and analysis are labelled separately.

Intel Nova Lake-HX and -H die shots surface: six-tile mobile package mapped — Semiconductor News news briefEditorial cover for a Semiconductor News brief. Chip motif; headline "Intel Nova Lake-HX and -H die shots surface: six-tile mobile package mapped". No reported key numbers on this brief, so no number strip is drawn. 1 cited source. A one-time entrance animation stops under reduced motion.SEMICONDUCTOR NEWS · NEWS BRIEFIntel Nova Lake-HX and -H die shotssurface: six-tile mobile package mappedXAIPART
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Reported by TechPowerUp on 2026-10-16. Summarized and analyzed by XAIPART Editorial.

What happened

Bare-die photographs of Intel's upcoming mobile "Nova Lake" processors have been published by the Moore's Law Is Dead YouTube channel, showing the package layout of both the "Nova Lake-HX" and "Nova Lake-H" variants.S1

The top "Nova Lake-HX" part uses an 8 P-Core plus 16 E-Core plus 4 LPE-Core configuration and ships in a 12x30 mm package totaling 360 mm² across six tiles.S1

Its compute tile holds the 8P+16E cores on the TSMC N2P node at 104 mm², the largest single die in the package.S1

The graphics tile embeds 4 Xe GPU cores on Intel 3-E at roughly 26 mm²; a central hub die on Intel 18A-P hosts the 4 LPE-Cores at 72 mm²; a peripheral control die sits beside it at 58 mm² on the same 18A-P node; a 21 mm² dummy die is used for structural integrity; and a separate 85 mm² passive die is placed beside the compute tile for structural and operational support.S1

The lower-tier "Nova Lake-H" uses a 4P+8E+4LPE setup in a smaller 12x23 mm package, 276 mm² total. The compute tile carries 4P+8E on TSMC N2P and shrinks to 55 mm², with an adjacent 45 mm² passive die. The peripheral, central hub, and graphics tiles retain the same sizes and Intel nodes as in the HX part.S1

MetricReported
Nova Lake-HX core config8P + 16E + 4 LPE
Nova Lake-HX package size / area12 x 30 mm / 360 mm²
Nova Lake-HX compute tile (TSMC N2P)104 mm²
Nova Lake-HX graphics tile (Intel 3-E)~26 mm², 4 Xe cores
Nova Lake-HX hub die / peripheral die (Intel 18A-P)72 mm² / 58 mm²
Nova Lake-HX passive die / dummy die85 mm² / 21 mm²
Nova Lake-H core config4P + 8E + 4 LPE
Nova Lake-H package size / area12 x 23 mm / 276 mm²
Nova Lake-H compute tile (TSMC N2P)55 mm²
Nova Lake-H passive die45 mm²
HX power, clocks, launch date, pricingNot disclosed
H power, clocks, launch date, pricingNot disclosed

Background timeline

  1. No prior milestones disclosed by the source.

XAIPART take

Technical impact

The package map codifies a chiplet approach in which Intel keeps the iGPU, hub, and I/O control tiles on internal 18A-P and Intel 3-E processes, while outsourcing the heavy compute tile to TSMC N2P. XAIPART analysis: in plain procurement terms, this means at least two separate foundry supply lines feed every Nova Lake mobile SKU, with the compute tile carrying the bulk of the die area and therefore the largest share of wafer consumption.

Market impact

Because the part reuses identical hub, peripheral, and graphics tiles across both SKUs, Intel can bin and yield these dies once and pair them with two compute-tile sizes (104 mm² vs 55 mm²). XAIPART analysis: that shared-tile strategy should help stabilize mobile-platform allocations relative to a monolithic die, although buyers should still plan for TSMC N2P-driven timing risk on the compute tile.

Action

Design teams evaluating Nova Lake-HX or -H should freeze system thermal budgets once Intel publishes TDP figures (not disclosed here) and cross-check that the 12x30 mm / 12x23 mm package footprints fit existing socket or BGA keep-out zones. XAIPART analysis: for now it is wise to lock the hub and iGPU block-diagrams from this shot, then wait for an official Intel block diagram before committing to a final BOM revision.

XAIPART Forecast

If Intel discloses the Nova Lake-HX TDP at or below 55 W, this forecast is confirmed; if it lands above 75 W, the forecast is wrong. XAIPART analysis: XAIPART expects an official block diagram for Nova Lake-HX to appear within 9 months (by Q3 2027), based on the cadence between prior Meteor Lake and Lunar Lake disclosures.

Facts are as reported by the cited source. The design-in, sourcing and forward-looking statements above are XAIPART's analysis, not the source's claims. The die-shot images come from a single YouTube source (Moore's Law Is Dead) and have not yet been confirmed against an official Intel block diagram; TDP, launch date, and pricing are not disclosed.

Corrections: none at publication. This brief will be updated with a timestamp if the source corrects its report.

Alternatives and lifecycle

Alternatives on file — catalog scope, not a market ranking
PartRelationLifecycleBasis
— No alternative on file NEEDS DATA — Requires match_type before any predecessor label may appear

“Predecessor” and “alternative” labels come only from a recorded match type, a lifecycle status, or the source text. Where no match is recorded, no label is shown. Our own listings are not a market reference.

What to watch

Falsifiable forecast — threshold, window and current status. Disproved forecasts stay visible.
ClaimThresholdByStatus
If Intel discloses the Nova Lake-HX TDP at or below 55 W, this forecast is confirmed it lands above 75 W Q3 2027 Pending

Forecasts that turn out wrong are kept visible and marked. We do not delete them.

Competitive landscape

  • 21763 live listings in this category on XAIPART
  • 88 manufacturers represented
  • 57 manufacturers mentioned in our news archive over the last 30 days

Counts reflect the XAIPART catalog only — they are not market share.

Affected parts

No catalog match. This story does not map to any part currently listed on XAIPART. We do not infer matches, and we do not show a placeholder list.

Where this sits in the story

Event chain · as of 2026-10-18T07:30:14+08:00 · showing 6 of 7 briefs · nodes link to published articles on this site.
Event chain — intel+semiconductor-newsChain nodes: 2026-10-08 Intel is preparing a Core 2000HX mobile family on 'Raptor Lake Next' dies, reviving DDR4 compatibility for laptops while Nova Lake-HX takes the Core Ultra 4000HX name.; 2026-10-10 ASUS has started U.S. retail of the Zenbook 14 (UX3480QA) in 8 GB and 16 GB variants, with an Intel Core Ultra 9 386H SKU slated for early Q4 2026.; 2026-10-11 Akasa launches a fully passive aluminium Mini-ITX chassis with an integrated 220 W DC-DC board and dual 2.5" bays, aimed at POS, kiosks and edge boxes running Intel LGA1851 through LGA115X CPUs up to 35 W TDP.; 2026-10-11 INNO3D launches the 6U AGS-6220V2 rack server with eight PCIe Gen 5 RTX PRO 6000 Blackwell Server Edition GPUs, aimed at AI training and inference fleets.; 2026-10-17 Bare-die photos of Nova Lake-HX and -H lay out a six-tile mobile package using TSMC N2P, Intel 3-E and Intel 18A-P nodes, with new core counts and package sizes.; 2026-10-18 Intel said Razor Lake-AX will deliver 700 TOPS at INT8/FP8, 3.88x Panther Lake's 180 TOPS, using a Xe3 iGPU up to 32 cores and bringing back on-package LPDDR5X/LPDDR6 memory.. As of 2026-10-18T07:30:14+08:00. Open forecast: Intel is preparing a Core 2000HX mobile family on 'Raptor Lake Next' die — pending Open forecast: ASUS has started U.S. retail of the Zenbook 14 (UX3480QA) in 8 GB and 16 — pending.2026-10-08Intel is preparingour brief ↗2026-10-10ASUS has started Uour brief ↗2026-10-11Akasa launches a four brief ↗2026-10-11INNO3D launches thour brief ↗2026-10-17Bare-die photos ofour brief ↗this brief2026-10-18Intel said Razor Lour brief ↗Open forecast: Intel is preparing a Core 2000HX mobile family on 'Raptor Lake Next' die — pendingOpen forecast: ASUS has started U.S. retail of the Zenbook 14 (UX3480QA) in 8 GB and 16 — pending
  1. intel-s-core-2000hx-plan-brings-ddr4-support-back-to-high-end-laptop-cpus2026-10-08
  2. asus-zenbook-14-lands-at-u-s-best-buy-with-snapdragon-x-plus-an-intel-core-ultra-9-386h-sku-due-q4-20262026-10-10
  3. akasa-euler-mx2-fanless-mini-itx-case-targets-35-w-industrial-builds-without-moving-parts2026-10-11 · product launch
  4. inno3d-ags-6220v2-packs-eight-rtx-pro-6000-blackwell-server-gpus-in-6u-what-it-means-for-ai-rack-buyers2026-10-11 · product launch
  5. intel-nova-lake-hx-and-h-die-shots-surface-six-tile-mobile-package-mapped2026-10-17
  6. intel-razor-lake-ax-targets-700-tops-what-3-88x-panther-lake-means-for-mobile-ai-boms2026-10-18
  1. Intel is preparing a Core 2000HX mobile family on 'Raptor Lake Next' dies, reviving DDR4 compatibility for laptops while Nova Lake-HX takes the Core Ultra 4000HX name. trade
  2. ASUS has started U.S. retail of the Zenbook 14 (UX3480QA) in 8 GB and 16 GB variants, with an Intel Core Ultra 9 386H SKU slated for early Q4 2026. trade
  3. Akasa launches a fully passive aluminium Mini-ITX chassis with an integrated 220 W DC-DC board and dual 2.5" bays, aimed at POS, kiosks and edge boxes running Intel LGA1851 through LGA115X CPUs up to 35 W TDP. product launch trade
  4. INNO3D launches the 6U AGS-6220V2 rack server with eight PCIe Gen 5 RTX PRO 6000 Blackwell Server Edition GPUs, aimed at AI training and inference fleets. product launch trade
  5. Bare-die photos of Nova Lake-HX and -H lay out a six-tile mobile package using TSMC N2P, Intel 3-E and Intel 18A-P nodes, with new core counts and package sizes. trade
  6. Intel said Razor Lake-AX will deliver 700 TOPS at INT8/FP8, 3.88x Panther Lake's 180 TOPS, using a Xe3 iGPU up to 32 cores and bringing back on-package LPDDR5X/LPDDR6 memory. trade
  7. Minisforum announced the fanless 5-bay S5 NAS on Intel Core 3 304, with 5x M.2 NVMe, 10GbE + 2.5GbE, dual USB4, and an always-on local Agent runtime. product launch trade

The chain is built only from published briefs — a node without a brief is not drawn.

Cost pressure by dimension

Source: FRED · Generated · reference output z and composite are algorithm outputs, not a fetch snapshot

Cost pressure by dimension — composite stateDiverging bars for three dimensions around a zero midpoint. Input Cost has no reading; Supply Demand z -1.4711, notable; Fx Energy z 0.4541, neutral. Composite index -7.6, band neutral.0Input costno readingSupply/demandz −1.4711 · notable46 dFX & energyz +0.4541 · neutral6 dcomposite −7.6 · neutral−100 · −40 · −15 · 0 · +15 · +40 · +100
Underlying values — copyable for verification.
DimensionFRED series IDUnitLagAs of
Input costPCOPPUSDM, PALUMUSDM, PNICKUSDMUSD/mt96 d
Supply/demandPCU334413334413, IPG3344Sindex(1982=100) / index(2017=100)46 d
FX & energyDEXCHUS, DCOILBRENTEU, DHHNGSPrate / USD/bbl / USD/MMBtu6 d

No free authoritative interface for: gold · silver · rare earth · polysilicon · lithium carbonate · market share — listed rather than approximated.

How this was produced

Process evidence — fetch, source sanity, model and gate
Audit trail for this brief
Source fetched TechPowerUp · www.techpowerup.com · 2,322 chars · fetch status success
Source sanity (S1) ok — passed before any model call (no s1_ block recorded)
Model / prompt MiniMax-M3 · prompt Blog Agent - News Summary (v2.8-final) · 6,667 tokens · 26.7s · run completed
Gate verdict pass · 6/6 applicable checks passed · spec v2.9 · C10 ratio 0.023138 · C10 rounds 0

Every row above is produced by the pipeline, not written by hand.

Editorial score

Deterministic gate result — pure PHP, no model involvement in the verdict
Gate score breakdown 6 applicable checks, 6 passed: 100 percent. No hold items or mandatory failures. Gate spec: v2.9 (S0 + S1 + C1–C20) · Source affinity (C20): 0.5479. Applicable checks passed 6 / 6 = 100% · verdict: pass No hold items or mandatory failures Gate spec: v2.9 (S0 + S1 + C1–C20) · Source affinity (C20): 0.5479 The gate decides publication. The independent audit score is advisory only.

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Sources

  1. Intel "Nova Lake-HX" and "Nova Lake-H" Die Shots Appear — https://www.techpowerup.com/353791/intel-nova-lake-hx-and-nova-lake-h-die-shots-appear · rss · accessed

Facts are marked S1/S2 and trace to the linked source. Passages labelled analysis are XAIPART's own reasoning, kept separate from reported facts. Source links are followed rather than nofollow — attribution is intentional.