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Intel Nova Lake-HX 和 -H 裸片图曝光：六芯片移动封装布局揭晓

Nova Lake-HX 和 -H 的裸片照片展示了采用 TSMC N2P、Intel 3-E 和 Intel 18A-P 节点的六芯片移动封装，以及新的核心数量和封装尺寸。

已发布 已更新 4 分钟阅读 ✓ AI 就绪 分享

TL;DR——三句话

  • Nova Lake-HX pairs 8P+16E+4LPE cores on TSMC N2P with hub, peripheral, and graphics tiles on Intel 18A-P and Intel 3-E in a 360 mm² six-tile package (S1).
  • Nova Lake-H shares the same non-compute tiles as HX but ships a 4P+8E+4LPE compute die on TSMC N2P at 55 mm² inside a 276 mm² package (S1).
  • Graphics tile embeds 4 Xe cores on Intel 3-E at about 26 mm², with an 85 mm² passive die aiding structural and operational integrity on HX (S1).

摘自 key_takeaways （真实字段，最多 3 条）。事实与分析分别标注。

Intel Nova Lake-HX 和 -H 裸片图曝光：六芯片移动封装布局揭晓 — Semiconductor News news briefEditorial cover for a Semiconductor News brief. Chip motif; headline "Intel Nova Lake-HX 和 -H 裸片图曝光：六芯片移动封装布局揭晓". No reported key numbers on this brief, so no number strip is drawn. 1 cited source. A one-time entrance animation stops under reduced motion.SEMICONDUCTOR NEWS · NEWS BRIEFIntel Nova Lake-HX 和 -H裸片图曝光：六芯片移动封装布局揭晓XAIPART
Cover image generated from data already shown on this page: the category motif, the headline, and reported key numbers. No decorative illustration; no third-party image.

您从 AI 回答跳转而来——这是可验证的原文

AI 摘要可能遗漏了其结论的依据。原始预测、受影响料号及所有引用均在本页，均可追溯至来源。

XAIPART 预测

本篇简报包含可证伪的预测。

跳转至完整预测及其证伪规则 ›
受影响的料号

此报道在目录中无匹配——我们选择不显示，而不是推断匹配。

了解判定方式 ›
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Reported by TechPowerUp on 2026-10-16. Summarized and analyzed by XAIPART Editorial.

What happened

Bare-die photographs of Intel's upcoming mobile "Nova Lake" processors have been published by the Moore's Law Is Dead YouTube channel, showing the package layout of both the "Nova Lake-HX" and "Nova Lake-H" variants.S1

The top "Nova Lake-HX" part uses an 8 P-Core plus 16 E-Core plus 4 LPE-Core configuration and ships in a 12x30 mm package totaling 360 mm² across six tiles.S1

Its compute tile holds the 8P+16E cores on the TSMC N2P node at 104 mm², the largest single die in the package.S1

The graphics tile embeds 4 Xe GPU cores on Intel 3-E at roughly 26 mm²; a central hub die on Intel 18A-P hosts the 4 LPE-Cores at 72 mm²; a peripheral control die sits beside it at 58 mm² on the same 18A-P node; a 21 mm² dummy die is used for structural integrity; and a separate 85 mm² passive die is placed beside the compute tile for structural and operational support.S1

The lower-tier "Nova Lake-H" uses a 4P+8E+4LPE setup in a smaller 12x23 mm package, 276 mm² total. The compute tile carries 4P+8E on TSMC N2P and shrinks to 55 mm², with an adjacent 45 mm² passive die. The peripheral, central hub, and graphics tiles retain the same sizes and Intel nodes as in the HX part.S1

MetricReported
Nova Lake-HX core config8P + 16E + 4 LPE
Nova Lake-HX package size / area12 x 30 mm / 360 mm²
Nova Lake-HX compute tile (TSMC N2P)104 mm²
Nova Lake-HX graphics tile (Intel 3-E)~26 mm², 4 Xe cores
Nova Lake-HX hub die / peripheral die (Intel 18A-P)72 mm² / 58 mm²
Nova Lake-HX passive die / dummy die85 mm² / 21 mm²
Nova Lake-H core config4P + 8E + 4 LPE
Nova Lake-H package size / area12 x 23 mm / 276 mm²
Nova Lake-H compute tile (TSMC N2P)55 mm²
Nova Lake-H passive die45 mm²
HX power, clocks, launch date, pricingNot disclosed
H power, clocks, launch date, pricingNot disclosed

Background timeline

  1. No prior milestones disclosed by the source.

XAIPART take

Technical impact

The package map codifies a chiplet approach in which Intel keeps the iGPU, hub, and I/O control tiles on internal 18A-P and Intel 3-E processes, while outsourcing the heavy compute tile to TSMC N2P. XAIPART analysis: in plain procurement terms, this means at least two separate foundry supply lines feed every Nova Lake mobile SKU, with the compute tile carrying the bulk of the die area and therefore the largest share of wafer consumption.

Market impact

Because the part reuses identical hub, peripheral, and graphics tiles across both SKUs, Intel can bin and yield these dies once and pair them with two compute-tile sizes (104 mm² vs 55 mm²). XAIPART analysis: that shared-tile strategy should help stabilize mobile-platform allocations relative to a monolithic die, although buyers should still plan for TSMC N2P-driven timing risk on the compute tile.

Action

Design teams evaluating Nova Lake-HX or -H should freeze system thermal budgets once Intel publishes TDP figures (not disclosed here) and cross-check that the 12x30 mm / 12x23 mm package footprints fit existing socket or BGA keep-out zones. XAIPART analysis: for now it is wise to lock the hub and iGPU block-diagrams from this shot, then wait for an official Intel block diagram before committing to a final BOM revision.

XAIPART Forecast

If Intel discloses the Nova Lake-HX TDP at or below 55 W, this forecast is confirmed; if it lands above 75 W, the forecast is wrong. XAIPART analysis: XAIPART expects an official block diagram for Nova Lake-HX to appear within 9 months (by Q3 2027), based on the cadence between prior Meteor Lake and Lunar Lake disclosures.

Facts are as reported by the cited source. The design-in, sourcing and forward-looking statements above are XAIPART's analysis, not the source's claims. The die-shot images come from a single YouTube source (Moore's Law Is Dead) and have not yet been confirmed against an official Intel block diagram; TDP, launch date, and pricing are not disclosed.

Corrections: none at publication. This brief will be updated with a timestamp if the source corrects its report.

替代料与生命周期

已收录的替代料——仅为目录范围，不代表市场排名
料号关系生命周期依据
— 暂无收录替代料 待补充数据 — 需 match_type 后才可显示任何前代标签

“前代”和“替代”标签仅来自已记录的匹配类型、生命周期状态或来源文本。没有记录匹配时，不显示任何标签。我们自己的商品列表不构成市场参考。

关注要点

可证伪预测——阈值、时间窗口和当前状态。被推翻的预测仍保留可见。
论断阈值发布方状态
If Intel discloses the Nova Lake-HX TDP at or below 55 W, this forecast is confirmed it lands above 75 W Q3 2027 Pending

被证明错误的预测仍保留可见并加以标注。我们不会删除它们。

竞争格局

  • 23331 个在售商品（XAIPART 此分类）
  • 107 收录制造商
  • 68 家制造商（过去 30 天内出现在我们的新闻存档中）

统计数据仅反映 XAIPART 目录，不代表市场份额。

受影响的料号

目录中无匹配。 此事件未映射到 XAIPART 当前上架的任何料号。我们不推断匹配，也不显示占位列表。

此事在事件脉络中的位置

Event chain · as of 2026-10-18T07:30:14+08:00 · showing 6 of 7 briefs · nodes link to published articles on this site.
Event chain — intel+semiconductor-newsChain nodes: 2026-10-08 Intel 正在基于“Raptor Lake Next”芯片准备 Core 2000HX 移动系列，为笔记本电脑恢复 DDR4 兼容性，同时 Nova Lake-HX 采用 Core Ultra 4000HX 名称。; 2026-10-10 ASUS已在美国零售Zenbook 14（UX3480QA）的8 GB和16 GB版本，搭载Intel Core Ultra 9 386H的版本计划于2026年第四季度初推出。; 2026-10-11 Akasa 推出全被动铝制 Mini-ITX 机箱，集成 220 W DC-DC 板与双 2.5 英寸盘位，面向 POS、自助终端与边缘盒子，支持 Intel LGA1851 至 LGA115X、TDP 最高 35 W 的 CPU。; 2026-10-11 INNO3D 推出 6U AGS-6220V2 机架服务器，搭载八块 PCIe Gen 5 RTX PRO 6000 Blackwell Server Edition GPU，面向 AI 训练与推理集群。; 2026-10-17 Nova Lake-HX 和 -H 的裸片照片展示了采用 TSMC N2P、Intel 3-E 和 Intel 18A-P 节点的六芯片移动封装，以及新的核心数量和封装尺寸。; 2026-10-18 Intel 表示 Razor Lake-AX 将在 INT8/FP8 下提供 700 TOPS，是 Panther Lake 180 TOPS 的 3.88 倍，采用最高 32 核的 Xe3 iGPU，并重新引入封装内 LPDDR5X/LPDDR6 内存。. As of 2026-10-18T07:30:14+08:00. Open forecast: Intel 正在基于“Raptor Lake Next”芯片准备 Core 2000HX 移动系列，为笔记本电脑恢复 DDR4 兼容性，同时 N — pending Open forecast: ASUS已在美国零售Zenbook 14（UX3480QA）的8 GB和16 GB版本，搭载Intel Core Ultra 9 386H的版本 — pending.2026-10-08Intel 正在基于“Raptor our brief ↗2026-10-10ASUS已在美国零售Zenbook our brief ↗2026-10-11Akasa 推出全被动铝制 Miniour brief ↗2026-10-11INNO3D 推出 6U AGS-6our brief ↗2026-10-17Nova Lake-HX 和 -H our brief ↗this brief2026-10-18Intel 表示 Razor Lakour brief ↗Open forecast: Intel 正在基于“Raptor Lake Next”芯片准备 Core 2000HX 移动系列，为笔记本电脑恢复 DDR4 兼容性，同时 N — pendingOpen forecast: ASUS已在美国零售Zenbook 14（UX3480QA）的8 GB和16 GB版本，搭载Intel Core Ultra 9 386H的版本 — pending
  1. intel-s-core-2000hx-plan-brings-ddr4-support-back-to-high-end-laptop-cpus2026-10-08
  2. asus-zenbook-14-lands-at-u-s-best-buy-with-snapdragon-x-plus-an-intel-core-ultra-9-386h-sku-due-q4-20262026-10-10
  3. akasa-euler-mx2-fanless-mini-itx-case-targets-35-w-industrial-builds-without-moving-parts2026-10-11 · product launch
  4. inno3d-ags-6220v2-packs-eight-rtx-pro-6000-blackwell-server-gpus-in-6u-what-it-means-for-ai-rack-buyers2026-10-11 · product launch
  5. intel-nova-lake-hx-and-h-die-shots-surface-six-tile-mobile-package-mapped2026-10-17
  6. intel-razor-lake-ax-targets-700-tops-what-3-88x-panther-lake-means-for-mobile-ai-boms2026-10-18
  1. Intel 正在基于“Raptor Lake Next”芯片准备 Core 2000HX 移动系列，为笔记本电脑恢复 DDR4 兼容性，同时 Nova Lake-HX 采用 Core Ultra 4000HX 名称。 trade
  2. ASUS已在美国零售Zenbook 14（UX3480QA）的8 GB和16 GB版本，搭载Intel Core Ultra 9 386H的版本计划于2026年第四季度初推出。 trade
  3. Akasa 推出全被动铝制 Mini-ITX 机箱，集成 220 W DC-DC 板与双 2.5 英寸盘位，面向 POS、自助终端与边缘盒子，支持 Intel LGA1851 至 LGA115X、TDP 最高 35 W 的 CPU。 product launch trade
  4. INNO3D 推出 6U AGS-6220V2 机架服务器，搭载八块 PCIe Gen 5 RTX PRO 6000 Blackwell Server Edition GPU，面向 AI 训练与推理集群。 product launch trade
  5. Nova Lake-HX 和 -H 的裸片照片展示了采用 TSMC N2P、Intel 3-E 和 Intel 18A-P 节点的六芯片移动封装，以及新的核心数量和封装尺寸。 trade
  6. Intel 表示 Razor Lake-AX 将在 INT8/FP8 下提供 700 TOPS，是 Panther Lake 180 TOPS 的 3.88 倍，采用最高 32 核的 Xe3 iGPU，并重新引入封装内 LPDDR5X/LPDDR6 内存。 trade
  7. Minisforum 发布基于 Intel Core 3 304 的无风扇 5 盘位 S5 NAS，配备 5x M.2 NVMe、10GbE + 2.5GbE、双 USB4 和常驻本地 Agent 运行时。 product launch trade

因果链仅由已发布的简报构建——没有简报的节点不会绘制。

各维度成本压力

Source: FRED · Generated · reference output z and composite are algorithm outputs, not a fetch snapshot

Cost pressure by dimension — composite stateDiverging bars for three dimensions around a zero midpoint. Input Cost has no reading; Supply Demand z -1.4711, notable; Fx Energy z 0.2546, neutral. Composite index -9.1, band neutral.0投入成本no reading供需z −1.4711 · notable46 d汇率与能源z +0.2546 · neutral5 dcomposite −9.1 · neutral−100 · −40 · −15 · 0 · +15 · +40 · +100
Underlying values — copyable for verification.
DimensionFRED series IDUnitLagAs of
投入成本PCOPPUSDM, PALUMUSDM, PNICKUSDMUSD/mt52 d
供需PCU334413334413, IPG3344Sindex(1982=100) / index(2017=100)46 d
汇率与能源DEXCHUS, DCOILBRENTEU, DHHNGSPrate / USD/bbl / USD/MMBtu5 d

No free authoritative interface for: gold · silver · rare earth · polysilicon · lithium carbonate · market share — listed rather than approximated.

本文如何生成

过程证据——抓取、来源可靠性检查、模型与校验
本简报的审计记录
Source fetched TechPowerUp · www.techpowerup.com · 2,322 chars · fetch status success
Source sanity (S1) ok — passed before any model call (no s1_ block recorded)
Model / prompt MiniMax-M3 · prompt Blog Agent - News Summary (v2.8-final) · 6,667 tokens · 26.7s · run completed
Gate verdict pass · 6/6 applicable checks passed · spec v2.9 · C10 ratio 0.023138 · C10 rounds 0

上述每一行均由流水线生成，而非人工撰写。

编辑评分

确定性校验结果——纯 PHP 实现，判定过程不涉及模型
校验评分明细 6 项适用检查， 6项通过： 100 %. No hold items or mandatory failures. Gate spec: v2.9 (S0 + S1 + C1–C20) · Source affinity (C20): 0.5479. 适用检查已通过 6 / 6 = 100% · 判定： pass No hold items or mandatory failures Gate spec: v2.9 (S0 + S1 + C1–C20) · Source affinity (C20): 0.5479 是否发布由校验决定。独立审计评分仅供参考。

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来源

  1. Intel "Nova Lake-HX" and "Nova Lake-H" Die Shots Appear — https://www.techpowerup.com/353791/intel-nova-lake-hx-and-nova-lake-h-die-shots-appear · rss · 访问于

事实标注为 S1/S2，并可追溯至所链接的来源。标注为 分析 的内容是 XAIPART 自身的推理，与报道的事实分开呈现。来源链接会被访问核实，而非 nofollow ——署名是有意为之。