FPGA & CPLD
Products (6352)
10M25DAF256C7G - MAX 10 FPGA, 25K LE, 256-LBGA | Intel / Altera
The Intel (formerly Altera) 10M25DAF256C7G is a MAX 10 Field Programmable Gate Array (FPGA) integrating 25,000 logic elements, 691,200 bits of embedded SRAM, and 178 user I/Os in a 256-pin LBGA (F256) package. It belongs to the MAX 10 family of non-volatile FPGAs that combine flash-based configuration memory with analog and digital peripherals on a single die, eliminating the need for an external configuration device. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit at the top of the programmable logic hierarchy: programmable logic device (PLD) -> CPLD -> FPGA. MAX 10 specifically is a low-cost, low-power, instant-on FPGA family targeting volume applications in industrial, automotive, and consumer markets. Key features of the 10M25DAF256C7G include 25K logic elements, 1.6 Mb embedded memory (M9K blocks), integrated 12-bit ADC blocks, on-chip flash configuration memory, and DSP blocks. The -C7 speed grade and commercial temperature grade (0C to +85C) make it the cost-optimized variant for non-automotive applications. The 256-ball LBGA package supports high I/O count with 178 user I/Os, suitable for industrial control, motor drive interfaces, and video bridging. The MAX 10 architecture combines a look-up-table (LUT) based logic fabric with hard IP for PLLs, ADCs, and DDR memory controllers. On-chip flash enables single-chip instant-on operation, which differentiates MAX 10 from SRAM-based FPGAs (Cyclone V, Cyclone 10) that require external boot memory. The 10M25 is the mid-density point in the family, sitting between 10M16 and 10M40/10M50. Typical applications include industrial machine vision, factory automation controllers, motor control interfaces, video format conversion, IoT edge nodes, and as a glue-logic replacement for multiple CPLDs or discrete logic. The integrated ADC and instant-on flash make it especially attractive for applications that previously required an MCU plus separate logic devices. When designing with the 10M25DAF256C7G, allocate sufficient PCB area for decoupling capacitors near each power pin, follow Intel's recommended power-sequencing and thermal management guidelines, and verify Quartus Prime support for the -C7 speed grade. Designers migrating from 10M16 should review the additional logic and memory resources; designers moving to 10M40 or 10M50 can use the same F256 footprint family. This page synthesizes distributor pricing, drop-in alternatives from the MAX 10 family, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing and substitution decisions.
10M25DAF256C8G - MAX 10 FPGA, 25K LE, 256-FBGA | Intel
The Intel 10M25DAF256C8G is a member of the MAX 10 family of non-volatile Field-Programmable Gate Arrays (FPGAs), integrating 25,000 logic elements (LEs), 1,728 Kbits of embedded memory, and a 178-pin user I/O count in a 256-ball Fine-Pitch BGA (FBGA) package. It is fabricated on a low-power 55 nm TSMC process with instant-on support provided by internal configuration flash, and is offered in the commercial 0 °C to 85 °C temperature grade with the C8 speed grade. The device includes hardened 12-bit ADC blocks, PLLs, and DSP multipliers suitable for general-purpose logic, motor control, industrial I/O expansion, and low-cost display bridge applications. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic architecture, routing, and I/O behaviour can be defined by the user after manufacture through a hardware-description-language (HDL) bitstream. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> CPLD -> FPGA -> SoC FPGA, and combine lookup-table (LUT) based fabric, dedicated memory, multipliers, transceivers, and clock management to implement parallel digital signal processing, glue logic, and bus-bridging functions that would otherwise require multiple discrete ICs. Key feature highlights for the 10M25DAF256C8G include 25,000 logic elements, 1,728 Kbits (Kb) embedded SRAM, 4 PLLs, 2 hard 12-bit ADCs, and integrated configuration flash that eliminates an external boot PROM. The device supports LVDS, LVCMOS, SSTL, and DDR3 external memory interfaces, with 8 GPIO banks and a low-power core that typically draws under 1 W at moderate toggle rates. Compared with discrete MCU+ASIC solutions, the integrated flash and ADC blocks reduce BOM count and PCB footprint for industrial control designs. From an architectural standpoint, the MAX 10 family uses an SRAM-based logic fabric backed by non-volatile flash, allowing single-chip instant-on in under 10 ms. Each logic element is a 4-input LUT plus dedicated register, and DSP blocks support 18x18 multiplication with optional accumulation. The dual 12-bit ADCs can sample up to 1 MSPS with up to 17 analog inputs, providing sensor interface capability without an external ADC. Typical applications include industrial motor control (where the integrated ADC and PWM-friendly I/O simplify drive firmware), factory automation I/O expansion modules, low-cost video bridging and image preprocessing, and consumer display controllers. The 256-FBGA package offers ample I/O for parallel RGB or LVDS panel interfaces in human-machine-interface (HMI) systems. When designing with the 10M25DAF256C8G, observe the I/O bank supply grouping in the pinout table because mixed-voltage rails (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) require separate VCCIO pins per bank. Use Intel Quartus Prime (Lite or Standard edition) for synthesis, place-and-route, and programming-file generation, and follow the MAX 10 Power and Thermal Management User Guide for power estimation. This page synthesizes distributor pricing, package-level drop-in alternatives within the MAX 10 family, and PCB layout notes that are not consolidated in the manufacturer datasheet itself, giving component engineers a single reference for sourcing, replacement, and design validation.
10M25DAF256I7G - MAX 10 FPGA 25K LE 256-FBGA Industrial | Intel
The Intel / Altera 10M25DAF256I7G is a MAX 10 family field-programmable gate array (FPGA) with 25,000 logic elements, 1,638 Kbit embedded memory (691,200 bits), and 178 user I/Os, housed in a 256-ball FineLine BGA (FBGA-256) package with industrial temperature grade (-40°C to +100°C). It belongs to the dual-supply "DAF" sub-family, integrating non-volatile configuration flash, 18x18 multipliers, and analog-to-digital converter (ADC) blocks directly on-chip. An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable I/O, allowing hardware designers to implement arbitrary digital logic that is re-programmed in the field. Within the broader semiconductor taxonomy, FPGAs sit alongside microcontrollers, microprocessors, ASICs, and CPLDs in the programmable logic category. The MAX 10 line, manufactured on a 55 nm process, occupies the low-power, non-volatile niche between traditional SRAM FPGAs and CPLDs, eliminating external boot PROM requirements through on-die flash configuration memory. Key features of the 10M25DAF256I7G include 25K logic elements, 4 PLLs, 2 KB user flash, integrated 12-bit ADC, 45 18x18 multipliers, and dual-core 1.2 V/2.5 V core voltage support. The 256-FBGA package enables dense I/O count for bridge, motor-control, and industrial sensor aggregator designs while keeping board area modest. The architecture combines look-up-table (LUT)-based logic fabric, embedded SRAM blocks (M9K/M144K), variable-precision DSP blocks, and hard IP for phase-locked loops and ADCs. This heterogeneous mix lets a single device replace discrete logic, timers, and analog front-ends, simplifying BOM and PCB layers in industrial designs. Typical applications include industrial motor control, factory automation I/O expansion, LED video-wall scan drivers, portable instrumentation, and bridging between legacy parallel buses and modern serial protocols such as SPI, I2C, UART, and LVDS. The integrated flash and ADC suit designs that previously required a CPLD plus an external MCU. When designing, budget I/O bank voltages before pin assignment; MAX 10 supports 1.2 V through 3.3 V LVCMOS/LVDS per bank, and mixing voltages requires careful VREF planning. Use Quartus Prime for synthesis and place-and-route, and verify JTAG chain integrity before programming. This page synthesizes Intel / Altera datasheet parameters, current distributor pricing, drop-in pin-compatible alternatives, and practical design notes not aggregated on any single manufacturer or distributor page.
10M25DAF256I7P - MAX 10 FPGA 25K LE 256-FBGA | Intel / Altera
The Intel (formerly Altera) MAX 10 10M25DAF256I7P is a non-volatile, low-power Field Programmable Gate Array (FPGA) from the MAX 10 family, integrating 25,000 logic elements, 1,134 Kbits of embedded RAM, and 178 general-purpose I/Os in a 256-pin FineLine BGA (FBGA) package. The device is fabricated on a 55 nm process, supports a 1.2 V core supply, and combines programmable logic with on-chip flash configuration memory that enables instant-on dual-configuration capability without an external boot PROM. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks and interconnect after manufacture. FPGAs sit in the programmable logic hierarchy between CPLDs (smaller, lower density) and ASICs (higher density but fixed-function). MAX 10 FPGAs specifically belong to the non-volatile, instant-on category, integrating configuration flash and an analog-to-digital converter (ADC) on-die, simplifying board design and reducing bill-of-materials cost in industrial and consumer applications. Key features of the 10M25DAF256I7P include 25,000 logic elements (LEs), 1,134 Kbits of embedded SRAM (M9K blocks), 4 embedded PLLs, 50 embedded multipliers (18x18), 1 dedicated 12-bit successive-approximation ADC block, and dual-configuration flash. The device supports LPDDR2, DDR3, and DDR3L external memory interfaces through hardened controllers, and exposes up to 178 general-purpose I/Os that support LVDS, SSTL, HSTL, LVCMOS, and LVTTL standards. The MAX 10 architecture pairs a logic array fabric with on-die flash, allowing the part to operate in single-chip instant-on mode. This eliminates the external configuration PROM typical of SRAM-based FPGAs, reducing board footprint and BOM. The integrated 12-bit ADC supports up to 16 analog inputs and 1 MSPS conversion rate, while the on-die temperature-sensing diode supports system thermal management. Hardened memory controllers and PLLs further reduce soft-logic resource consumption. Typical applications include industrial motor control and factory automation, video processing and image sensor bridging in surveillance and machine-vision cameras, low-cost I/O expansion and protocol bridging on embedded SBCs, automotive body electronics (non-safety) and infotainment subsystems, and portable test & measurement instruments. The combination of instant-on boot, integrated analog, and DSP-friendly multipliers makes MAX 10 a strong fit for cost-sensitive, mixed-signal designs. When designing with this device, route all 1.2 V core and 2.5 V analog supplies with wide power planes and bulk decoupling. The FBGA-256 package requires via-in-pad or microvia PCB processes and careful impedance control on DDR3 and LVDS pairs. Quartus Prime design software is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, same-brand MAX 10 drop-in alternatives drawn from the Site MPN list, and practical design notes not collected on a single manufacturer page, providing engineers with a single reference for sourcing and substitution.
10M25DAF484A7G - MAX 10 FPGA, 25K LE, 484-BGA | Intel
The Intel 10M25DAF484A7G is a member of the MAX 10 family of non-volatile FPGAs, delivering 25,000 logic elements, 691,200 bits of embedded SRAM, and 250 18x18 multipliers in a 484-ball BGA package. This automotive-grade variant supports industrial temperature range operation and integrates a hardened memory controller, PLLs, and ADCs on-chip, eliminating the need for external boot memory in most designs. The device targets cost-sensitive applications requiring low power, instant-on behavior, and integrated peripherals. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic functionality is defined after manufacturing through programmable configuration memory. The MAX 10 family sits within the broader programmable logic hierarchy (FPGA -> programmable logic -> programmable logic device (PLD) -> semiconductor) and represents Intel's non-volatile, low-power FPGA tier below Cyclone and Stratix families. FPGAs are typically used for parallel processing, custom interfaces, and glue logic where ASIC NRE costs are prohibitive or where design flexibility is required late in the product cycle. Key features include 360 user I/O pins supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), on-chip flash configuration memory, up to 16 global clock networks with 8 PLLs, integrated 12-bit SAR ADC (up to 1 Msps, 16 channels), and hard memory controllers (DDR3/LPDDR3 support). The device operates from a 1.2V core supply with 2.5V/3.3V tolerant I/O. The 484-BGA package enables high pin density for applications requiring many parallel interfaces or memory channels. From an architecture standpoint, MAX 10 devices combine a traditional LUT-based fabric with embedded SRAM blocks (M9K), 18x18 multiplier blocks, and a hard processor subsystem-free control plane. The non-volatile configuration cell eliminates boot PROM, reducing BOM cost and board area. The ADC block supports temperature sensor, voltage monitoring, and analog signal sampling without an external MCU's ADC. Typical applications include industrial motor control, automotive body electronics, LED video walls, industrial sensor hubs, machine vision pre-processing, and portable medical device interfaces. Designers choose MAX 10 when instant-on, embedded flash, and integrated ADC are valued over the highest logic density. When designing with this part, allocate 2.5V and 3.3V rails for I/O banks, route differential pairs with 100-ohm impedance, and place decoupling within 5mm of each power pin. Verify JTAG chain integrity before configuration to avoid bitstream load failures in production. This page synthesizes Intel MAX 10 family distributor pricing, same-package drop-in alternatives, and design notes not found in the standalone datasheet, providing decision context for engineers selecting between MAX 10 density points and Cyclone V equivalents.
10M25DAF484A7P - MAX 10 25K LE FPGA, 484-BGA, Automotive | Intel
The Intel 10M25DAF484A7P is a MAX 10 family field-programmable gate array (FPGA) with 25,000 logic elements, packaged in a 484-ball plastic BGA (S-PBGA-B484) for automotive temperature grade operation. Built on a 55 nm non-volatile process, the device integrates dual-configuration flash, embedded SRAM, 9-bit block memory, and DSP blocks alongside on-package analog-to-digital converters, eliminating the need for an external boot PROM. It targets glue-logic, I/O expansion, and motor-control tasks where instant-on non-volatile configuration is required. A field-programmable gate array (FPGA) is a semiconductor integrated circuit whose logic function is defined by a user-supplied configuration bitstream rather than at the factory. Within the broader digital IC hierarchy, an FPGA belongs to programmable logic devices (PLDs) and sits alongside CPLDs, ASICs, and microcontrollers. MAX 10 devices occupy the low-power, non-volatile segment of Intel's FPGA portfolio, providing instant-on behavior comparable to CPLDs while offering higher logic density and modern hard IP blocks such as PLLs, transceivers-free LVDS, and DDR3 memory controllers. Key features include 25,000 logic elements (LEs), 1,563 configurable logic blocks (CLBs), 360 user I/O pins (max), 1,728 Kbits of embedded memory, and automotive-grade temperature support from -40 C to +125 C junction (per A7 speed grade). The 484-ball BGA package is offered at industrial/automotive A7 speed grade with on-chip dual-boot flash, and the device supports LVDS, LVTTL, LVCMOS, SSTL, and differential I/O standards through per-pin dynamic OCT. The 10M25DAF484A7P integrates 2 PLLs, 1 hard ADC block (up to 12-bit, 1 MSPS), temperature-sensing diodes, and an embedded configuration flash that supports dual-boot and remote system upgrade. Internal regulators generate core voltages from a single 3.3 V or 1.8 V supply, simplifying board power design. DSP blocks deliver up to 150 MHz 18x18 multiply-accumulate, and the device supports Nios II soft-core processor implementation in fabric. Typical applications include automotive body electronics and infotainment bridging, industrial motor control and PLC I/O expansion, video processing and display controllers, and low-cost ASIC prototyping. Designers also use the 10M25 in system-on-module I/O aggregation, sensor hubs, and medical instrumentation where instant-on non-volatile logic is essential. When designing with this part, note that the 484-BGA requires careful PCB stack-up, microvia fan-out, and matched-length routing for LVDS pairs. JTAG, active serial, or dual-boot flash configuration modes are user-selectable, and Quartus Prime software is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor availability, drop-in alternative MPNs, and application guidance not found in the standalone datasheet, helping engineers shorten the sourcing and qualification cycle for MAX 10 designs.
10M25DAF484C7G - MAX 10 FPGA 25K LE, 484-BGA | Intel
The Intel (formerly Altera) 10M25DAF484C7G is a MAX 10 non-volatile FPGA integrating 25,000 logic elements, 1,728 Kbit embedded block RAM (M9K), and 66 embedded 18x18 multipliers into a single-chip, low-cost programmable logic device housed in a 484-ball FineLine BGA package. It supports up to 360 user I/O pins with multiple I/O standards including LVDS, LVCMOS, SSTL, and RSDS, and integrates a hardened ADC, dual configuration flash, and on-chip temperature-sensing diode for system monitoring. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect, designed to implement arbitrary digital logic after PCB assembly. Within the broader programmable logic taxonomy, FPGAs sit above CPLDs in density and below ASICs in NRE cost, making them ideal for low-to-medium volume designs. The MAX 10 family specifically targets non-volatile integration by embedding configuration flash on-die, eliminating the external boot PROM traditionally required by SRAM-based FPGAs. Key features of the 10M25DAF484C7G include 25K logic elements (LEs), 1,728 Kbits of embedded SRAM, 66 dedicated 18x18 hardware multipliers, four general-purpose PLLs, and integrated dual-configuration flash supporting instant-on and remote update. The 484-BGA package supports industrial temperature grades and is Pb-free / RoHS compliant per Intel's MAX 10 device family datasheet. Compared with discrete MCU + CPLD implementations, MAX 10 consolidates glue logic, custom state machines, and sensor interfacing into a single device. The MAX 10 architecture combines a fabric of adaptive logic modules (ALMs) with embedded hard IP, including the 12-bit successive-approximation ADC, voltage and temperature monitors, and a user flash memory (UFM) block for non-volatile parameter storage. This hardware integration reduces BOM cost and PCB area for industrial motor control, video bridging, and I/O expansion designs. Typical applications include industrial machine vision, motor and motion control, I/O expansion and protocol bridging, automotive driver-assistance subsystems, and consumer electronics requiring custom logic glue. The 484-BGA footprint provides sufficient I/O headroom for designs aggregating multiple buses such as Ethernet, USB, and parallel RGB video. When designing with this part, verify that PCB footprint and ball map match the F484 BGA standard (23x23 mm, 1.0 mm pitch per MAX 10 datasheet package specifications). The Quartus Prime design suite supports the device from Lite Edition onwards for compilation, place-and-route, and on-chip debugging via JTAG. This page synthesizes distributor pricing, drop-in alternatives from the same MAX 10 family, and practical Quartus Prime design notes not found in a single manufacturer table.
10M25DAF484C8G - MAX 10 FPGA 25K LE 484-BGA | Intel | CPLD/FPGA
The Intel (Altera) 10M25DAF484C8G is a MAX 10 Field Programmable Gate Array (FPGA) integrating 25,000 logic elements into a 484-ball FineLine BGA package, built on a 55 nm CMOS process and operating from a 1.2 V core supply. Per the Intel MAX 10 datasheet, the device integrates 25K logic elements (LEs), 360 user I/O pins, 1,638 Kbit of embedded SRAM, and a 55 nm process node, with a -8C speed grade targeting commercial 0 °C to 85 °C operation. The MAX 10 family uniquely integrates dual-configuration flash, instant-on support, and an optional 12-bit ADC block. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory/DSP slices that designers can reconfigure post-manufacture to implement arbitrary digital functions. In the broader system hierarchy, FPGAs sit between microcontrollers (fixed-instruction, low power) and ASICs (application-specific, highest density/perf), offering parallel hardware execution, deterministic latency, and hardware-level I/O customization. MAX 10 specifically targets glue-logic, I/O expansion, motor control, and low-cost system-on-module integration with the convenience of non-volatile configuration. Key features of the 10M25DAF484C8G include 25,000 logic elements, 1,638 Kbit embedded memory, integrated dual-configuration flash, optional 12-bit 1 MSPS ADC, up to 360 general-purpose I/O, and built-in PLLs. The F484 FineLine BGA at 23 × 23 mm with 1.0 mm pitch balances high I/O density with manageable PCB routing, while commercial temperature grade supports industrial and consumer designs without -I (industrial) or -A (automotive) screening. The MAX 10 architecture pairs a Logic Array Block (LAB) fabric of adaptive logic modules (ALMs) with MultiTrack interconnect, hardware multipliers, and DSP blocks. The on-die flash enables instant-on (<10 ms) single-chip operation, eliminating external boot memories. PLL-based clock management supports up to 16 global clocks with low jitter, and the ADC block (when present) provides analog signal capture without external components. Typical applications include industrial motor control and PLC I/O expansion, factory automation HMI controllers, low-cost video processing and bridging, prototyping platforms, and consumer appliance controllers. The integrated ADC makes it especially attractive for mixed-signal motor-drive and sensor-conditioning designs. When designing with the 10M25DAF484C8G, ensure adequate decoupling (100 nF + 10 µF per VCCIO/VCCINT bank) and follow Intel's pinout guidelines for the F484 package. Quartus Prime Lite/Standard edition supports the full MAX 10 family free of charge. The commercial -8C speed grade requires junction temperature stays within 0 °C to 85 °C ambient. This page synthesizes distributor pricing, same-family drop-in alternatives (10M25DAF484C7G, 10M25DAF484A7P, 10M25DAF484A7G), and practical design considerations not aggregated in any single manufacturer document.
10M25DAF484I7G - MAX 10 FPGA 25K LE 484-FBGA | Intel
The Intel 10M25DAF484I7G is a MAX 10 field-programmable gate array (FPGA) with 25,000 logic elements, 691,200 bits of embedded SRAM, and 360 user I/Os, packaged in a 484-ball FineLine BGA (FBGA) and supplied in tray. It belongs to the 10M25 density tier of the MAX 10 family, operating from a 1.2 V core supply with on-die voltage regulation, and integrates dual-configuration flash, an internal ADC block, and a hardened Nios II state-machine equivalent. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as PLLs, transceivers, memory controllers, and SERDES. FPGAs sit above microcontrollers in the programmable-logic hierarchy: they offer parallel, deterministic hardware execution at gate-level granularity and are reprogrammed via HDL synthesis. The MAX 10 family specifically targets low-cost, non-volatile applications where CPLDs, discrete microcontrollers, or small ASICs would otherwise be used. Key features of the 10M25DAF484I7G include 25,000 logic elements (LEs), 66 embedded 18 x 18 multipliers, 2 PLLs, 4 general-purpose timers, and an integrated 12-bit successive-approximation ADC with up to 17 external analog inputs. Dual on-chip configuration flash supports instant-on and dual-boot operation. The device is rated industrial (-40 C to +100 C ambient) and ships in lead-free, RoHS-compliant 484-FBGA packaging. Architecturally, the MAX 10 device uses a TSMC 55 nm embedded-flash process. This non-volatile process enables single-chip FPGA operation without an external boot memory, simplifying board layout and BOM. Hard memory controllers and the hardened ADC eliminate soft-IP overhead, leaving fabric resources available for application logic. Typical applications include industrial motor control, video bridging and image aggregation, I/O expansion and protocol bridging, factory automation I/O hubs, and portable instrumentation. Designers select MAX 10 when they need the I/O count and parallel performance of an FPGA but want the instant-on simplicity of a microcontroller. When designing with the 10M25DAF484I7G, plan the FBGA escape routing early. The 484-ball package requires a 4-layer minimum stack-up with microvia or via-in-pad capability on the inner rows. Verify the Quartus Prime software supports the I7 speed grade before committing to layout. This page synthesizes distributor pricing, drop-in MAX 10 alternatives, and practical board-level design guidance not found in the manufacturer datasheet alone.
10M25DCF256A7G - MAX 10 FPGA, 25K LE, 256-FBGA | Intel
The Intel 10M25DCF256A7G is a member of the MAX 10 family of non-volatile, single-chip, low-cost Field Programmable Gate Arrays (FPGAs) delivering 25,000 logic elements, 1,728 Kbits of embedded memory, and 178 maximum user I/Os in a 256-ball FineLine BGA package. Built on TSMC 55nm NOR flash technology, the device integrates a hardened dual-configuration flash, 12-bit 1 Msps ADC, and DSP blocks, targeting cost-sensitive industrial and consumer applications. Speed grade -7 and commercial temperature grade are encoded in the suffix. What is a MAX 10 FPGA? A MAX 10 FPGA is a non-volatile programmable logic device (PLD) from Intel that integrates a flash configuration memory directly on-chip, eliminating the need for an external boot PROM. Within the programmable-logic taxonomy, the MAX 10 sits between traditional CPLDs (limited logic, instant-on) and SRAM-based FPGAs (high logic density, require external boot). The broader hierarchy is: FPGA -> programmable logic device (PLD) -> digital semiconductor. Compared with Cyclone V FPGAs, MAX 10 parts deliver smaller logic capacity but lower system BOM cost and instant-on behavior. Key features of the 10M25DCF256A7G include 25,000 logic elements, 1,728 Kbits embedded SRAM, 4 PLLs, 45 embedded 18x18 multipliers, 178 user I/Os, 1.2 V core supply, and integrated dual-configuration flash supporting remote field upgrade. The device also integrates a 12-bit successive-approximation ADC with up to 1 Msps sample rate and 17 analog input channels. The 10M25 uses a TSMC 55nm embedded flash process combined with a look-up-table (LUT)-based logic fabric and dedicated DSP blocks (18x18 multipliers with pre-adder and accumulator). The hardened configuration flash enables < 100 ms instant-on, while the integrated ADC eliminates an external mixed-signal IC for sensor monitoring. Maximum core frequency reaches 450 MHz in commercial grade. Typical applications include industrial motor control, factory automation I/O expansion, low-cost video processing, sensor fusion in IoT edge nodes, and portable medical device front-ends. The combination of instant-on, integrated ADC, and small form factor makes the 10M25DCF256A7G well-suited to designs that need FPGA flexibility without external boot complexity. When designing with this device, plan for dual-voltage rails (3.3 V VCCIO and 1.2 V VCCINT), ensure each VCC pin has a 0.1 uF decoupling capacitor within 2 mm, and verify the Quartus Prime pinout for the 256-FBGA package before PCB layout. ADC analog supply (VCCA) requires a clean linear regulator. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, including cross-validation against Intel/Altera MAX 10 datasheets.
10M25DCF256C7G - MAX 10 FPGA, 25K LE, 256-BGA | Intel / Altera
The Intel / Altera 10M25DCF256C7G is a member of the MAX 10 family of non-volatile FPGAs, offering 25,000 logic elements, 178 (18x18) multipliers, and 691,200 bits of embedded SRAM in a 256-ball FineLine BGA (FBGA) package. Built on TSMC's 55nm embedded-flash process, the device integrates a single-chip instant-on architecture with on-die flash configuration memory, dual-configuration flash support, and integrated analog-to-digital converters that eliminate external ADC components for many sensing applications. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device (PLD) that allows hardware designers to configure digital logic, embedded multipliers, memory blocks, and high-speed I/O after manufacturing. MAX 10 sits within Intel's broader programmable logic hierarchy as a low-power, small-form-factor family optimized for bridging, I/O expansion, motor control, and industrial control applications. As a member of the FPGA & CPLD product category, it occupies the low-density end of Intel's FPGA portfolio, alongside the higher-density Cyclone and high-performance Stratix families. Key features of the 10M25DCF256C7G include up to 25000 logic elements (LEs), 178 (18x18) hardware multipliers for DSP operations, 2,112 Kbits of embedded SRAM, 25 Kbytes of user flash memory, and an integrated 12-bit ADC. The 256-FBGA package exposes 178 user I/O pins, supporting LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards. The device operates from a 1.2V core supply with support for 3.3V/2.5V LVCMOS I/O banks, making it suitable for mixed-voltage bridging scenarios. Architecturally, MAX 10 devices combine a lookup-table (LUT)-based logic fabric with embedded flash for instant-on behavior, eliminating the external boot PROM required by SRAM-based FPGAs. The dual-configuration flash subsystem enables field upgrades and A/B fallback configurations, while the embedded ADC and temperature-sensing diode support industrial monitoring functions without external analog components. Typical applications include industrial motor control (CNC, robotics, drives), factory automation and PLC I/O expansion, video bridging and image-sensor interfaces, automotive driver-assistance subsystems, low-density communications backplanes, and portable instrumentation. The 25K LE density positions this device for moderate-complexity glue logic, protocol bridging (I2C/SPI to parallel buses), and small DSP functions. When designing with the 10M25DCF256C7G, note that the 256-FBGA package is 17x17 mm with a 1.0 mm ball pitch; PCB layout requires high-density interconnect (HDI) stack-ups with laser-drilled microvias. Quartus Prime Prime Lite or Standard edition is required for design entry, synthesis, place-and-route, and programming. The 'C' speed grade and '7G' suffix indicate commercial temperature range (0C to +85C) with lead-free / RoHS-compliant lead finish. This product page consolidates distributor stock and pricing, parametric comparison with same-package alternatives in the MAX 10 family, and PCB/thermal design notes that are not covered in the manufacturer's datasheet alone.
10M25DCF256C8G - MAX 10 FPGA 25K LE 256-BGA | Intel / Altera
The Intel (formerly Altera) 10M25DCF256C8G is a member of the MAX 10 family of non-volatile FPGAs integrating 25,000 logic elements (LE), 178 user I/O pins, and 691 Kbits of embedded SRAM into a single-chip, low-cost programmable logic device. The part is offered in a 256-ball LBGA package (F256) with a commercial speed grade (C8) suitable for general-purpose digital logic integration. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured by the end user after manufacturing. FPGAs sit between fixed-function ASICs and microcontrollers in the design hierarchy: programmable logic device -> FPGA -> non-volatile FPGA -> MAX 10 family. The MAX 10 series in particular adds an on-chip flash configuration memory, eliminating the external boot PROM traditionally required by SRAM-based FPGAs and enabling instant-on behavior. Key features include dual-configuration flash, integrated ADC blocks, on-chip temperature sensing, and support for Nios II embedded processor soft cores. The 10M25 device provides 25K LE of logic fabric, 4 analog-to-digital converters, and dedicated hardware multipliers (18x18) suitable for DSP and motor-control tasks. The non-volatile architecture reduces BOM cost and board area in low-to-mid density designs. Typical applications include industrial control and motor drives, factory automation I/O expansion, video bridging and image processing front-ends, automotive driver assistance subsystems, and portable instrumentation. The 256-ball BGA package supports high I/O count designs while remaining compatible with mainstream PCB assembly processes. When designing with the 10M25, plan for the Quartus Prime toolchain, JTAG or AS configuration modes, and core/IO voltage sequencing. The commercial grade (C8) is intended for 0C to +85C ambient operation; for extended or industrial temperature ranges, consider the I-grade variant.
10M25DCF256I7G - MAX 10 FPGA, 25K LE, 256-BGA | Intel
The Intel / Altera 10M25DCF256I7G is a MAX 10 family field-programmable gate array (FPGA) integrating 25,000 logic elements, 1,563 LABs/CLBs, and 691,200 bits of embedded SRAM in a 256-ball fine-pitch BGA (F256) package. The device combines a non-volatile FPGA fabric with on-die flash configuration, an integrated ADC block, and 178 user I/O pins, all on a low-cost, single-chip platform. It is specified for the industrial temperature range (-40C to +100C) with the I7G speed/temperature grade. A MAX 10 FPGA is a non-volatile, low-power programmable logic device that belongs to the broader category of FPGAs (Field Programmable Gate Arrays) within the integrated circuit hierarchy: FPGA > programmable logic > digital IC > semiconductor. Unlike SRAM-based FPGAs that require an external boot PROM, MAX 10 devices store their configuration in on-chip flash, enabling instant-on behavior and a single-chip bill of materials. This makes MAX 10 useful as a glue-logic, control, and bridge companion to higher-end processors and ASICs. Key features of the 10M25DCF256I7G include 25K logic elements backed by 1,563 LABs, 691 Kbits of embedded RAM, 4 Mb of user flash memory, integrated 12-bit ADC with up to 17 channels, and 178 general-purpose I/Os. The device supports LVDS, LVTTL, LVCMOS, SSTL, and other single-ended and differential I/O standards. Embedded DSP blocks and PLLs provide flexible clock management and signal processing for motor control, sensor fusion, and industrial automation designs. The MAX 10 architecture uses a Look-Up Table (LUT)-based logic fabric with routing switch matrices, on-die flash for configuration and user data, and hard IP blocks such as the ADC and PLLs. The flash-backed configuration gives deterministic power-on behavior (sub-100 ms wake-up) and supports remote field upgrades through standard JTAG or passive serial interfaces, eliminating the need for a separate boot memory. Typical applications include industrial motor and motion control, factory automation I/O expansion, video bridging and display controllers, automotive body electronics and infotainment subsystems, and IoT edge nodes requiring deterministic boot. The integrated ADC also makes the device a strong fit for sensor aggregation and power-conversion control loops. When designing with this part, plan I/O bank assignments early: the F256 package exposes four or more I/O banks, each with its own VCCIO supply; mixing 3.3 V LVCMOS with 1.8 V LVCMOS in the same bank requires level-shifting or careful bank voltage planning. Quartus Prime software is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in alternatives within the MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.
10M25DCF484A7G - MAX 10 FPGA, 25K LE, 484-BGA | Intel
The Intel (formerly Altera) 10M25DCF484A7G is a MAX 10 FPGA with 25,000 logic elements, 1,728 Kbit embedded block RAM (Kb), and 360 maximum user I/O pins, packaged in a 484-ball FineLine BGA (FBGA-484) optimized for high I/O density designs. Operating from a 1.2 V core supply with integrated voltage regulator and configuration flash, this non-volatile FPGA delivers up to 25000 logic elements and 81 multipliers (18x18) for DSP pipelines, with up to 4 PLLs for clock management. A Field Programmable Gate Array (FPGA) is a programmable logic device that allows hardware designers to implement custom digital circuits after manufacturing, using configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as multipliers, block RAM, and PLLs. FPGAs occupy a tier in the digital logic hierarchy above simple microcontrollers and below custom ASICs, offering parallel processing capability, deterministic latency, and reconfigurability that makes them ideal for glue logic, I/O expansion, motor control, industrial communication protocols, and pre-ASIC prototyping. The MAX 10 family specifically targets low-power, non-volatile, cost-sensitive applications by integrating a configuration flash and an internal LDO voltage regulator on-chip, eliminating the need for external boot PROMs and regulators used in classic SRAM FPGAs. Key features of the 10M25DCF484A7G include dual-configuration flash with self-refresh, 12 Kbit user flash for system-level parameter storage, a built-in ADC block (up to 12-bit, 1 MSPS, 17 channels) for analog sensor monitoring, instant-on support from <10 ms, and -40C to +125C (automotive AEC-Q100 grade) operating range. The device integrates an analog-to-digital converter and temperature-sensing diode, supporting industrial and automotive mixed-signal designs without external ADC ICs. The 484-ball FBGA package exposes up to 360 user I/O pins, accommodating LVDS, LVCMOS, SSTL, and other interface standards via Intel Quartus Prime pin assignment. The MAX 10 architecture uses a 55 nm non-volatile process with embedded flash, supporting up to 300 MHz internal operation. Embedded memory is partitioned into 9 Kbit M9K blocks for distributed workloads, while 144 18x18 multipliers accelerate DSP algorithms such as FIR filters and motor-control transforms. The device supports external memory interfaces including DDR3, LPDDR2, and SRAM, controlled by four PLL-driven clock trees. Typical applications include industrial motor control drives, programmable logic controllers (PLCs), automotive driver-assistance systems, sensor fusion hubs, factory automation gateways, and low-cost video processing pipelines. The integrated ADC simplifies analog front-end design for battery management and process control, while non-volatile instant-on behavior suits safety-critical and power-sequenced designs. When designing with this device, verify that the FBGA-484 land pattern matches PCB manufacturing tolerances (typically 1.0 mm pitch), and confirm that the Quartus Prime device selection corresponds to speed grade -7 and the A7 commercial temperature option. Always check the latest Intel MAX 10 device handbook for I/O bank voltage constraints and configuration scheme selection. This page synthesizes distributor inventory, drop-in alternatives from the same MAX 10 family, and practical design notes not found in the manufacturer datasheet alone.
10M25DCF484C8G - MAX 10 FPGA 25K LE 484-BGA | Intel
The Intel (Altera) 10M25DCF484C8G is a MAX 10 field-programmable gate array integrating 25,000 logic elements, 691,200 bits of embedded SRAM, and a 360-pin interface in a 484-ball fine-pitch BGA package. It is part of Intel's non-volatile MAX 10 family, which uniquely combines FPGA logic with on-chip flash configuration memory, eliminating the need for an external boot PROM in most designs. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that engineers can customize after manufacturing. FPGAs sit between fixed-function ASICs and microcontrollers in the semiconductor taxonomy: programmable logic device -> FPGA -> reconfigurable logic IC -> semiconductor. They are widely used for digital glue logic, sensor aggregation, industrial control, motor drive, video bridging, and ASIC prototyping where parallelism and deterministic latency matter more than raw clock speed. Key features of the 10M25DCF484C8G include 25,000 logic elements, 16 dedicated 18x18 multipliers (DSP blocks), integrated configuration flash, on-chip ADC support, and 360 user I/O pins enabled by the F484 BGA package. It belongs to the 'C8' speed/temperature grade, which targets commercial-temperature operation (0C to 85C) at the -8 speed bin, balancing cost and timing margin for mainstream industrial and consumer designs. The MAX 10 architecture employs a look-up-table (LUT)-based logic fabric combined with a flash-programmable configuration plane, allowing instant-on behavior at power-up - a critical advantage over SRAM-based FPGAs that require external boot devices. The 484-BGA package also exposes a high number of general-purpose I/O and high-speed LVDS lanes, supporting parallel data capture and bridge applications. Typical applications include industrial machine vision, motor control and drive, factory automation backplanes, low-cost video processing, sensor fusion hubs, and portable test instrumentation where instant-on reconfigurable logic is valuable. The integrated flash and ADC blocks reduce bill-of-materials cost for distributed I/O nodes. When designing with the 484-BGA variant, pay close attention to PCB stack-up and via-in-pad rules for breakout routing. Confirm Quartus Prime device support (Cyclone V / MAX 10 device library) before committing the layout, and verify that the -C8 timing model matches your target fMAX for DSP and external memory interfaces.
10M25DCF484I7G - MAX 10 FPGA 25K LE 484-BGA | Intel
The Intel (formerly Altera) 10M25DCF484I7G is a member of the MAX 10 family of non-volatile FPGAs integrating 25,000 logic elements, 1,728 Kbits of embedded RAM, and a 5 Mb flash configuration block in a 484-ball FineLine BGA package. The device provides up to 360 user I/O pins with industrial temperature grade support (I7 suffix = -40C to +100C) and is built on a low-power 55 nm TSMC process that consumes roughly one-tenth the standby power of comparable CPLDs. A Field Programmable Gate Array (FPGA) is a reprogrammable digital logic device built from an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as PLLs, transceivers, multipliers, and memory controllers. FPGAs sit hierarchically within the broader taxonomy of programmable logic: CPLD (simpler, non-volatile, fast I/O) -> FPGA (higher density, SRAM or flash based) -> SoC FPGA (integrated CPU subsystem) -> ASIC (custom silicon). MAX 10 devices occupy the non-volatile low-end FPGA segment, replacing CPLDs and small ASICs in glue-logic, I/O expansion, and control-plane roles. Key features include single-chip instantiation through on-chip flash, integrated analog-to-digital converters (ADCs) on selected variants, instant-on support, and dual-configuration flash images for fail-safe field upgrades. The 25K LE density supports moderate glue logic, custom peripheral implementations, and small protocol bridging designs. Hard IP blocks include up to 4 PLLs, embedded SRAM blocks of 9 Kbits (M9K) totaling 1,728 Kbits, and multiplier blocks for DSP operations. The 10M25DCF484I7G uses a flash-backed configuration cell that retains the bitstream across power cycles, eliminating external boot PROMs. Internal dual-boot logic can store two images, allowing field reconfiguration and fail-safe rollback. The package is a 1.0 mm pitch FineLine BGA optimized for high I/O count with manageable PCB routing complexity. Typical applications include industrial motor control, factory automation I/O expansion, low-cost video bridging, LED display controllers, sensor aggregation nodes, and portable medical instrumentation. The integrated flash and analog blocks reduce BOM count and PCB footprint versus discrete CPLD-plus-ADC implementations. Designers should plan power distribution carefully. Decoupling must include 100 nF ceramic capacitors on every VCCIO/VCCA supply pin placed within 100 mils of the ball, plus bulk capacitance. Ensure JTAG chain integrity for in-system programming, and verify that the Quartus Prime pinout matches the chosen board layout before committing to the 484-BGA footprint. This page consolidates distributor pricing, drop-in alternative MAX 10 OPNs, and engineering notes beyond the manufacturer datasheet to accelerate board bring-up and sourcing decisions.
10M25SAE144C8G - MAX 10 FPGA 25K LE 144-LQFP | Intel
The Intel (formerly Altera) 10M25SAE144C8G is a non-volatile, low-cost MAX 10 Field-Programmable Gate Array (FPGA) with 25,000 logic elements (25K LE), 1,638 Kbit embedded SRAM (1,638 Kbits total memory), and 101 maximum user I/Os, housed in a 144-pin LQFP Exposed Pad (EQFP-144) package at 0.5 mm pitch. It integrates a 12-bit 1 Msps ADC, dual-configuration flash, and instant-on support, delivering single-chip programmable logic that eliminates external boot devices. What is a non-volatile FPGA? A non-volatile FPGA integrates its configuration memory on-chip, so it powers up instantly without an external boot PROM. The MAX 10 family belongs to Intel's low-cost programmable logic portfolio (FPGA -> programmable logic -> logic device -> semiconductor) and targets bridge, I/O expansion, motor control, and industrial sensor applications where instant-on and small footprint are critical. Key features include 25K logic elements, 54 embedded 18x18 multipliers, 66 PLLs (4 fractional PLLs), 1.638 Mbit user flash, single or dual power supply options, and 1 Msps 12-bit ADC with 17 analog inputs. The 144-LQFP package has a body size of 22 x 22 mm with exposed thermal pad for enhanced power dissipation. The device operates across industrial temperature ranges and supports JTAG programming. The MAX 10 architecture uses SRAM-based logic fabric backed by on-chip configuration flash, allowing dual boot from two flash images for field upgrades. The fabric includes LABs (Logic Array Blocks), MLABs (Memory LABs), and DSP blocks with hardware multipliers for signal-processing pipelines. Hardened IP blocks (PLL, ADC, flash) reduce die area and power compared to soft implementations. Typical applications include industrial motor control with hardware PWM, factory sensor aggregation with on-chip ADC, video bridging between parallel RGB and MIPI, automotive rear-view camera preprocessing, and consumer appliance HMI controllers. The exposed thermal pad supports continuous operation up to 100 MHz core frequencies in fanless enclosures. When designing with this device, use the Quartus Prime design suite and Intel FPGA Power and Thermal Calculator to validate junction temperature. Route all LVDS pairs with length-matched 100 ohm differential traces, and provide at least four PCB vias under the exposed pad to the inner ground plane for thermal relief.
10M25SAE144I7G - MAX 10 FPGA 25K LE 144-LQFP | Intel / Altera
The Intel (formerly Altera) MAX 10 10M25SAE144I7G is a non-volatile Field Programmable Gate Array from the MAX 10 family, integrating 25,000 logic elements, 1,728 Kbits of embedded memory (691,200 bits), and 144 EQFP pins in a 144-LQFP exposed-pad package. The device supports up to 101 user I/O pins and is fabricated on a 55 nm process node, targeting low-power, instant-on, single-chip FPGA applications. According to the Intel MAX 10 datasheet family, this OPN operates across industrial temperature range (-40C to +100C for I7G speed grade) with core voltage support for 3.0 V/3.3 V rails. A MAX 10 FPGA is a non-volatile, flash-based programmable logic device that combines look-up tables, embedded memory blocks, digital signal processing blocks, phase-locked loops, and on-chip analog-to-digital converters in a single die. Within the broader programmable logic taxonomy, MAX 10 sits below Cyclone 10 LP in cost and power, while above CPLDs (such as MAX V) in density and DSP capability, and is the lowest-cost Intel FPGA family with integrated ADC and instant-on flash configuration. Key features of the 10M25SAE144I7G include 25,000 logic elements, 45 embedded 18x18 multipliers, 4 analog-to-digital converters (12-bit, 1 MSPS), 1.2 V core voltage, and support for LVDS, LVCMOS, SSTL, and other single-ended I/O standards. The device also integrates user flash memory (up to 1.6 Mbits) for non-volatile data storage, dual configuration flash for instant-on operation, and an on-chip temperature-sensing diode. The 144-LQFP exposed-pad package (designator E144) provides up to 101 general-purpose user I/O with a 22x22 mm body footprint suitable for industrial through-hole-style reflow assembly. Typical applications for the 10M25SAE144I7G include industrial control and motor drive, machine vision pre-processing, factory automation I/O expansion, video bridging and display controllers, low-cost ASIC/ASSP replacement, and distributed I/O aggregation at the edge of industrial Ethernet networks. The combination of non-volatile flash configuration, integrated 12-bit ADC, and industrial temperature grade makes it well suited for designers who need a glue-logic device with analog sensing and instant-on behavior without an external configuration PROM. When designing with this part, ensure the exposed pad (EPAD) is soldered to a sufficiently large copper pour for thermal dissipation and ground integrity, since high-utilization designs in the E144 package can dissipate 1-2 W. Use Intel Quartus Prime (Lite or Standard edition) for synthesis, place-and-route, and timing closure; the MAX 10 device family is supported by Quartus Prime Lite at no additional cost for evaluation. The vertical-migration feature of the MAX 10 family allows seamless migration between density grades (10M02, 10M04, 10M08, 10M16, 10M25, 10M40, 10M50) within the same E144 footprint. This page synthesizes distributor pricing across DigiKey, Mouser, LCSC, and authorized Intel/Altera channels, cross-references drop-in same-package MAX 10 alternatives, and consolidates practical design guidance not found in the manufacturer datasheet.
10M25SCE144A7G - MAX 10 FPGA 25K LE, 144-LQFP | Intel | Altera
The Altera 10M25SCE144A7G is a non-volatile MAX 10 field programmable gate array with 25000 logic elements, 691200 bits of embedded user flash memory, and 101 maximum user I/O pins, housed in a 144-pin LQFP with exposed pad. It is fabricated on a 55nm CMOS process and supports a 1.2V core supply. This -A7G speed/temperature grade targets commercial 3.3V operation and is part of the MAX 10 family that integrates flash configuration, ADC, and DSP blocks on a single chip. A field programmable gate array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected by programmable interconnect. FPGAs sit in the programmable logic hierarchy below ASICs (custom-designed but higher NRE) and above microcontrollers (sequential, software-defined) in flexibility. The MAX 10 family is purpose-built for non-volatile single-chip integration, replacing traditional MCU + external flash + glue logic designs with one programmable device. Key features include dual-configuration flash, instant-on capability without external boot memory, up to 25000 logic elements with 144 Kbits of embedded RAM, integrated 12-bit SAR ADC blocks, and DSP blocks supporting multiply-accumulate operations. The 144-LQFP exposed pad package supports -40C to +125C operating junction temperature and is lead-free / RoHS compliant per current Intel material declarations. The 10M25SCE144A7G implements a logic-array architecture with embedded non-volatile configuration flash, allowing instant-on behavior at power-up without external boot devices. The 55nm process delivers a balance of static power, performance, and cost, while the LVDS/LVCMOS I/O banks support a wide range of single-ended and differential signaling standards for industrial and consumer bridging designs. Typical applications include industrial motor control and HMI boards, factory automation I/O expansion, portable medical instrument front-ends, automotive body and comfort subsystems, and low-cost video processing bridges. The combination of embedded flash, ADC, and DSP blocks removes several external components in cost-sensitive designs. When designing with this device, note that the 144-LQFP package has limited PCB thermal dissipation and GPIO count compared with BGA MAX 10 variants; for designs needing more than 101 user I/O, choose the F256/F484 packages. Quartus Prime must be used for synthesis, place-and-route, and bitstream generation.
10M40DAF256C7G - 40K LE MAX 10 FPGA, 256FBGA | Intel
The Intel 10M40DAF256C7G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) with 40,000 logic elements, 178 user I/Os, and 1,290,240 RAM bits, housed in a 256-ball FineLine BGA (FBGA-256) package. It is a commercial-temperature MAX 10 device with an operating range of 0C to +85C, a 1.2V core supply, and the industry-recognized MAX 10 instant-on capability. An FPGA is a semiconductor device containing programmable logic fabric that can be configured after manufacturing to implement digital circuits, from combinational logic to complex state machines and soft microcontrollers. The MAX 10 family is notable for integrating non-volatile configuration memory on-chip, which means no external SPI flash configuration device is required during board bring-up. In the system hierarchy, this FPGA sits between high-end ASSPs/SoCs and low-density CPLDs, allowing engineers to implement custom I/O, protocol bridging, and real-time control logic while retaining field-upgrade flexibility. Key features of the 10M40DAF256C7G include 40,000 logic elements, 178 user I/Os, and 1,290,240 RAM bits. The FBGA-256 package has a 17 mm x 17 mm body with 1 mm ball pitch, enabling compact PCB implementation. The device is marked as RoHS compliant in distributor listings and is supplied as non-volatile, configurable FPGA silicon from the MAX 10 portfolio. From an architecture perspective, the MAX 10 family combines FPGA fabric, embedded memory blocks, and non-volatile configuration flash in one die. The 256-ball package provides a practical balance between I/O count and board area. The 1.2V core supply simplifies power delivery planning compared to some older CPLD/FPGA devices that require multiple auxiliary supplies, while the many I/O pins support parallel interfaces, memory buses, and general-purpose control signals. Typical applications for this part include industrial motor control, factory automation, IoT edge gateways, display and vision interfaces, remote I/O concentrators, and test-and-measurement equipment. The combination of 40K logic elements and on-chip configurability makes it suitable for designs that need custom logic without the cost or board space of external configuration memory. One important design consideration is that the commercial-temperature device is rated only from 0C to +85C. For outdoor or cold-start environments, use the industrial-temperature variant, 10M40DAF256I7G, which has the same logic density and FBGA-256 package. Power-supply decoupling should target the 1.2V core rail with low-ESR ceramic capacitors distributed near the BGA package. This page synthesizes distributor availability, price references, drop-in alternative variants, and practical design notes that are not all consolidated in a single manufacturer datasheet, providing engineers with actionable data for sourcing and design decisions.
10M40DAF256C8G - MAX 10 FPGA 40K LE, 256-FBGA | Intel / Altera
The Intel / Altera (formerly Altera) 10M40DAF256C8G is a MAX 10 family non-volatile Field-Programmable Gate Array (FPGA) integrating 40,000 logic elements, 1,290,240 bits of embedded SRAM, and 178 general-purpose user I/O in a 256-ball FineLine BGA (FBGA-256) package. Built on a 55 nm process, the device combines LUT-based fabric, 9-bit analog-to-digital converter blocks, on-chip flash configuration memory, and instant-on support in a single chip, enabling glue-logic, control-plane, and low-power signal-processing designs without an external configuration PROM. What is a MAX 10 FPGA? The MAX 10 is Intel's small-to-medium-density non-volatile FPGA family that bridges CPLDs and high-end FPGAs. It belongs to the broader category hierarchy of programmable logic devices (PLD) -> field-programmable gate array (FPGA) -> non-volatile FPGA -> instant-on FPGA -> low-power FPGA. MAX 10 devices integrate dual-configuration flash, user flash memory, and analog blocks, which eliminates the need for a separate boot memory and makes them suitable for industrial control and motor-drive subsystems where deterministic power-up timing is required. Key features include 40K logic elements (LE), 1.29 Mbit embedded SRAM, 178 maximum user I/O pins, integrated 12-bit analog-to-digital converter (ADC) blocks, embedded SRAM, and DSP blocks. The 256-ball FBGA package uses a 1.0 mm ball pitch on a 17 x 17 mm body, supporting surface-mount assembly with standard JEDEC JEDEC MSL-3 moisture sensitivity handling. The 10M40DAF256C8G is implemented in a low-power 55 nm CMOS process and supports instant-on functionality because the configuration image is stored in on-chip flash. The integrated 9-bit sigma-delta ADC can sample up to twelve analog channels and is suited to multi-rail voltage and temperature monitoring without an external ADC IC. Hard memory controllers, PLLs, and global clock networks provide deterministic timing for industrial protocols. Typical applications include industrial motor control and factory automation, low-power IoT edge nodes with deterministic boot, video bridge and display controllers, automotive driver-assistance subsystems (non-safety-critical), and portable test-and-measurement instrumentation. Designers choose MAX 10 when instant-on, integrated analog, and single-chip simplicity outweigh the need for high-end transceivers. When designing with the 10M40DAF256C8G, pay attention to the FBGA-256 PCB land-pattern requirements: a 1.0 mm pitch BGA requires microvia or laser-drilled via technology for inner-row fan-out, and the JTAG and configuration pins must be pulled according to Intel MAX 10 Hardware Reference guidance. Quartus Prime design software is required for synthesis, place-and-route, and bitstream generation. This page consolidates distributor pricing, datasheet links, drop-in MAX 10 alternatives in the same FBGA-256 footprint, and practical PCB design notes not found in the manufacturer datasheet alone.
10M40DAF256I7G - MAX 10 FPGA 40K LE, 178 I/O, 256-FBGA | Intel
The Intel (Altera) 10M40DAF256I7G is a non-volatile MAX 10 Field Programmable Gate Array delivering 40,000 logic elements, 1,290,240 bits of embedded memory, and 178 user I/O in a 256-pin FineLine BGA (FBGA) package with 1.2 V core operation at up to 472.5 MHz internal performance. Built on a 55 nm TSMC process, this MAX 10 device integrates a dual-configuration flash, ADC blocks, and instant-on support in a single chip. What is a non-volatile FPGA? A non-volatile FPGA is a field-programmable gate array that retains its configuration bitstream in on-chip flash memory, eliminating the need for an external boot PROM and enabling instant-on operation within milliseconds of power-up. MAX 10 FPGAs sit at the lowest end of Intel's FPGA portfolio in terms of logic density but offer the highest integration of analog/mixed-signal features (12-bit SAR ADC, temperature sensors, PLLs), making them ideal for I/O expansion, glue-logic replacement, and low-cost control-plane designs. Within the broader taxonomy they belong to: FPGA -> programmable logic -> digital IC -> semiconductor. Key features of the 10M40DAF256I7G include 40K logic elements (LEs), 1,290,240 bits (M9K + M144K) embedded user RAM, 4 PLLs, 56 (18x18) multipliers for DSP, and an integrated hard IP block set including DDR3 external memory interfaces, 12-bit ADC, and PCIe Gen2 hard IP (x1/x2). The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with hot-socket support and on-die termination. Technically the 10M40DAF256I7G uses Intel's adaptive logic module (ALM) architecture with 8-input fracturable look-up tables, providing superior logic packing versus legacy 4-input LUT architectures. The on-chip flash stores two configuration images for fail-safe dual-boot, and the analog block integrates up to 16 channels of 12-bit 1 MSPS SAR ADC plus on-die temperature sensing diodes that connect to the FPGA fabric. Typical applications include industrial motor control, factory automation I/O concentrators, portable medical device displays, low-cost video bridging, automotive infotainment pre-processing, and PCIe endpoint cards. The 256-FBGA package also fits space-constrained designs requiring a BGA footprint with high pin count and good thermal dissipation via the exposed die paddle. When designing with this device, route the dedicated configuration/JTAG pins (nCONFIG, nSTATUS, CONF_DONE, TMS, TCK, TDI, TDO) to the board test access points and provide at least one 10 uF + one 100 nF decoupling pair per power rail (VCCINT, VCCA, VCCIO bank). The dual-boot flash allows in-field updates over PCIe or serial protocols, but designers must budget flash update time and provide an external watchdog to recover from corrupted images. This page synthesizes distributor pricing, drop-in pin-compatible alternatives from Intel's MAX 10 family, application-specific design notes, and comparison tables not consolidated in the manufacturer datasheet.
10M40DAF484C7G - MAX 10 FPGA, 40K LE, 484-BGA | Intel / Altera
The Intel / Altera 10M40DAF484C7G is a MAX 10 field-programmable gate array (FPGA) integrating 40,000 logic elements, 1,290,240 bits of embedded SRAM, and 360 user I/Os in a 484-ball FineLine BGA package. It belongs to the MAX 10 non-volatile FPGA family, which uniquely combines a flash-backed configuration memory with on-chip analog and digital peripherals, eliminating the need for an external boot PROM. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, and are used to implement custom digital logic, glue logic, signal conditioning, and compute pipelines that would otherwise require many discrete ICs. The MAX 10 family adds integrated features such as ADCs, PLLs, temperature-sensing diodes, and flash memory, blurring the line between FPGA and microcontroller-plus-SoC designs. Key features of the 10M40DAF484C7G include 40,000 logic elements (LEs), 1,290,240 bits (approximately 160 Kbytes) of embedded user SRAM, 4 embedded DSP blocks, and an integrated 12-bit ADC. The 484-ball FineLine BGA exposes 360 general-purpose user I/Os supporting LVDS, LVCMOS, and other single-ended I/O standards. The 'C7G' speed/grade suffix denotes a commercial temperature range device targeting cost-sensitive high-volume designs. On the technical side, the part uses Intel's TSMC 55 nm embedded flash process, which gives instant-on behavior (configuration loaded in microseconds from internal flash) and supports dual-image configuration for fail-safe field updates. The integrated hard IP blocks (PLLs, ADC, JTAG, and temperature sensor) operate independently of the fabric, allowing deterministic latency for I/O conditioning and analog sampling even before user logic is loaded. Typical applications for the 10M40DAF484C7G include industrial motor control, machine vision pre-processing, video bridging, I/O expansion and protocol translation (I2C, SPI, UART to LVDS or parallel), portable test instrumentation, and low-cost display controllers. The high I/O count (360) and 484-BGA footprint are well suited to designs that need to fan out to many external peripherals or high-speed parallel buses. When designing with this device, allocate at least four PCB layers for signal routing under the BGA and follow Intel/Altera's power-sequencing guidance. Decouple each bank of I/O supplies with 0.1 microfarad plus bulk ceramic capacitors placed as close to the balls as the breakout allows. Quartus Prime is the supported design toolchain for this part. This page synthesizes distributor pricing, package-level alternatives, and practical Quartus Prime design notes not present in the manufacturer datasheet.
10M40DAF672C7G - MAX 10 FPGA 40K LE 672-BGA | Intel
The Intel (formerly Altera) 10M40DAF672C7G is a MAX 10 non-volatile FPGA with 40,000 logic elements, 1,290,240 bits of embedded SRAM, and 500 user I/Os housed in a 672-ball FineLine BGA package. It is fabricated on a 55 nm TSMC process and operates from a 1.2 V core supply with on-chip voltage regulation for the configuration and flash blocks. According to the verified distributor data, the device belongs to the MAX 10 family and integrates dual-configuration flash, a 12-bit ADC block, and hardware multiplier/ DSP blocks. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that allows hardware designers to implement arbitrary digital circuits after PCB fabrication. The MAX 10 family sits at the intersection of CPLD and high-density FPGA: it offers instant-on non-volatile configuration via on-die flash, eliminating external boot memories. Within Intel's programmable-logic taxonomy, MAX 10 ranks as a low-power, low-cost, non-volatile FPGA suitable for I/O expansion, bridging, motor control, and industrial automation. Key differentiating features of the 10M40DAF672C7G include 40K logic elements (the largest density in the MAX 10 family), 1.29 Mbit user flash, 5,888 Kbit embedded SRAM, 4 PLLs, 2 I/O banks with LVDS support, and an integrated 12-bit 1 MSPS ADC with up to 17 analog inputs. The 672-FBGA package exposes 500 general-purpose I/Os - the highest user-IO count in the family - making it suitable for high-pin-count bridging and parallel-processing designs. The device is offered in the commercial C7 speed grade (about -40 °C to +85 °C) and supports JTAG, AS, and PS configuration modes. Architecturally, MAX 10 uses Logic Array Blocks (LABs) of 16 Adaptive Logic Modules (ALMs), each ALM containing an 8-input fracturable look-up table, two dedicated adders, and four registers. Embedded memory blocks (M9K) deliver true dual-port or single-port RAM, while DSP blocks support 18x18 signed multiplication. The on-die flash supports dual-boot images and instant-on operation, so the device behaves like a CPLD at power-up while retaining full FPGA flexibility. Typical applications include industrial motor control and drive interfaces, multi-protocol industrial bridging (EtherCAT, PROFINET, Modbus), video processing and image-sensor aggregation, factory-automation PLCs, and portable medical instrumentation. The high IO count also makes it attractive for LED video-wall scan boards and avionics display controllers where every pin matters. A practical design consideration: route LVDS pairs as length-matched 100 ohm differential nets and place the 1.2 V core decoupling capacitors as close as the FBGA's inner-row balls allow. Because the device integrates configuration flash, designers must still respect the dual-boot image boundary or risk bricking the part if the user image is corrupted during in-field updates. This page synthesizes distributor pricing, same-package MAX 10 drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, giving engineers a single decision-ready reference.