10M25DCF256C7G - MAX 10 FPGA, 25K LE, 256-BGA | Intel / Altera
MPN: 10M25DCF256C7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.65 | $346.50 |
| 100 | $29.2 | $2,920.00 |
| 500 | $25.4 | $12,700.00 |
| 1,000 | $22.1 | $22,100.00 |
| 3,000 | $18.75 | $56,250.00 |
Drop-in alternatives for 10M25DCF256C7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M25DAF256C7G
✅ Drop-In✓ In Stock
$38.75 / Unit
View Datasheet →10M25DAF256C8G
✅ Drop-In✓ In Stock
$45.3 / Unit
View Datasheet →10M25DAF256I7G
✅ Drop-In✓ In Stock
$60.3 / Unit
View Datasheet →10M16DCF256C7G
✅ Drop-In✓ In Stock
$11.75 / Unit
View Datasheet →10M16DAF256C7G
✅ Drop-In✓ In Stock
$13.8 / Unit
View Datasheet →10M25DCF256C7G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Family | MAX 10 (non-volatile FPGA) |
| Manufacturer | Intel (formerly Altera) |
| Process Technology | 55 nm TSMC embedded flash |
| Logic Elements (LE) | 25,000 |
| Embedded Memory | 691,200 bits (1,728 Kbits M9K / 86 M144K blocks) |
| Embedded Multipliers (18x18) | 178 |
| User Flash Memory | 25 Kbytes |
| User I/O Pins | 178 |
| Package | 256-ball FBGA, 17x17 mm, 1.0 mm pitch |
| Operating Temperature | 0C to +85C (Commercial) |
| Speed Grade | C7 |
| Core Voltage | 1.2 V |
| I/O Standard Support | LVCMOS, LVTTL, LVDS, SSTL, PCI, HSTL |
| Integrated ADC | 12-bit SAR ADC (1 Msps) |
| Configuration Method | On-die flash, dual-configuration support |
| RoHS / Lead-Free | Yes (lead-free finish, per '7G' suffix) |
| Mounting Type | Surface Mount (BGA) |
10M25DCF256C7G 256-ball fbga, 17x17 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for 10M25DCF256C7G (256-ball fbga, 17x17 mm, 1.0 mm pitch package) with 178 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M25DCF256C7G.
Refer to the datasheet for full pin configuration.
Estimated pin count: 178 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M25DCF256C7G is suitable for 6 applications: Industrial Motor Control, Factory Automation PLC I/O Expansion, Video Bridging and Image-Sensor Interfaces, Automotive Driver-Assistance Subsystems, Low-Density Communications Backplanes, Portable Test and Measurement Instrumentation.
Industrial Motor Control
The 10M25DCF256C7G is well-suited for industrial motor control because it combines 25K logic elements with 178 (18x18) hardware multipliers, enough to implement field-oriented control (FOC) loops for PMSM and AC induction motors. The integrated 12-bit SAR ADC digitizes current-sense amplifier outputs at 1 Msps, eliminating an external ADC for three-phase current sampling. MAX 10's 256-FBGA variant exposes 178 user I/O pins, enabling direct interfacing to opto-isolated gate drivers, incremental encoders (QEP), Hall sensors, and RS-485/RS-232 service ports without external muxing. The on-die flash supports instant-on field upgrades of motor-control firmware, critical for production-line servicing.
Recommended
Factory Automation PLC I/O Expansion
In PLC and distributed-I/O subsystems, the 10M25DCF256C7G provides 178 user I/O pins across its 256-FBGA package, enough to fan out 32-64 isolated digital I/O channels with PWM and counter functions. The MAX 10 instant-on behavior (sub-10 ms configuration from on-die flash) ensures deterministic boot for fail-safe I/O startup, a requirement in IEC 61131-3 PLC architectures. Dual-configuration flash allows A/B firmware fallback for safe field upgrades. The 1.2V core with 3.3V LVCMOS I/O bank compatibility supports direct interfacing to 24V-tolerant opto-isolators with simple resistive dividers.
Recommended
Video Bridging and Image-Sensor Interfaces
The 10M25DCF256C7G's LVDS I/O support and 178 user I/O count make it suitable as a bridge between CMOS image sensors, MIPI-CSI receivers, parallel RGB displays, and HDMI/DVI transmitters. 178 (18x18) multipliers enable real-time image scaling, color-space conversion (YUV to RGB), and simple edge-detection preprocessing at low frame rates. The MAX 10 256-FBGA variant's 1.0 mm ball pitch and 17x17 mm footprint fit compact vision modules used in machine-vision cameras and entry-level industrial inspection.
Recommended
Automotive Driver-Assistance Subsystems
For entry-level ADAS functions such as rear-view camera processing, ultrasonic-sensor fusion, and LED-headlight matrix control, the 10M25DCF256C7G provides the logic density, multiplier count, and I/O bandwidth required. The 25K LEs and 178 (18x18) multipliers can implement simple computer-vision kernels (Sobel, Canny edges) at VGA resolution. However, for AEC-Q100 qualified operation, engineers should select the industrial-grade 10M25DAF256I7G instead, which extends the temperature range to -40C to +100C junction. The MAX 10 dual-configuration flash supports fail-safe OTA firmware updates.
Recommended
Low-Density Communications Backplanes
In telecom and industrial backplanes, the 10M25DCF256C7G serves as a low-latency glue-logic device, implementing protocol bridging between I2C/SPI/UART management buses and parallel FPGA or ASIC interfaces. 25K LEs accommodate simple state machines, packet buffers in distributed RAM, and clock-domain-crossing FIFOs. The 256-FBGA variant's 178 user I/O count allows direct connection to backplane connectors with multiple parallel data buses, LVDS SERDES lanes, and clock distribution networks without external bus switches.
Recommended
Portable Test and Measurement Instrumentation
Portable T&M instruments benefit from the 10M25DCF256C7G's combination of low static power (compared to SRAM-based FPGAs without a boot PROM) and integrated ADC for direct sensor signal conditioning. The MAX 10 instant-on flash configuration reduces bill-of-materials by eliminating external SPI boot PROMs, reducing PCB area in handheld oscilloscopes, data loggers, and field multimeters. 25K LEs and 178 (18x18) multipliers can implement FIR filters, FFT engines, and statistical signal processing for measurement front-ends. The 256-FBGA package suits multi-layer portable instrument PCBs.
Recommended
Recommended Products Summary
Engineering reference data for 10M25DCF256C7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M25DAF256C7G | 10M25DAF256C8G | 10M25DAF256I7G | 10M16DCF256C7G | 10M16DAF256C7G |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 256-ball FBGA (17x17 mm, 1.0 mm pitch) | 256-ball FBGA (17x17 mm, 1.0 mm pitch) - same | 256-ball FBGA (17x17 mm, 1.0 mm pitch) - same | 256-ball FBGA (17x17 mm, 1.0 mm pitch) - same | 256-ball FBGA (17x17 mm, 1.0 mm pitch) - same | 256-ball FBGA (17x17 mm, 1.0 mm pitch) - same |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 16,000 (-36%) | 16,000 (-36%) |
| (18x18) Multipliers | 178 | 178 | 178 | 178 | 45 (-75%) | 45 (-75%) |
| Embedded Memory (bits) | 691,200 | 691,200 | 691,200 | 691,200 | 270,000 (-61%) | 270,000 (-61%) |
| Speed Grade | C7 (commercial) | C7 | C8 (faster) | I7 (industrial) | C7 | C7 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C | 0C to +85C |
| Integrated ADC | 12-bit SAR, 1 Msps | 12-bit SAR, 1 Msps | 12-bit SAR, 1 Msps | 12-bit SAR, 1 Msps | 12-bit SAR, 1 Msps | 12-bit SAR, 1 Msps |
Key Differentiators
- Higher logic capacity than 10M16 256-FBGA variants (vs 10M16DCF256C7G)
- Commercial temperature grade optimization (vs 10M25DAF256I7G)
- C7 speed grade for typical timing closure (vs 10M25DAF256C8G)
Design Notes
Estimated: the 256-ball FBGA package is 17x17 mm with a 1.0 mm ball pitch; PCB design requires an HDI stack-up with laser-drilled microvias. Use a 4-1-4 (4-layer top/bottom, 1 core) or 6-layer stack-up with 1 oz copper. Place 0.1uF decoupling capacitors on every VCCIO/VCC/VCCA pin, plus bulk 10uF capacitors on each power rail within 5 mm of the BGA. Matched-length routing is required for LVDS pairs; reference Intel AN 532 for MAX 10 PCB layout guidelines.
Estimated: MAX 10 devices in the 256-FBGA package typically dissipate 1-3 W in typical industrial control applications. Theta-JA for this package is approximately 15 C/W on a JEDEC 4-layer test board. Continuous operation at industrial temperatures (-40C to +100C junction) requires the 'I' suffix variant (e.g., 10M25DAF256I7G); commercial 'C' grade parts are rated to 0C-85C ambient only.
Do not confuse the 10M25DCF256C7G with the 10M25DAF256C7G without consulting the MAX 10 ordering code PDF - the DC vs DA suffix difference is feature-related (configuration flash, ADC channel count, and PLL availability vary). Always run Quartus Prime fitter pre-checks to verify pinout compatibility. The 'G' suffix indicates lead-free finish; pre-'G' parts are Pb-bearing and not RoHS-compliant.
Compliance Information
The '7G' suffix per Intel MAX 10 ordering guide indicates lead-free / RoHS-compliant finish. Commercial 'C' temperature grade; industrial 'I' grade parts (e.g., 10M25DAF256I7G) required for -40C operation. AEC-Q100 qualification is not applicable for non-automotive-grade ordering codes; check with Intel for AEC-Q100 status if needed.
