10M16SCU324I7G - MAX 10 FPGA, 16K LE, 324-LFBGA | Intel
MPN: 10M16SCU324I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $87.5 | $87.50 |
| 10 | $78.2 | $782.00 |
| 100 | $68.9 | $6,890.00 |
| 500 | $61.4 | $30,700.00 |
| 1,000 | $54.8 | $54,800.00 |
10M16SCU324I7G Overview
What is a MAX 10 FPGA? MAX 10 is Intel's (formerly Altera's) low-power, non-volatile FPGA family targeted at bridging the gap between CPLDs and traditional SRAM FPGAs. As a hybrid device in the broader FPGA hierarchy (CPLD < MAX 10 < Cyclone < Arria < Stratix), MAX 10 combines instant-on dual-configuration flash with FPGA fabric, embedded multipliers, block RAM, and analog peripherals, making it well-suited for industrial motor control, video bridging, I/O expansion, and protocol bridging.
Key features include 16,000 logic elements, 549 Kbits M9K block RAM, 45 embedded 18x18 multipliers, a 12-bit SAR ADC with up to 16 channels and 1 MSPS throughput, and a built-in temperature sensing diode. The U324 package exposes 246 user I/Os supporting LVDS, LVCMOS, SSTL, and differential I/O standards at up to 400 MHz, with per-pin dynamic phase alignment. The device also integrates user flash memory (up to ~736 Kbits for 10M16) for user data storage alongside the configuration image.
The MAX 10 architecture uses logic array blocks (LABs) of 16 LEs, an interconnect fabric of row/column multiplexers, and DSP blocks of 18x18 multipliers, all clocked by up to 16 global clock networks plus 4 PLLs. Compared with traditional SRAM FPGAs, the integrated configuration flash eliminates external boot memory and provides dual-boot capability, while reducing board complexity for cost-sensitive industrial designs.
Typical applications include industrial machine vision bridges, factory automation controllers, video format conversion, motor drive control, portable instrumentation, and consumer display interface bridges. The integrated ADC simplifies current/voltage monitoring loops, and the dual-boot flash enables field-recoverable firmware in remote installations.
When designing with this device, pay close attention to bank I/O voltage grouping - the U324 package divides I/O into eight banks, each with its own VCCIO rail, requiring level shifting between mixed-voltage interfaces. Also budget power dissipation carefully: dynamic power scales with toggle rate and clock frequency, so Quartus Prime PowerPlay early power estimation is recommended before PCB layout.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical Quartus Prime design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for 10M16SCU324I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10M16SCU324I7G (same form factor and footprint) — differing in Package, Mounting Type, Global Clock Networks, Logic Elements, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M16SCU324C8G
✅ Drop-In📋 Reference alternative (not in catalog)
10M16SCU324A7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M08SCU324I7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M25SCU324I7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M16SAU324I7G
✅ Drop-In✓ In Stock
$32.4 / Unit
View Datasheet →10M16DCU324I7G
✅ Drop-In✓ In Stock
$40.1 / Unit
View Datasheet →10M16SCU324I7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 16,000 |
| Adaptive Logic Modules (ALM) | N/A (MAX 10 uses LE architecture) |
| M9K Block RAM | 549 Kbits |
| Embedded 18x18 Multipliers | 45 |
| User Flash Memory | ~736 Kbits (approx, 10M16) |
| Maximum User I/O | 246 |
| Package | 324-LFBGA (U324) |
| Process Technology | 55 nm TSMC NOR flash + SRAM |
| Core Voltage (VCCINT) | 1.2 V |
| Configuration Method | On-chip flash, dual-boot capable |
| PLLs | 4 |
| Global Clock Networks | 16 |
| Integrated ADC | 12-bit SAR, up to 16 channels, 1 MSPS |
| Temperature Range | -40C to +100C (industrial, I7G) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
| Design Software | Intel Quartus Prime (Standard/Pro/Lite) |
10M16SCU324I7G 324-lfbga (u324) Pin Configuration Guide
Pin configuration for 10M16SCU324I7G (324-lfbga (u324) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M16SCU324I7G.
Refer to the datasheet for full pin configuration.
Typical Applications
10M16SCU324I7G is suitable for 6 applications: Industrial Motor Control, Video Interface Bridging, Factory Automation Protocol Bridge, Portable Test & Measurement, Medical Patient Monitoring, LED Lighting & Display Controllers.
Industrial Motor Control
The 10M16SCU324I7G fits industrial motor-control designs because its 16,000 LEs, 45 embedded 18x18 multipliers, and integrated 12-bit SAR ADC enable field-oriented control (FOC) loops for 3-phase BLDC and PMSM motors in a single chip. With 246 user I/Os in the U324 package, it directly interfaces to power-stage gate drivers (e.g. gate drivers above 600V), Hall/encoder feedback, and isolated communication links such as RS-485 or CAN. The on-chip flash eliminates external boot PROM, enabling fast power-on determinism required for safety-critical motion sequences, while the ADC's 1 MSPS throughput samples shunt currents at typical 20 kHz PWM rates.
Recommended
Video Interface Bridging
The 10M16SCU324I7G handles video bridging between MIPI CSI-2, LVDS, RGB parallel, and HDMI source/sink interfaces. Its 549 Kbits of M9K block RAM buffers active scan lines, while 45 multipliers perform color-space conversion (YUV to RGB) and scaling in real time at 1080p60. The U324 package's 246 user I/Os accept wide parallel video buses up to 24 bits at 150 MHz pixel clock, with on-chip PLLs generating independent sampling clocks for input and output domains. Compared with discrete ASSPs, the FPGA's reconfigurability lets OEMs update protocol support after PCB freeze.
Recommended
Factory Automation Protocol Bridge
The 10M16SCU324I7G bridges between industrial protocols (Modbus RTU, PROFINET, EtherCAT, EtherNet/IP, CANopen) and legacy serial or parallel machine interfaces. Its 16K LEs hold multiple soft-core protocol stacks simultaneously, and 549 Kbits block RAM serves as packet buffer for real-time Ethernet. The integrated ADC monitors 4-20 mA loop current from field sensors without an external analog front end, while the industrial temperature grade (-40C to +100C) suits cabinet-mounted PLCs. The non-volatile flash supports dual-boot fail-safe firmware update across plant-wide rollouts.
Recommended
Portable Test & Measurement
The 10M16SCU324I7G suits portable instruments because its non-volatile instant-on configuration eliminates boot delay, while the integrated ADC and 16K LEs implement real-time DSP for signal capture, FFT, and digital filtering at sample rates to 1 MSPS. With 246 user I/Os and 4 PLLs, the FPGA drives TFT displays, touch controllers, USB, and isolated serial links from a single chip. Industrial temperature rating plus on-chip temperature-sensing diode enables self-calibration over the operating range, reducing factory trim cost.
Recommended
Medical Patient Monitoring
The 10M16SCU324I7G fits patient-monitoring peripherals (non-life-support) where on-chip ADC samples ECG, SpO2, or temperature analog front ends, and the FPGA fabric runs DSP filters and QRS detection algorithms. The non-volatile flash boots deterministically for IEC 62304 software-class verification, and 45 hardware multipliers handle real-time digital filtering at low latency. Designers should note this device is not AEC-Q100 and not IEC 60601 qualified - additional system-level compliance work is required for medical end equipment.
Recommended
LED Lighting & Display Controllers
The 10M16SCU324I7G drives large-pixel-count LED walls and architectural lighting fixtures where each pixel needs independent PWM and color-correction data. The 246 user I/Os in U324 fan out 24-bit-per-pixel data to dozens of daisy-chained LED drivers at refresh rates above 1 kHz, while 45 multipliers perform gamma correction and temperature-compensation math in real time. Industrial temperature rating plus integrated temperature-sensing diode enables closed-loop LED brightness compensation across outdoor installations.
Recommended
Recommended Products Summary
Engineering reference data for 10M16SCU324I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M16SCU324C8G | 10M16SCU324A7G | 10M08SCU324I7G | 10M25SCU324I7G | 10M16SAU324I7G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 324-LFBGA (U324) | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same |
| Logic Elements | 16,000 | 16,000 | 16,000 | 8,000 | 25,000 | 16,000 |
| Block RAM (M9K) | 549 Kbits | 549 Kbits | 549 Kbits | 378 Kbits | 819 Kbits | 549 Kbits |
| 18x18 Multipliers | 45 | 45 | 45 | 24 | 66 | 45 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | I7 (fastest industrial) | C8 | A7 | I7 | I7 | I7 |
| User I/O (U324) | 246 | 246 | 246 | 246 | 246 | 246 |
| Configuration Flash | Single image, standard size | Single image, standard | Single image, standard | Single image, standard | Single image, standard | Dual image, standard |
Key Differentiators
- 16K LE mid-range density with full U324 I/O bandwidth (vs 10M08SCU324I7G)
- Cost-optimized alternative to 10M25 (vs 10M25SCU324I7G)
- Standard flash vs dual-image 'SAU' variant (vs 10M16SAU324I7G)
Design Notes
The U324 LFBGA package uses 0.8 mm ball pitch on a 15x15 mm body, requiring microvia (HDI) PCB stackup with at least a 1-2-1 or 2-2-2 build-up. Per Intel's MAX 10 Hardware Design Guidelines, escape the inner balls through a 4-layer PCB using 0.2 mm laser-drilled microvias, fan out the outer two ball rows with dogbone fanout to 0.4 mm-pitch BGAs, and place eight 0402 decoupling capacitors (one per I/O bank VCCIO + VCCINT + GND) within 2 mm of the BGA. Avoid routing signal traces under the BGA - use inner layers only for power and ground planes with stitched thermal vias.
The 10M16SCU324I7G requires three rails: VCCINT (1.2 V core), VCCA (2.5 V analog for PLLs/ADC), and VCCIO (1.2/1.5/1.8/2.5/3.3 V per bank). Per Intel's MAX 10 power tree, use a dedicated LDO for VCCA (the ADC reference requires low-noise supply; recommended TPS7A47xx or equivalent 4.17 uVrms-noise LDOs). All VCC pins must be connected - leaving any VCCINT ball floating prevents configuration. Add 100 nF + 10 uF decoupling on each rail, distributed around the BGA perimeter within 5 mm.
Three pitfalls dominate MAX 10 bring-up failures: (1) the JTAGEN or CONFIG pins are shared with user I/O on some banks - check Intel's pin connection guidelines before assigning these pins to user logic; (2) the on-chip flash programming requires JTAG or AS mode and a specific 30 MHz to 50 MHz clock; if your board routes the configuration clock to a wrong pin, Quartus Programmer reports failure with cryptic CRC errors; (3) unused I/O pins default to tri-stated input with weak pull-up - explicitly set them to output driving ground in your design to avoid excess supply current from floating inputs.
Compliance Information
RoHS and REACH compliance per Intel MAX 10 product page. Not AEC-Q100 qualified; not recommended for automotive safety-critical use without additional system-level qualification.
