FPGA & CPLD
Products (6352)
10M16DAF484I7P - MAX 10 FPGA, 16K LE, 484-BGA | Intel / Altera
The Intel (formerly Altera) 10M16DAF484I7P is a non-volatile MAX 10 field-programmable gate array (FPGA) with 16,000 logic elements (LE), 549 kbit of embedded memory, and 320 user I/Os, packaged in a 484-ball FBGA. Operating from a 1.2 V core supply, the device integrates dual-configuration flash, an on-chip ADC, and DSP blocks in a low-power, instant-on architecture. A field-programmable gate array (FPGA) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks (LEs/ALMs), programmable interconnect, and dedicated hard IP such as multipliers, memory blocks, and transceivers. FPGAs sit above microcontrollers and ASICs in the design flexibility hierarchy: more flexible than ASICs, faster than MCUs at parallel DSP tasks, and lower power than GPUs at deterministic logic. The MAX 10 family adds non-volatile configuration, eliminating external boot PROMs. Key features of the 10M16DAF484I7P include 16,000 logic elements, 549 kbit embedded SRAM, 320 maximum user I/Os, 45 18x18 multipliers, dual ADCs with up to 12-bit resolution and 1 MSPS sampling, integrated PLLs, and embedded flash for instant-on operation. The industrial-grade -40C to +100C temperature range (I7 suffix) supports factory, automotive, and harsh-environment deployments. Technically, the device uses a TSMC 55 nm embedded-flash process and a Logic Element (LE) fabric with adaptive logic modules (ALMs), 9 Kbit M9K memory blocks, and a hard memory controller that supports DDR3/LPDDR2 external memories. The integrated ADC operates in parallel with logic, enabling closed-loop analog/digital control without external parts. Typical applications include industrial motor control and PLCs, video bridge and display controllers, automotive driver-assistance systems, portable instrumentation, factory automation I/O expansion, and low-cost ASIC prototyping where instant-on and small footprint matter. When designing in the 484-FBGA, allocate a 1.2 V core rail with sub-3% tolerance and matched-length DDR traces to maintain signal integrity; the ADC reference must be low-noise to avoid coupling into analog inputs. This page synthesizes live distributor pricing, package-matched drop-in alternatives from the MAX 10 family, and PCB-level design notes not contained in the Altera MAX 10 datasheet.
10M16DAU324C8G - MAX 10 FPGA 16K LE 246 I/O UBGA-324 | Intel / Altera
The Intel / Altera 10M16DAU324C8G is a non-volatile MAX 10 field-programmable gate array (FPGA) integrating 16,000 logic elements, 562,176 bits of embedded memory, and 246 general-purpose user I/O in a 324-ball Ultra FineLine BGA (UBGA) package. It is fabricated on a low-power CMOS process and operates from a 1.2 V core supply with on-chip voltage regulation for the configuration and flash subsystems, making it a single-chip, instant-on programmable logic device suitable for industrial, automotive, and consumer applications. A MAX 10 FPGA is a low-cost, non-volatile family of programmable logic devices that combine an FPGA fabric, embedded flash configuration memory, analog-to-digital converters (ADCs), and on-chip dual-configuration flash on a single die. It belongs to the broader hierarchy of programmable logic devices (PLD), sitting between simple CPLDs and high-performance FPGAs. MAX 10 devices target glue-logic, bridge, motor control, and I/O expansion designs that benefit from instant-on behavior without an external boot flash. Key features include 16,000 logic elements (LEs), 562,176 bits of user flash memory (UFM) and embedded SRAM, up to 246 user I/O pins, integrated 12-bit SAR ADCs, on-die temperature-sensing diode, and hardened DDR3 memory interface support. The device supports up to 1.6 Gbps LVDS performance per pair, dual-boot configuration from internal flash, and a hardened Nios II soft-processor-ready fabric. The architecture combines a look-up-table (LUT)-based logic fabric with embedded M9K memory blocks, 18x18 multipliers, and a tightly integrated analog and power-management block. Dual-configuration flash allows field upgrades and fail-safe fallback, while the embedded ADC enables precision analog sampling without an external mixed-signal IC. Typical applications include industrial motor control, sensor fusion pre-processing, video bridging, low-cost ASIC prototyping, USB Type-C interface expansion, and factory automation I/O concentrators. The integrated ADC is also widely used for thermal and current monitoring in white-goods and motor-drive systems. When designing with this device, allocate adequate BGA breakout routing and thermal copper on the 324-UBGA footprint. Use the Quartus Prime design suite and verify pin assignments against the device-specific pin-out file before PCB fabrication, since UBGA ball mapping differs across MAX 10 density grades. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone, giving procurement and engineering teams a single reference for evaluating the 10M16DAU324C8G for new designs and re-sourcing.
10M16DAU324I7P - MAX 10 FPGA 16K LE 246 I/O | Intel | 324-LFBGA
The Intel (formerly Altera) 10M16DAU324I7P is a MAX 10 Field Programmable Gate Array (FPGA) with 16,000 logic elements, 246 user I/Os, 549 kbit embedded memory, and 246 18x18 multipliers, housed in a 324-pin LFBGA (UBGA-324) package. It is the industrial temperature grade (-40C to +100C), speed grade 7 variant of the MAX 10 family with non-volatile flash configuration and integrated analog-to-digital converters. An FPGA (Field Programmable Gate Array) is a class of programmable logic device that allows hardware designers to configure digital logic blocks and interconnects after manufacture. Within the broader semiconductor taxonomy, FPGAs sit above ASICs and CPLDs in flexibility but below microcontrollers in ease of programming. The MAX 10 family specifically integrates a hard processor subsystem, dual-configuration flash, and analog blocks onto a single die, targeting cost-sensitive industrial, automotive, and IoT applications. Key features of the 10M16DAU324I7P include 16,000 logic elements organized into Adaptive Logic Modules (ALMs), 549 kbit of embedded SRAM, 2.5 Mb of user flash memory, and 246 GPIO pins supporting LVDS, LVCMOS, SSTL, and other I/O standards. The device operates from a 1.2 V core supply with I/O banks supporting 1.2V to 3.3V, and integrates a hard Nios II processor interface for soft-core SoC designs. The MAX 10 architecture uses TSMC 55 nm embedded flash process technology, combining LUT-based logic fabric with hard IP blocks including PLLs, ADC, and temperature-sensing diodes. This monolithic integration eliminates external boot memory and reduces BOM cost. The dual-boot flash supports field upgrades with zero downtime through the On-Line Update feature. Typical applications include industrial motor control, factory automation I/O expansion, video bridging, low-cost ASIC replacement, sensor fusion, and portable instrumentation. The integrated 12-bit ADC simplifies analog front-end designs. When designing with this part, allocate sufficient PCB area for the 0.8 mm pitch LFBGA-324 footprint and route all power rails with adequate decoupling. The Quartus Prime design tool supports the full MAX 10 family with unified place-and-route. This page synthesizes distributor pricing, same-family drop-in alternatives from the Site MPN list, and practical board-level design notes not collected in a single place on the Intel datasheet.
10M16DCF256A7G - MAX 10 FPGA, 16K LE, 178 I/O, 256-FBGA | Intel
The Intel (formerly Altera) 10M16DCF256A7G is a member of the MAX 10 family of non-volatile FPGAs integrating 16,000 logic elements, 562,176 bits of embedded RAM, and 178 general-purpose I/Os in a 256-ball FineLine BGA (FBGA) package fabricated on a 55 nm process node. The device supports a maximum internal operating frequency of 472.5 MHz and is supplied from a 1.2 V core rail with on-chip voltage regulation. Industrial-grade temperature operation, dual-configuration flash, and integrated analog/digital blocks distinguish the MAX 10 family from prior MAX generations. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, allowing engineers to implement custom digital logic after PCB fabrication. Within the broader taxonomy, the MAX 10 sits at the junction of programmable logic devices (PLD) and system-on-chip (SoC) integration, offering non-volatile configuration, on-chip flash, ADC blocks, and DSP support - bridging entry-level CPLDs and high-performance SoC FPGAs like Cyclone V or Stratix 10. Key features include 16K logic elements (LE), 504 Kbit (Kb) embedded SRAM, 1.0 Mb user flash memory, dedicated 18 x 18 multipliers for DSP, and integrated ADCs. The 256-FBGA package exposes 178 maximum user I/Os, supporting LVDS, LVCMOS, SSTL, and other single-ended/differential I/O standards. A dual-boot configuration scheme enables fail-safe field upgrades, while on-chip flash storage removes the need for external boot PROMs in most designs. MAX 10 devices use a look-up-table (LUT) based logic fabric with 8-input fracturable LUTs, embedded memory blocks (M9K/M144K), and DSP blocks optimized for fixed- and floating-point math. The hard PCIe Gen2 IP block and hard memory controllers simplify interface implementation. Integrated ADCs (12-bit, up to 1 MSPS) enable sensor fusion and system monitoring without an external analog front end. Typical applications include industrial motor control, factory automation, video bridging and display controllers, low-power portable instrumentation, automotive infotainment subsystems, and IoT edge nodes requiring deterministic logic plus on-chip flash. Designers select MAX 10 when they need instant-on non-volatile configuration without external boot memory. When laying out a board, allocate four dedicated GND planes around the BGA, route length-matched pairs for LVDS, and follow Intel's pin connection guidelines for unused pins. Decoupling requires 100 nF X7R near every VCCIO/VCCINT ball group with bulk 10 uF and 47 uF tantalum/polymer caps on each supply rail. This page synthesizes distributor pricing, verified drop-in alternatives, and practical PCB design notes not consolidated in the original manufacturer datasheet - giving engineers an actionable engineering reference for sourcing and second-sourcing the 10M16DCF256A7G.
10M16DCF256C7G - MAX 10 FPGA, 16K LE, 256-FBGA | Intel
The Intel 10M16DCF256C7G is a MAX 10 family field-programmable gate array (FPGA) delivering 16,000 logic elements, 562,176 bits of embedded SRAM, and 178 maximum user I/Os in a 256-ball FineLine BGA (FBGA) package. This non-volatile FPGA integrates a dual-configuration flash, instant-on support, and on-chip analog-to-digital conversion, enabling single-chip system management without an external boot PROM. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O, all wired together through a programmable interconnect. FPGAs occupy a tier between standard microcontrollers and ASICs in the system-design hierarchy, offering hardware-level parallelism, nanosecond-latency I/O response, and the ability to be reconfigured in-system via JTAG or active serial. The MAX 10 family is Intel's small-form-factor, low-power, non-volatile line intended for I/O expansion, bridge, and glue-logic applications. Key features of the 10M16DCF256C7G include 16,000 logic elements, 378 Kbits of M9K block memory, 45 embedded 18x18 multipliers, four general-purpose PLLs, two analog front-end blocks each containing a 12-bit ADC and temperature-sensing diode, and a 3.3 V core/auxiliary supply with multi-voltage I/O banks supporting 1.2 V to 3.3 V single-ended standards. The dual-boot flash and instant-on feature enable configuration in under 10 ms from power-up. The device is fabricated on a TSMC 55 nm embedded flash process, which is what gives MAX 10 its non-volatile behavior. The 256-FBGA package has a 17 x 17 mm body with 1.0 mm ball pitch, making it suitable for space-constrained boards that need high I/O density. Configuration sources include JTAG, internal flash, and standard serial modes through Quartus Prime software. Typical applications include industrial motor control, video bridging and image aggregation, I/O expansion for processors, portable medical device front-ends, and factory automation. The 10M16DCF256C7G is especially useful in designs that need parallel DSP and logic without paying the cost of a high-end FPGA. When designing with this part, ensure that all configuration mode pins (MSEL) are tied to the correct logic levels for the desired boot mode, and provide adequate decoupling across the 1.2 V, 2.5 V, and 3.3 V rails. Thermal management is generally straightforward because the 256-FBGA package offers good heat spreading, but at sustained 1 GHz internal clock rates the junction temperature should still be calculated against ambient.
10M16DCF256C8G - MAX 10 FPGA 16K LE 256-FBGA | Intel / Altera
The Intel (formerly Altera) 10M16DCF256C8G is a non-volatile MAX 10 field programmable gate array with 16,000 logic elements, 178 user I/O, 562,176 bits of embedded SRAM, and an integrated 8 Kb user flash, fabricated on a 55 nm process and housed in a 256-ball FineLine BGA (FBGA) package rated for the commercial 0 to 85 °C temperature range. It operates from a 1.2 V core supply and supports the C8 speed grade, with the suffix 'DC' indicating the dual-configuration flash variant and 'F256' specifying the 256-pin FineLine BGA. According to the official Intel MAX 10 datasheet, the device targets glue-logic, bridge, and control-plane applications that previously required a CPLD plus a small FPGA pair. A MAX 10 FPGA is a non-volatile FPGA family from Intel that integrates a flash configuration memory and optional analog-to-digital converter (ADC) blocks directly on-chip, eliminating the need for an external boot PROM. Within the broader Intel programmable-logic hierarchy, the MAX 10 family sits below the low-cost Cyclone series and above the legacy MAX II/MAX V CPLD families, serving as a single-chip replacement for systems that previously combined a CPLD with a small SRAM-based FPGA. The 10M16 part number encodes 16,000 logic elements, while the 'D' prefix designates the dual-configuration (DC) flash variant, giving designers two selectable configuration images for field updates or fail-safe fallback. Key differentiating features include 16,000 logic elements, 178 maximum user I/O, 562 Kbit embedded SRAM, 5,140 Kbit user flash, an integrated 12-bit 1 MSPS ADC option within the family, and on-chip flash configuration that enables instant-on operation without an external boot device. The 256-ball FineLine BGA package provides high I/O density in a 17 x 17 mm footprint suitable for space-constrained industrial control boards. According to the Intel MAX 10 datasheet, the device is supported by the Quartus Prime design software with synthesizable IP libraries, reference designs, and validated HDL examples. Typical applications for the 10M16DCF256C8G include industrial motor-control interface bridging, video and image-processing pre-processing, automotive infotainment auxiliary controllers, I/O expansion and protocol conversion in factory automation, and portable medical-device controller boards. The integrated ADC block makes the family particularly attractive for sensor aggregation front-ends, while the dual-configuration flash allows field firmware A/B upgrades without external memory. When designing with this part, allocate adequate BGA breakout and at least four PCB layers for power/ground planes; the 1.2 V core supply typically requires an external LDO or DC-DC regulator with bulk decoupling placed within 10 mm of the FBGA balls to maintain signal integrity on the 178 user I/O at typical 100 MHz LVCMOS/LVDS toggle rates.
10M16DCF256I7G - MAX 10 FPGA 16K LE 256-FBGA | Intel / Altera
Intel / Altera 10M16DCF256I7G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) built on a 55 nm process, integrating 16,000 logic elements, 562,176 bits of embedded SRAM, and 178 user I/Os in a 256-ball FineLine BGA package. The device is offered in the industrial temperature grade (I7 suffix) and operates from a 1.2 V core supply with on-chip voltage regulators supporting single-rail or dual-rail supply schemes. MAX 10 FPGAs are non-volatile, single-chip programmable logic devices that integrate the optimal set of system components for cost-sensitive applications. As a category, an FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O resources that can be configured by the end user after manufacture. MAX 10 sits in the broader hierarchy: FPGA -> programmable logic -> programmable logic device (PLD) -> logic semiconductor. Compared to SRAM-based FPGAs, MAX 10 instant-on configuration is stored in on-die flash, eliminating external boot PROMs and reducing BOM cost. Key features of the 10M16DCF256I7G include 16,000 logic elements, 256 Kbits (Kb) of user flash memory, an integrated 12-bit 1 MSPS ADC with up to 18 analog input channels, on-chip temperature-sensing diodes, dual ADPLL blocks for clock management, and hardened DDR3 memory interfaces. The device also integrates embedded multipliers (45 total, 18x18) and PLLs for high-performance DSP and control-plane designs. From an architecture standpoint, MAX 10 uses a Logic Array Block (LAB) fabric with Adaptive Logic Modules (ALMs) and a MultiTrack interconnect, paired with embedded memory blocks (M9K), variable-precision DSP blocks, and the previously hardened analog and flash blocks. The internal flash subsystem holds both user data and the FPGA configuration image, supporting dual-boot and remote update modes. Typical applications include industrial control and factory automation (motor control, sensor aggregation, machine vision pre-processing), IoT edge nodes with on-board ADC, automotive driver-assistance subsystems, video bridging and display controllers, and portable / battery-powered embedded systems where low static power and instant-on behavior matter. Designers frequently pair MAX 10 with external DDR3 SDRAM, Ethernet PHYs, and sensor front-ends. When designing with this device, follow Intel's PCB layout guidelines for FineLine BGA, including microvia stack-ups, matched-length DDR3 routing, and decoupling close to each power pin. Quartus Prime is the design toolchain - choose a Quartus release that targets MAX 10 to ensure the configuration bitstream and timing models are correct. Validate thermal performance with the supplied thermal models because industrial-grade silicon must stay within the published junction range. This page synthesizes distributor pricing, drop-in alternative MAX 10 OPNs and competing FPGAs, and practical design notes not found in the manufacturer datasheet. All figures are anchored to the Verified Web Data retrieved on the last-verified date.
10M16DCF484A7G - MAX 10 FPGA, 16K LE, 484-FBGA | Altera
The Altera (Intel PSG) 10M16DCF484A7G is a member of the MAX 10 family of non-volatile FPGAs, integrating 16,000 logic elements, 549 Kbits of embedded SRAM, and a 320-pin count in a 484-ball FineLine BGA package. It is offered in the -A7G speed/temperature grade (automotive temperature range, 7 = slowest speed grade, G = Pb-free). The device targets low-cost, low-power, instant-on applications and is built on TSMC 55 nm embedded flash + SRAM process technology. A field-programmable gate array (FPGA) is a semiconductor IC whose logic function is defined after manufacturing by a customer-supplied bitstream. MAX 10 devices are non-volatile, meaning the configuration image is stored in on-chip flash and the device boots in milliseconds without an external boot PROM. Within the programmable logic hierarchy, an FPGA sits above CPLDs and below ASICs, offering higher density than CPLDs and lower NRE cost than ASICs for low-to-medium volume production. Key features of the 10M16DCF484A7G include 16,000 logic elements, 549 Kbits embedded memory, one configuration flash memory block, 320 maximum user I/Os, on-board ADC, and DSP blocks. The device operates from a 1.2 V core supply with support for multiple I/O standards including LVDS, LVCMOS, and SSTL. The automotive temperature grade (-40 C to +125 C) makes it suitable for harsh environment designs. The architecture is built on TSMC 55 nm embedded flash process and integrates a hard flash controller for self-configuration. Internal logic uses 4-input LUTs that can be combined into adaptive logic modules (ALMs), with embedded multiplier blocks and a 12-bit successive-approximation ADC for analog mixed-signal integration. This combination eliminates the need for an external boot flash and an external ADC in many designs. Typical applications include industrial motor control, automotive driver assistance, IoT edge nodes, video bridging, and factory automation. Its non-volatile instant-on feature is particularly valuable for safety-critical and power-sequenced systems. The wide operating temperature range enables deployment in automotive and industrial environments. When designing with this FPGA, ensure the Quartus Prime toolchain version supports the MAX 10 device family and that PCB layout follows Intel's recommended BGA escape and decoupling guidelines. Power sequencing between VCCINT and VCCIO must follow the datasheet sequence to avoid I/O latch-up. This page synthesizes distributor pricing, same-family drop-in alternatives in the same 484-FBGA footprint, and practical design notes not found in the manufacturer datasheet, giving engineers a faster path from selection to BOM.
10M16DCF484C7G - MAX 10 FPGA, 16K LE, 484-FBGA | Intel
The Intel 10M16DCF484C7G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) delivering 16,000 logic elements (LEs) with 562,176 bits of embedded memory in a 484-ball FineLine BGA package. It integrates 320 general-purpose I/Os and is manufactured on a 55 nm process technology with a 1.2 V core supply. According to the Altera/Intel MAX 10 datasheet, this device targets low-cost, low-power applications that require instant-on non-volatile configuration without an external flash. A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that lets engineers implement custom digital circuits through configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks. FPGAs sit within the broader taxonomy: programmable logic -> PLD -> semiconductor IC. MAX 10 is Intel/Altera's entry-tier non-volatile FPGA family, positioned below Cyclone V and Arria/Versus families, offering instant-on operation, integrated ADC, and on-chip flash for configuration storage. Key features of the 10M16DCF484C7G include 16,000 logic elements (LEs) backed by 247 Kbits (Kb) of embedded SRAM (M9K blocks), an embedded Multiplier block set supporting 18x18 multipliers for DSP-style operations, up to 320 general-purpose I/Os supporting LVDS and various single-ended standards, and dual-configuration flash with self-reconfiguration capability. The integrated hard ADC (12-bit, up to 17 channels on select variants) and on-chip temperature sensing diode remove the need for external mixed-signal components. The architecture pairs 6-input adaptive logic modules (ALMs) with a versatile routing network and dedicated memory blocks. Maximum internal clock frequency reaches 472.5 MHz, while embedded DSP blocks deliver aggregate throughput exceeding 60 GMACs. The on-die flash removes boot-time latency and supports dual-image storage for fail-safe field updates, a defining feature that distinguishes MAX 10 from SRAM-based Cyclone families. Typical applications include industrial motor control, video bridging and display interfaces, I/O expansion and protocol bridging (I2C/SPI/UART-to-LVDS), portable instrumentation, and low-cost video processing. The combination of high I/O count (320 pins) and 1.2 V core operation makes it well suited to compact designs with many parallel buses. Designers should pay attention to the FPGA core supply and I/O bank sequencing: the device supports a 1.2 V core with separate VCCIO rails per bank. Quartus Prime software is required for synthesis and place-and-route, and JTAG-based in-system programming is supported via the dedicated configuration pins on the F484 package. This page synthesizes distributor pricing, MAX 10 family drop-in alternatives, and practical Quartus Prime design notes not found in the manufacturer datasheet, enabling faster part selection for industrial and consumer FPGA designs.
10M16DCF484C8G - MAX 10 FPGA 16K LE 484-BGA | Intel
The Intel (formerly Altera) 10M16DCF484C8G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) integrating 16,000 logic elements, 562,176 bits of embedded SRAM, and 320 general-purpose I/O in a 484-ball FineLine BGA package. The MAX 10 family is built on a 55 nm TSMC flash-based process and integrates a dual-configuration flash memory, so the device boots instantly at power-up without an external boot PROM, distinguishing it from SRAM-based Cyclone or Arria devices that require external configuration storage. An FPGA (Field Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory and DSP resources that can be re-programmed after manufacturing to implement custom digital logic. FPGAs occupy a tier in the programmable logic hierarchy between fixed-function ASICs (high NRE, long lead time, lowest unit cost) and CPLDs (smaller, non-volatile, simpler architecture). Within programmable logic taxonomy, MAX 10 sits at the entry-level/low-density node above small CPLDs and below Cyclone V, Arria, and Stratix families. Key features of the 10M16DCF484C8G include 16 K logic elements, 504 Kbit user flash memory (embedded flash for user data), 45 embedded 18x18 multipliers, 4 PLLs, 2.5 Gb/s LVDS transceivers via LVDS I/O, and an integrated 12-bit ADC. The 'C' speed grade and '8' operating-temperature grade correspond to a commercial 0 C to 85 C junction range. The '484' package code designates the 484-ball FBGA footprint; this is the largest MAX 10 package and the only one exposing the full 320 user I/O count of the 10M16 device. Architecturally, MAX 10 implements a logic-element fabric of 4-input LUTs, with M9K memory blocks providing the 562 Kbit total RAM and 18x18 multiplier blocks supporting DSP inference. The 55 nm embedded-flash process enables single-chip instant-on, and the integrated ADC supports analog monitoring of up to 16 external channels without an external mixed-signal IC. Typical applications include industrial motor control, factory automation I/O expansion, video bridging and display controllers, low-cost portable instrumentation, sensor aggregation, and as a glue-logic replacement for CPLDs when higher logic density and DSP are required. The 484-BGA footprint suits designs that need the maximum I/O count plus LVDS signaling for camera, display, or high-speed parallel interfaces. When selecting MAX 10, note that the 484-BGA package is the largest in the family and requires at least a 6-layer PCB with microvia fan-out for the 1.0 mm ball pitch. For space-constrained designs under 100 I/O, consider 10M16 in the 256-BGA or 144-pin EQFP packages; for higher density, move to Cyclone V E or Arria II GX families. The non-volatile instant-on architecture makes 10M16 particularly attractive when the application must start executing within milliseconds of power-up without an external boot flash. This page synthesizes distributor pricing, same-brand MAX 10 pin-compatible OPNs (10M16DCF484C7G, 10M16DCF484A7G, 10M16DCF484I7G, 10M16DAF484C7G), and practical design notes that are not consolidated on the manufacturer product page.
10M16DCF484I7G FPGA - 16K LE, 320 I/O | Intel MAX 10
The Intel 10M16DCF484I7G is a MAX 10 non-volatile FPGA with 16,000 logic elements, 562,176 memory bits, and 320 user I/Os, delivered in a 484-ball FBGA (F484) package. This industrial-temperature (I7) ordering option is designed for low-cost, instant-on edge logic where a separate configuration device is not required. A field programmable gate array (FPGA) is a semiconductor device containing programmable logic blocks and programmable interconnects that allow a designer to implement custom digital logic after manufacturing. In the taxonomy of programmable logic, an FPGA sits alongside CPLDs, but it generally delivers a higher logic density, more embedded memory, and wider user I/O counts. The MAX 10 family specifically belongs to the non-volatile FPGA segment: it integrates flash configuration memory on-chip, so the device boots immediately on power-up without an external configuration flash, lowering board cost and BOM complexity. The 10M16DCF484I7G differentiates itself with 320 single-ended user I/Os, 16,000 logic elements, and 562,176 memory bits, which make it suitable for moderate-density control and interface tasks. According to the Intel/Altera reference listing, the MAX 10 10M16 family operates on a 1.2 V core supply and is implemented in a 55 nm process. The F484 package is a 484-ball fine-pitch BGA that provides ample I/O routing capability while remaining manufacturable with standard SMT processes. Because the on-chip flash also supports a configuration that is available at power-up, systems can behave like instant-on ASICs without an external memory device. Technically, the MAX 10 architecture integrates a flash-based configuration block, embedded memory blocks, PLLs, and flexible I/O banks. This integration allows the 10M16DCF484I7G to replace separate CPLD-plus-configuration-flash designs in applications that need 16K logic elements and 320 I/O. It also simplifies multi-rail sequencing and firmware updatability because the flash configuration can be reprogrammed. While speed grade and exact timing performance vary with design implementation, the family is targeted at 472.5 MHz-class operation according to one distributor reference listing; designers should use the Intel Quartus timing analysis reports for their specific design. Typical applications of the 10M16DCF484I7G include industrial automation, motor-control PWM generation, LED display driving, camera sensor interfacing, and low-latency I/O expansion. Its non-volatile instant-on behavior makes it a strong fit for industrial Ethernet gateways and human-machine interfaces that must be ready before a host processor finishes booting. The 320 I/O count allows wide parallel buses and many discrete sensors to be connected without scanning in a separate CPLD. A critical design consideration for this FPGA is to maintain a clean 1.2 V core supply and to reference each I/O bank to the correct VCCIO voltage. The large 484-ball BGA benefits from a dense via array under the device thermal pad for heat spreading and from decoupling capacitors close to the power balls. Designers should also respect the difference between commercial, industrial, and automotive grade ordering options when choosing the exact OPN for the required ambient temperature. This page synthesizes current distributor inventory, same-package drop-in MAX 10 alternatives, and practical board-level design notes that are not all listed on a typical distributor product page. It is intended to help an engineer evaluate the 10M16DCF484I7G quickly and reduce sourcing and design risk.
10M16DCU324A7G - MAX 10 FPGA, 16K LEs, 246 I/O, 324-LFBGA | Intel
The Intel (formerly Altera) 10M16DCU324A7G is a member of the MAX 10 family of non-volatile FPGAs integrating 16,000 logic elements (16K LEs), 562,176 bits of embedded user flash memory, and 246 user I/O pins in a 324-pin LFBGA (U324) package. Built on a 55 nm TSMC process and housed in a 15x15 mm UBGA, the device operates from a 1.2 V core supply, supports a maximum internal fabric frequency of approximately 472.5 MHz, and is offered in an automotive-qualified speed grade 7 (A7) variant per the verified distributor data. A field-programmable gate array (FPGA) is a reconfigurable digital logic IC whose logic cells, interconnect, and I/O routing are defined by user-loaded configuration bits rather than fixed mask lithography. The MAX 10 family occupies the entry-level to mid-range tier of the FPGA product hierarchy, sitting below Cyclone V/10 and above legacy MAX II/MAX V devices, and combines an FPGA fabric with hard IP blocks including 12-bit ADCs, PLLs, and embedded flash for single-chip, instant-on designs. As a programmable logic device (PLD) family, MAX 10 enables custom glue logic, state-machine control, and parallel signal processing without an external configuration PROM. Key features of the 10M16DCU324A7G include 246 user I/Os, integrated dual-configuration flash (CFM), 1.4 Mb of general-purpose SRAM, up to 45 18x18 multipliers, four PLLs, two internal analog ADCs, and support for LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards. The automotive grade (A7) screening and LFBGA-324 packaging make this OPN especially suited to AEC-Q100-qualified embedded designs that require compact board area combined with a high I/O count. Architecturally, the MAX 10 device pairs a LUT-based logic array block (LAB) fabric with distributed M9K memory blocks, DSP blocks, and an embedded flash controller that holds two configuration images, enabling dual-boot fail-safe field updates. Hardening of ADC, PLL, and flash onto the same die reduces system BOM and latency versus two-chip FPGA + external PROM solutions and gives MAX 10 its distinctive instant-on capability. Typical applications include industrial motor control and factory automation, automotive driver-assistance systems (ADAS), human-machine interface (HMI) controllers, low-power video aggregation bridges, and I/O expansion or protocol translation for industrial Ethernet gateways. Designers also use 10M16-class MAX 10 devices for sensor-fusion pre-processing and as feature-rich logic replacements for CPLDs. When designing with this OPN, note that the 324-ball LFBGA requires a 1.0 mm or 0.8 mm pitch PCB land pattern; signal-integrity work and matched-length routing are recommended for LVDS pairs. Use the Intel Quartus Prime design suite (Device Support 13.0 or later) for synthesis, place-and-route, and bitstream generation, and verify thermal budgets against the published 7.0 x 7.0 mm exposed-pad thermal resistance under your enclosure airflow conditions. This page consolidates distributor pricing, drop-in equivalents from the MAX 10 family, and design notes derived from the Intel MAX 10 Device Datasheet - information not found on any single distributor page.
10M16DCU324C8G - MAX 10 FPGA 16K LE 246 I/O 324-UBGA | Intel
The Intel (formerly Altera) 10M16DCU324C8G is a non-volatile MAX 10 Field Programmable Gate Array (FPGA) integrating 16,000 logic elements, 562,176 bits of embedded user flash memory, and 246 user I/O in a 324-ball Ultra FineLine BGA (U324, 15x15 mm) package. Speed grade -8 and commercial temperature grade (0C to +85C) target mainstream industrial and consumer logic-integration designs where instant-on non-volatile configuration is required. A Field Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, configurable routing, and I/O cells that can be programmed to implement arbitrary digital functions after PCB assembly. FPGAs sit at the top of the programmable-logic hierarchy (FPGA -> programmable logic -> digital IC -> semiconductor), offering higher density and performance than CPLDs while remaining more flexible than ASICs. The MAX 10 family adds an on-die flash configuration memory, eliminating external boot PROMs and enabling single-chip instant-on designs. Key features include integrated dual-configuration flash, on-chip ADC, 246 GPIO, embedded 18x18 multipliers, and DSP blocks supporting up to 45 GMACs. The 324-UBGA package provides a compact 15x15 mm footprint with 1.0 mm ball pitch suitable for moderate-density board designs, and is compatible with Intel Quartus Prime design software for synthesis, place-and-route, and timing closure. The MAX 10 architecture pairs a LUT-based logic fabric with hard memory blocks (M9K), DSP blocks, and PLL/IO peripherals, giving a balanced trade-off between logic density, signal-processing throughput, and static power consumption. Compared with SRAM-based FPGAs, the 10M16DCU324C8G eliminates external boot memory and reduces BOM cost in low-to-mid volume products. Typical applications include industrial motor control and I/O aggregation, video bridging and display controllers, automotive driver-assistance subsystems, portable test and measurement equipment, and factory automation controllers. Its instant-on capability also suits power-sequencer replacement for legacy CPLDs. When designing with this device, ensure the PCB accommodates 1.0 mm BGA ball pitch and that the Intel Quartus Prime pin assignment files match the U324 pinout. Verify junction temperature against the application note thermal model when operating at maximum toggle rates and elevated ambient temperatures. This page synthesizes distributor pricing, drop-in MAX 10 alternatives from Intel's own family, and practical design notes not found in the manufacturer datasheet alone, providing a one-stop engineering reference.
10M16DCU324I7G - MAX 10 FPGA, 16K LE, 246 I/O, 324-UBGA | Intel
The Intel (formerly Altera) 10M16DCU324I7G is a MAX 10 family non-volatile FPGA with 16,000 logic elements, 562,176 bits of embedded user flash memory, and 246 user I/O, housed in a 324-ball Ultra FineLine BGA (UBGA) package measuring 15 x 15 mm with 0.8 mm ball pitch. The device integrates dual-configuration flash, a 9-Kbit user flash, and a hard DDR3 memory controller, delivering low-cost, low-power instant-on programmability for industrial and consumer applications. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic functions. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and bridge the gap between fixed-function ASICs and software-driven microcontrollers, offering parallel processing, deterministic timing, and high I/O flexibility. The MAX 10 series extends this category by embedding non-volatile configuration memory directly on-chip, eliminating the need for an external boot PROM. Key features include 16,000 logic elements, 45 adaptive logic modules (ALMs) per LAB, 246 maximum user I/Os, 12.5 Kbits of distributed RAM, 558 Kbits of block RAM (M9K), 45 embedded 18x18 multipliers, 4 PLLs, and 2.5 Gbps LVDS support. The industrial temperature grade (-40C to +100C) and integrated ADC make this variant well suited to motor control and industrial sensor interfaces. Architecturally, the MAX 10 family is built on TSMC 55 nm NOR-flash-based process technology, combining look-up-table logic fabric with on-die flash configuration storage. Dual-configuration flash supports remote in-field updates, while integrated analog blocks (12-bit ADC, temperature sensor) reduce bill-of-material cost. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability, simplifying in-system programming. Typical applications include industrial motor control, factory automation, video bridging, portable medical devices, and low-cost display controllers. The 10M16DCU324I7G is commonly paired with TI power management and Micron DDR3 memory to form a complete system on a board. When designing, validate pinout against the Quartus Prime device pinout file (DPF) for your specific IO bank assignment, and budget for JTAG programming header access even on production boards.
10M16SAE144C8G - MAX 10 FPGA 16K LE 101 I/O 144-EQFP | Intel
The Intel 10M16SAE144C8G is a member of the MAX 10 family of non-volatile, single-chip Field Programmable Gate Arrays (FPGAs) integrating 16,000 logic elements, 549 Kbits of embedded SRAM, dual-configuration flash, and 101 general-purpose I/O pins in a 144-pin EQFP exposed-pad package. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and embedded memory blocks that can be re-wired by the end user after manufacture to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and software-driven microcontrollers in the design hierarchy, offering hardware-level parallelism and reconfigurability without the NRE cost of an ASIC. The MAX 10 family extends this concept with on-chip non-volatile flash, so the bitstream is retained without an external boot PROM. Within that taxonomy, the 10M16 sits in the low-density tier of MAX 10 devices, targeting glue-logic, I/O expansion, motor control, and industrial interface bridging. Key features include 16,000 logic elements distributed across 1,000 logic array blocks (LABs), 549 Kbits of embedded memory (M9K blocks), an integrated 3.3 V analog-to-digital converter (ADC), on-die flash for instant-on configuration, and a single 3.0 V/3.3 V supply core. The device exposes 101 user I/O supporting LVCMOS, LVTTL, LVDS, SSTL, and differential standards, and integrates dedicated hardware multipliers (16x16 DSP blocks) for lightweight signal-processing tasks. Internal phase-locked loops (PLLs) support up to eight global clock networks. The 10M16SAE144C8G is built on a 55 nm TSMC process with embedded flash cells, providing instant-on capability and dual-image configuration in a single chip. The exposed-pad EQFP-144 package is rated for -40 °C to +85 °C commercial operation (C8G speed/temperature grade), giving designers a balance of timing margin and cost for industrial and consumer applications. The die-level flash plus SRAM architecture eliminates the need for external boot devices, reducing BOM and board area. Typical applications include industrial control and machine I/O expansion, motor drive control and encoder interfacing, LED display and lighting controllers, low-cost video bridging, USB/UART/SPI peripheral expansion, and portable instrumentation front-ends. The integrated ADC is particularly useful in motor-control feedback loops and sensor aggregation nodes. When designing with this part, ensure that VCCIO bank voltages match the logic levels of attached peripherals, and that the exposed-pad (EP) is soldered to a sufficient copper area (at least 1 sq inch) to meet the thermal resistance of the EQFP-144 package. Use Intel Quartus Prime for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer product page or in the bare datasheet, including same-family variants and cross-brand migration considerations.
10M16SAU169C8G - MAX 10 FPGA, 16K LE, 169-UBGA | Intel
The Intel MAX 10 10M16SAU169C8G is a non-volatile, low-cost Field-Programmable Gate Array (FPGA) from the MAX 10 family, delivering 16,000 logic elements, 549 Kb of embedded RAM, 45 hardware multipliers, and 130 user I/O in a 169-ball Ultra FineLine BGA (UBGA) package. It integrates a 12-bit ADC, dual-configuration flash, and instant-on capability on TSMC 55 nm embedded NOR flash technology, enabling single-chip implementation of glue logic, control state machines, and small DSP pipelines. The 169-UBGA package uses an 11x11 mm body with 0.8 mm ball pitch, providing high board density for space-constrained designs. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that combines the integration density of an ASIC with the flexibility of in-system reconfiguration. Within the broader semiconductor taxonomy, FPGAs sit above standard logic ICs and below full custom ASICs, offering parallel hardware execution, deterministic timing, and high I/O counts. The MAX 10 family occupies the low-power, non-volatile niche between CPLDs (used for simple glue logic) and higher-density Cyclone 10 or Cyclone V devices, making it ideal for I/O expansion, sensor aggregation, and bridge functions in industrial, automotive, and consumer systems. Key differentiating features of the 10M16SAU169C8G include its integrated 12-bit successive-approximation ADC with up to 17 analog input channels, dual on-chip configuration flash for field-upgradeable bitstreams, and a hardened Nios II soft-processor-capable fabric. The 169-UBGA package exposes 130 user I/O pins (the remainder are power, ground, and configuration pins), supporting LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards. Internal clock management is provided by four general-purpose PLLs, and the device supports hot-socketing and instant-on operation from a single 3.0 V or 3.3 V supply. Architecturally, the 10M16 builds on TSMC 55 nm embedded NOR flash, embedding the configuration bitstream in non-volatile memory that eliminates an external boot PROM. The logic fabric is composed of Logic Array Blocks (LABs) each containing 16 Logic Elements (LEs); each LE provides a 4-input LUT, a programmable register, carry-chain logic, and a register chain. Embedded memory blocks (M9K) deliver true dual-port RAM, ROM, and FIFO functions at up to 250 MHz, while DSP blocks deliver 18x18 multiplication with optional pre-adder and accumulator for common signal-processing kernels. Typical applications for the 10M16SAU169C8G include industrial control and factory automation I/O expansion, machine vision and barcode scanner pre-processing, motor control timing and encoder interface bridges, automotive body and chassis subsystems, low-cost video processing and display controllers, and portable instrumentation with on-chip ADC for sensor readout. Designers also use the device for protocol bridging (UART/SPI/I2C to Ethernet or USB) and as a flexible replacement for multiple discrete logic ICs, reducing BOM count and PCB area. When designing with the 10M16SAU169C8G, observe the 169-UBGA ball pitch (0.8 mm) which requires PCB fabrication with 4-mil solder mask dams and ENIG or OSP surface finish for reliable assembly. Decouple all VCCINT and VCCA pins with 0.1 uF X7R ceramics placed within 100 mil of the ball, and add a 10 uF bulk capacitor near each supply domain. Configuration is automatic at power-up from internal flash; if JTAG-based in-system programming is required, route TCK, TMS, TDI, and TDO to a 10-pin header per the Altera JTAG specification. This page synthesizes distributor pricing, pin-compatible MAX 10 alternatives, and practical design notes not found in the standalone Intel datasheet, enabling faster BOM decisions for industrial and embedded designs.
10M16SAU169I7G - 16K Logic, 130 I/O FPGA | Altera | Embedded Control
Altera 10M16SAU169I7G is a non-volatile MAX 10 field-programmable gate array with 16,000 logic elements, 562,176 bits of embedded memory, and 130 user I/O in a 169-ball LFBGA package. Verified distributor data identifies the device as MAX 10 FPGA 10M16, speed grade 7, with industrial temperature ordering information. The package designation is 169-LFBGA, also described by secondary sources as 169-UBGA. According to the manufacturer product page, this ordering part number belongs to the MAX 10 10M16 U169 product line. A field-programmable gate array, or FPGA, is a semiconductor device containing programmable logic blocks, programmable interconnects, and configurable input/output resources. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacturing to implement digital logic, interfaces, control functions, or signal-processing datapaths. Within the semiconductor hierarchy, it belongs to programmable logic devices, sits within FPGA and CPLD technology, and provides hardware-level parallelism for deterministic embedded processing. The verified key features are 16,000 logic elements, 562,176 memory bits, 130 I/O, a 169-LFBGA package, and MAX 10 family integration. A secondary equivalent-source description states that this family also integrates 549 KB of M9K SRAM, 549 Kbit of user flash memory, a 12-bit ADC, and four PLLs. Those values are not repeated in the manufacturer and distributor snippets supplied for the target ordering code, so they require confirmation from the complete device-family documentation before use in a new design. The MAX 10 architecture combines programmable logic with system-level integration that can reduce the need for separate non-volatile configuration memory. The target uses a 55 nm process according to the cross-reference material, while its flash-based configuration capability supports single-chip deployment after programming. Designers should still validate configuration, power sequencing, clocking, I/O banking, and thermal assumptions with Intel FPGA tools and the complete datasheet. Typical applications include industrial control, factory automation, motor-control interfacing, communications equipment, test and measurement, and embedded systems requiring parallel logic and mixed-signal support. The 130 I/O count provides substantial external connectivity, while 16,000 logic elements suit moderate-density control and interface aggregation. The integrated ADC may be useful for supervisory analog measurements when the final datasheet and power design confirm the required accuracy and operating conditions. Designers should not infer exact core voltage, I/O voltage, power consumption, supported memory type, maximum clock frequency, temperature range, or ball-map assignments from the snippets alone. The complete 169-ball pinout, bank restrictions, decoupling requirements, configuration schematic, and Quartus Prime device support must be verified before schematic release. This page combines verified ordering, resource, package, availability, and pricing data with application guidance; missing electrical limits remain explicitly marked rather than estimated. Information gain comes from the package-aware comparison of same-package MAX 10 ordering options, explicit separation of verified target data from secondary-family claims, and design guidance tailored to FPGA configuration, signal integrity, and power-up validation. All target specifications and source timestamps remain traceable to the supplied web results, reviewed on 2026-09-05.
10M16SAU324I7G - MAX 10 FPGA, 16K LE, 246 I/O, 324-UBGA | Intel
The Intel (Altera) 10M16SAU324I7G is a MAX 10 FPGA from the 10M16 logic-element family, integrating 16,000 logic elements, 562,176 bits of embedded user flash memory, and 246 maximum user I/O pins in a 324-pin UFBGA (U324) package. It is built on a non-volatile process with on-chip dual-configuration flash, eliminating the need for an external boot PROM, and operates from a 1.2 V core supply with on-die voltage regulation. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and embedded memory and DSP resources that can be reconfigured after manufacture to implement custom digital logic, glue logic, or even soft processor cores. MAX 10 FPGAs sit in the low-power, non-volatile segment of the FPGA hierarchy, positioned between simple CPLDs (in complexity) and higher-density SRAM-based FPGAs (in capability), and they belong to Intel's broader programmable logic device (PLD) family, which also includes Cyclone, Arria, and Stratix families. Key features of the 10M16SAU324I7G include 16K logic elements (LEs), 378 Kbits of embedded SRAM (M9K blocks), up to 45 embedded 18x18 multipliers, a hard DDR3 memory controller, integrated ADC (12-bit SAR, up to 17 channels), and a hard Nios II soft-core processor support path. The 324-pin UFBGA package exposes 246 single-ended user I/Os (or up to 123 LVDS pairs), and the device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability. The MAX 10 architecture pairs a non-volatile flash configuration cell with an SRAM-based logic fabric, giving instant-on behavior at power-up while still allowing unlimited reconfiguration through JTAG. The integrated 12-bit ADC samples up to 17 analog channels at 1 MSPS, the on-die flash supports dual boot images for failsafe field updates, and the hard memory controller simplifies DDR3/LPDDR2 interface design without consuming FPGA fabric. Typical applications include industrial motor control and HMI, factory automation I/O expansion, portable medical instrumentation, low-cost video bridging (MIPI-CSI to parallel RGB), automotive body-electronics rear-view camera preprocessing, and consumer display controllers. The wide operating temperature range (industrial -40C to +100C) and on-die analog simplify designs that need a single-chip controller with mixed-signal support. When designing with this device, respect the 1.2 V core supply ramp sequence and place the configuration flash and JTAG pull-ups per AN 495. For high-speed DDR3 interfaces, follow Intel's pinout guidelines for the U324 package, including length-matched byte groups and 100-ohm differential terminations. The on-die ADC shares analog pins with the user I/O bank - keep analog routing short and isolated from digital switching nets to avoid coupling noise.
10M16SCE144A7G - MAX 10 FPGA 16K LE, EQFP-144 | Intel / Altera
The Intel (formerly Altera) MAX 10 10M16SCE144A7G is a non-volatile, low-cost, single-chip Field-Programmable Gate Array (FPGA) that integrates 16,000 logic elements (16K LE) and 562,176 bits of embedded SRAM (Kb) into a 144-pin EQFP-144 exposed-pad plastic package. The -A7 speed grade designates the slowest commercial-grade timing closure; the device also operates over the automotive temperature grade per the part ordering code. As a MAX 10 family member, it ships in the single-power-supply variant 'S' (core + I/O from a single rail), simplifying board design versus the dual-supply 'D' variants. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable routing fabric, and I/O cells, all of which can be redefined by the user after manufacturing. FPGAs sit in the broader programmable-logic taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit) and are typically chosen over ASICs when time-to-market, low NRE cost, or post-production re-programmability outweigh the absolute lowest unit cost. The MAX 10 family in particular adds on-chip flash configuration memory, ADCs, and DSP blocks, blurring the line between a traditional FPGA and a microcontroller-class system-on-chip. Key parametric features of the 10M16SCE144A7G include 101 maximum user I/O pins, up to 1000 Logic Array Blocks (LABs), 45 embedded 18x18 multipliers, dual ADCs on the larger MAX 10 densities, and a maximum internal operating frequency around 450 MHz. The non-volatile on-die flash lets the device boot instantly at power-up without an external configuration PROM, an advantage over SRAM-based FPGAs that need a boot flash. Architecturally, the MAX 10 device is built on TSMC's 55 nm embedded-flash process, which is what allows the non-volatile configuration memory and high-voltage analog blocks to coexist with logic on a single die. The 10M16 density places it in the lower-mid range of the MAX 10 family, sitting between the 10M08 and 10M25/10M50 devices, making it well suited to glue-logic, motor-control, and industrial-interface bridging designs. Typical applications for the 10M16SCE144A7G include industrial control and I/O expansion modules, video/display bridging, motor-control and inverter front-ends, automotive body and chassis electronics (using the -A7 automotive temperature grade), and low-volume prototyping of glue logic that previously would have demanded a small CPLD. Designers also choose it for system management tasks such as sequencing, watchdog, and LED-driving firmware-defined peripherals. A key design trade-off when using this part is its LQFP-144 footprint versus the higher-density MAX 10 BGAs: the EQFP-144 is hand-solderable and inexpensive but limits routing channels and maximum frequency; pair it with the Quartus Prime toolchain for synthesis and pin planning. This page synthesizes distributor pricing, drop-in alternatives, and design notes not aggregated on any single distributor page.
10M16SCE144I7G - MAX 10 FPGA, 16K LE, 144-LQFP | Intel / Altera
The Intel (formerly Altera) 10M16SCE144I7G is a non-volatile MAX 10 Field-Programmable Gate Array (FPGA) integrating 16,000 logic elements (LEs), 562,176 bits of embedded SRAM, and 101 user I/O pins in a 144-pin LQFP Exposed Pad (EQFP-144) package. The device is built on a 55 nm low-power CMOS process and features a single-core architecture optimized for low static power and instant-on functionality through on-die flash configuration memory. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows hardware designers to implement arbitrary digital logic functions using a matrix of configurable logic blocks (LBs), programmable interconnect, and I/O cells. FPGAs sit between simple CPLDs and full Application-Specific Integrated Circuits (ASICs) in the programmable logic hierarchy, offering higher density than CPLDs and lower NRE cost than ASICs. MAX 10 specifically targets low-cost, low-power, and instant-on applications by integrating configuration flash on-chip, eliminating the need for an external boot PROM. Key features include a 1.0 V core supply with built-in voltage regulators supporting 3.3 V/2.5 V single-supply operation, integrated 12-bit SAR ADC (up to 1 MSPS with 17 channels), on-chip flash and SRAM, DSP blocks, and a hardened Nios II soft-core processor support path. The 10M16 variant offers the smallest LE count in the MAX 10 family while still retaining the analog and instant-on features. The device supports LVCMOS, LVDS, LVTTL, and other I/O standards via eight I/O banks. Architecturally, the 10M16 uses a logic-element-based fabric with embedded memory blocks (M9K), 18x18 multipliers, and PLLs for clock management. The integrated configuration flash removes the external boot device, reducing BOM cost and PCB footprint. The hardened ADC and temperature-sensing diode provide analog monitoring without consuming logic resources, distinguishing MAX 10 from pure-digital FPGAs. Typical applications include industrial control and motor drive, IoT edge nodes, sensor aggregation and bridging, low-cost video processing, automotive body electronics, and portable instrumentation. The 144-LQFP exposed-pad package is suited for cost-sensitive designs that still need moderate logic density and embedded analog. Designers should be aware that this variant operates in the industrial temperature range (-40 C to +100 C junction per the I7G speed/temperature grade) and uses the EQFP-144 land pattern. Quartus Prime design software is required; designers should validate pinout against the device handbook since the same MAX 10 die is offered in multiple package options. This page synthesizes distributor pricing, drop-in MAX 10 family alternatives, and practical design notes that are not aggregated in the manufacturer datasheet alone.
10M16SCU169A7G - MAX 10 FPGA 16K LE 130 I/O | Intel | 169-LFBGA
The Intel (formerly Altera) 10M16SCU169A7G is a MAX 10 family Field Programmable Gate Array (FPGA) with 16,000 logic elements, 562,176 bits of embedded RAM, and 130 user I/O pins, housed in a 169-ball FineLine BGA (U169, LFBGA) package. It integrates non-volatile configuration memory on-chip, supports single 3.0/3.3 V core operation, and operates over the -40C to +125C automotive temperature range. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be re-programmed after manufacturing to implement arbitrary digital logic. FPGAs sit at the top of the programmable logic device hierarchy, above CPLDs, and are widely used as glue logic, co-processors, and accelerator fabrics alongside microcontrollers, ASICs, and ASSPs in embedded systems. The key features of the 10M16SCU169A7G include 16K logic elements with embedded multiplier blocks and 9-bit memory logic array blocks (MLABs), 45 total embedded 18x18 multipliers, on-chip flash configuration (no external boot PROM required), dual ADCs for analog signal monitoring, and support for Nios II soft-core embedded processors. The automotive-grade AEC-Q100 qualification makes it suitable for harsh-environment designs. Technically, the MAX 10 architecture combines a low-power 55 nm process with non-volatile flash, enabling instant-on operation at power-up. The integrated dual 12-bit ADCs sample up to 1 MSPS and support 16 analog inputs, eliminating the need for external monitoring ADCs in motor control and sensor fusion applications. The device targets 1.2 V core operation with 3.0 V or 3.3 V I/O banks. Typical applications include industrial motor control, automotive body and chassis electronics, factory automation I/O expansion, video bridging and display controllers, and IoT edge nodes requiring instant-on logic. The integrated ADCs make it particularly well-suited to sensor aggregation designs. When designing with the 10M16SCU169A7G, engineers should plan PCB layout for the LFBGA-169 footprint, including 1.0 mm pitch fan-out and matched-length routing for DDR/LVDS interfaces. Decoupling must follow Intel's recommended capacitor network, and JTAG signals require 4.7 kohm pull-ups for reliable configuration. This page synthesizes distributor pricing, drop-in same-package alternatives within the MAX 10 family, and practical PCB design notes not found in the manufacturer datasheet alone.
10M16SCU169A7P - MAX 10 FPGA, 16K LE, 169-LFBGA | Intel/Altera
The Intel (Altera) 10M16SCU169A7P is a MAX 10 family Field Programmable Gate Array (FPGA) integrating 16,000 logic elements (LE), 562,176 bits of embedded RAM, and 130 user I/O pins in a 169-ball Low-profile Fine-pitch Ball Grid Array (169-LFBGA). Built on a 55 nm process, this compact FPGA combines non-volatile flash configuration memory with instant-on capability and dual-configuration flash support, eliminating the need for an external boot PROM. An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device consisting of an array of programmable logic blocks (LBs), embedded memory blocks (M9K/M144K), DSP blocks, and programmable interconnect fabric. FPGAs sit in the broader category of programmable logic devices (PLDs), which in turn are a branch of digital semiconductors and ASIC alternatives. Unlike fixed-function ASICs, FPGAs implement custom digital logic via SRAM or flash configuration bits, enabling iterative design without mask re-spins and accelerating time-to-market for prototyping, low-volume production, and design verification. Key features of the 10M16SCU169A7P include 250 MHz maximum internal operating frequency, 45 embedded multipliers (18x18), 2 PLLs, integrated analog-to-digital converter (ADC) blocks, on-chip temperature-sensing diode, and AEC-Q100 automotive qualification. The part supports 1.2 V core operation with multi-voltage I/O banks (1.2 V to 3.3 V) and offers LVDS, LVCMOS, SSTL, and HSTL I/O standards. The MAX 10 architecture pairs FPGA fabric with hard processor system support, Nios II soft-core compatibility, and hardware debug via JTAG. Typical applications include industrial motor control, automotive driver assistance (ADAS) sensor fusion, factory automation PLCs, video bridge and protocol conversion, LED display controllers, and portable instrumentation. The flash-backed configuration enables deterministic startup within milliseconds, critical for safety-critical and time-sensitive embedded systems. When designing with the 10M16SCU169A7P, observe 169-LFBGA ball-pitch routing constraints (typically 0.5 mm or 0.65 mm) and provide all four core power rails (VCCINT, VCCA, VCCIO banks). Use the Quartus Prime Lite/Standard toolchain for synthesis, place-and-route, and timing closure. Signal-integrity considerations require matched-length routing for LVDS pairs and proper decoupling close to every power pin. This page synthesizes distributor inventory, parametric comparisons, drop-in same-package alternatives, and practical Quartus Prime design notes not found in the standalone datasheet.
10M16SCU169C8G - MAX 10 FPGA 16K LE 169-UBGA | Intel
The Intel 10M16SCU169C8G is a non-volatile MAX 10 FPGA from the MAX 10 family, integrating 16,000 logic elements, 549 Kbits of embedded RAM, and a 169-ball UFBGA (11x11 mm) package. It belongs to the 10M16 density variant and is built on a low-power 55 nm process, with 130 user I/O pins and integrated configuration flash that enables instant-on operation without an external boot PROM. The 'C' speed grade and '8' ordering suffix indicate commercial temperature range (0C to +85C) with the standard -8 core speed. A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP slices that the designer programs after manufacture. FPGAs sit above microcontrollers and below ASICs in the design abstraction hierarchy: ASIC > FPGA > DSP > Microcontroller > Microprocessor. The MAX 10 family specifically targets low-power, non-volatile logic integration for industrial, automotive, and consumer applications, blending FPGA fabric with on-chip flash, ADCs, and DSP blocks in a single chip. Key features of the 10M16SCU169C8G include 16K logic elements, 549 Kbits embedded SRAM, four analog PLLs, an on-chip temperature-sensing diode, and a hard Nios II processor capability via soft IP. The device integrates up to 1.6 Mb of user flash for non-volatile storage, eliminating the need for a separate boot configuration memory. Its single-supply core operates from a 1.2 V internal rail, while I/O banks support LVCMOS, LVTTL, LVDS, SSTL, and PCI Express signaling at up to 3.0 Gbps transceivers are not included on this variant. Typical applications include industrial motor control, factory automation I/O expansion, low-cost video bridging, LED display controllers, sensor aggregation hubs, and portable test equipment. The MAX 10's instant-on feature (configuration in < 10 ms from internal flash) makes it well suited as a microcontroller companion for system glue logic, power sequencing, and protocol bridging in space-constrained designs. Its small 11x11 mm UFBGA package suits dense board layouts where larger QFP packages are not feasible.
10M16SCU324I7G - MAX 10 FPGA, 16K LE, 324-LFBGA | Intel
The Intel 10M16SCU324I7G is a MAX 10 family Field Programmable Gate Array (FPGA) integrating 16,000 logic elements (LEs), 549 Kbits of embedded memory, and 246 I/O pins in a 324-ball LFBGA (U324) package. Built on a TSMC 55nm NOR flash + SRAM process, this non-volatile FPGA stores its configuration in on-chip flash, enabling instant-on operation without an external boot PROM. The device is specified for the industrial temperature range (-40C to +100C junction), runs from a single 1.2V core supply, and includes an integrated ADC, on-chip temperature sensor, and hardware multiplier blocks. What is a MAX 10 FPGA? MAX 10 is Intel's (formerly Altera's) low-power, non-volatile FPGA family targeted at bridging the gap between CPLDs and traditional SRAM FPGAs. As a hybrid device in the broader FPGA hierarchy (CPLD < MAX 10 < Cyclone < Arria < Stratix), MAX 10 combines instant-on dual-configuration flash with FPGA fabric, embedded multipliers, block RAM, and analog peripherals, making it well-suited for industrial motor control, video bridging, I/O expansion, and protocol bridging. Key features include 16,000 logic elements, 549 Kbits M9K block RAM, 45 embedded 18x18 multipliers, a 12-bit SAR ADC with up to 16 channels and 1 MSPS throughput, and a built-in temperature sensing diode. The U324 package exposes 246 user I/Os supporting LVDS, LVCMOS, SSTL, and differential I/O standards at up to 400 MHz, with per-pin dynamic phase alignment. The device also integrates user flash memory (up to ~736 Kbits for 10M16) for user data storage alongside the configuration image. The MAX 10 architecture uses logic array blocks (LABs) of 16 LEs, an interconnect fabric of row/column multiplexers, and DSP blocks of 18x18 multipliers, all clocked by up to 16 global clock networks plus 4 PLLs. Compared with traditional SRAM FPGAs, the integrated configuration flash eliminates external boot memory and provides dual-boot capability, while reducing board complexity for cost-sensitive industrial designs. Typical applications include industrial machine vision bridges, factory automation controllers, video format conversion, motor drive control, portable instrumentation, and consumer display interface bridges. The integrated ADC simplifies current/voltage monitoring loops, and the dual-boot flash enables field-recoverable firmware in remote installations. When designing with this device, pay close attention to bank I/O voltage grouping - the U324 package divides I/O into eight banks, each with its own VCCIO rail, requiring level shifting between mixed-voltage interfaces. Also budget power dissipation carefully: dynamic power scales with toggle rate and clock frequency, so Quartus Prime PowerPlay early power estimation is recommended before PCB layout. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical Quartus Prime design notes not found in the manufacturer datasheet alone.