10AX090S2F45E2SG vs 10AX090S3F45E2LG Comparison

Detailed side-by-side comparison of 10AX090S2F45E2SG by Intel and 10AX090S3F45E2LG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10AX090S2F45E2SG 10AX090S3F45E2LG
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $2,050.00 $12,480.00
Series Arria 10 GX Arria 10 GX
Logic Elements 900,000 900,000
Embedded Memory (bits) 59,234,304 59,234,304
User I/O Count 624 —
Speed Grade -2 (mid) S3 (-2 speed grade equivalent)
Logic Blocks [DATA_NEEDED: ALM count] —
Transceivers [DATA_NEEDED: number of transceiver channels] 624 (per package aggregate channels)
DSP Blocks [DATA_NEEDED: variable-precision DSP count] 1,518
Package Type 1932-BBGA, FCBGA —
Operating Temperature -40C to +100C (E2 = extended) —
Process Node 20nm TSMC TSMC 20nm
Mounting Type Surface Mount Surface Mount (BGA)
MSL Level [DATA_NEEDED: moisture sensitivity level] —
RoHS Status Compliant Compliant
Lead-Free Yes —
Family Arria 10 —
Device Variant GX (transceiver-equipped) —
Ball Count 1932 —
Adaptive Logic Modules (ALMs) — 339,620
Maximum Transceiver Data Rate — 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT)
Package — 1932-ball FCBGA (F45, 45mm flip-chip BGA)
Core Voltage (nominal) — 0.9 V
User I/O Banks — 12
Maximum User I/O — 624
Operating Temperature Range — 0C to 100C (E2 commercial)
Memory Interfaces — DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3

Datasheets & Resources

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