10AX090S2F45E2SG vs 10AX090S3F45E2LG 对比

详细并排对比 10AX090S2F45E2SG 出自 Intel 和 10AX090S3F45E2LG 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
10AX090S2F45E2SG 10AX090S2F45E2SG - Arria 10 GX FPGA 900K LE | Intel FPGA

10AX090S2F45E2SG - Arria 10 GX FPGA 900K LE | Intel FPGA

10AX090S2F45E2SG ✓ 量产中

规格对比

参数 10AX090S2F45E2SG 10AX090S3F45E2LG
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $2,050.00 $12,480.00
Series Arria 10 GX Arria 10 GX
Logic Elements 900,000 900,000
Embedded Memory (bits) 59,234,304 59,234,304
User I/O Count 624 —
Speed Grade -2 (mid) S3 (-2 speed grade equivalent)
Logic Blocks [DATA_NEEDED: ALM count] —
Transceivers [DATA_NEEDED: number of transceiver channels] 624 (per package aggregate channels)
DSP Blocks [DATA_NEEDED: variable-precision DSP count] 1,518
Package Type 1932-BBGA, FCBGA —
工作温度 -40C to +100C (E2 = extended) —
Process Node 20nm TSMC TSMC 20nm
安装类型 Surface Mount Surface Mount (BGA)
MSL 等级 [DATA_NEEDED: moisture sensitivity level] —
RoHS 状态 Compliant Compliant
Lead-Free Yes —
Family Arria 10 —
Device Variant GX (transceiver-equipped) —
Ball Count 1932 —
Adaptive Logic Modules (ALMs) — 339,620
Maximum Transceiver Data Rate — 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT)
封装 — 1932-ball FCBGA (F45, 45mm flip-chip BGA)
Core Voltage (nominal) — 0.9 V
User I/O Banks — 12
Maximum User I/O — 624
工作温度范围 — 0C to 100C (E2 commercial)
Memory Interfaces — DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3

数据手册与资源

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