10AX090S2F45E2SG vs 10AX090S3F45E2LG Comparación
Comparación detallada lado a lado de 10AX090S2F45E2SG por Intel y 10AX090S3F45E2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX090S2F45E2SG | 10AX090S3F45E2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.050,00 | $12.480,00 |
| Series | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Embedded Memory (bits) | 59,234,304 | 59,234,304 |
| User I/O Count | 624 | — |
| Speed Grade | -2 (mid) | S3 (-2 speed grade equivalent) |
| Logic Blocks | [DATA_NEEDED: ALM count] | — |
| Transceivers | [DATA_NEEDED: number of transceiver channels] | 624 (per package aggregate channels) |
| DSP Blocks | [DATA_NEEDED: variable-precision DSP count] | 1,518 |
| Package Type | 1932-BBGA, FCBGA | — |
| Temperatura de funcionamiento | -40C to +100C (E2 = extended) | — |
| Process Node | 20nm TSMC | TSMC 20nm |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Family | Arria 10 | — |
| Device Variant | GX (transceiver-equipped) | — |
| Ball Count | 1932 | — |
| Adaptive Logic Modules (ALMs) | — | 339,620 |
| Maximum Transceiver Data Rate | — | 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT) |
| Encapsulado | — | 1932-ball FCBGA (F45, 45mm flip-chip BGA) |
| Core Voltage (nominal) | — | 0.9 V |
| User I/O Banks | — | 12 |
| Maximum User I/O | — | 624 |
| Rango de temperatura de funcionamiento | — | 0C to 100C (E2 commercial) |
| Memory Interfaces | — | DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3 |