AS4C512M16D4A-62BCN vs H5AN8G6NDJR-XNC Comparison

Detailed side-by-side comparison of AS4C512M16D4A-62BCN by Alliance Memory and H5AN8G6NDJR-XNC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Alliance Memory
AS4C512M16D4A-62BCN AS4C512M16D4A-62BCN - 8Gb DDR4 SDRAM 512Mx16 | Alliance Memory

AS4C512M16D4A-62BCN - 8Gb DDR4 SDRAM 512Mx16 | Alliance Memory

AS4C512M16D4A-62BCN ✓ Active
SK hynix
H5AN8G6NDJR-XNC H5AN8G6NDJR-XNC - 8Gb DDR4-3200 x16 DRAM | SK Hynix

H5AN8G6NDJR-XNC - 8Gb DDR4-3200 x16 DRAM | SK Hynix

H5AN8G6NDJR-XNC ✓ Active

Specification Comparison

Parameter AS4C512M16D4A-62BCN H5AN8G6NDJR-XNC
Brand Alliance Memory SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Unit Price (USD) — $55.68
Memory Type DDR4 SDRAM DDR4 SDRAM
Memory Size 8 Gbit 8 Gb
Organization 512M x 16 —
Supply Voltage 1.2 V —
Data Rate 1600 MHz (3200 Mbps) 3200 Mbps
CAS Latency 18 ns —
Package 96-FBGA (7.5x13 mm) FBGA-96 (13x7.5 mm)
Operating Temperature 0°C to 95°C —
Mounting Type Surface Mount —
JEDEC Standard Compliant —
Interface POD (Pseudo Open Drain) —
Refresh Auto-refresh and self-refresh —
On-Die Termination Yes —
RoHS Status Compliant —
Packaging Tray —
Memory Organization — 512M x16
Supply Voltage (VDD) — 1.2 V (max 1.26 V)
Number of Terminals — 96
Maximum Operating Temperature — 85 °C
Input/Output Type — COMMON
RoHS — Compliant
Lead-Free — Yes
Halogen Free — Yes
Auto Self-Refresh — Yes
Auto Precharge — Yes
Data Mask — Yes
Dynamic On-Chip Termination — Yes
ZQ Calibration — Yes
CRC Function — Yes
Write Leveling — Yes
Asynchronous Reset — Yes

Datasheets & Resources

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