EP1M120B484C6 vs EP1M120F484C6 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP1M120B484C6 sa pamamagitan ng Intel at EP1M120F484C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP1M120B484C6 EP1M120F484C6
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family Mercury (ACEX 1M) Mercury (APEX EP1M)
Logic Elements (typical) 120 LE —
Maximum Logic Elements [DATA_NEEDED: maximum logic elements] —
Flip-Flops 4,800 —
User I/O Pins (max) 303 —
Configuration Memory SRAM-based (volatile, re-load on power-up) —
Packhaging 484-ball FineLine BGA (BGA-484) 484-ball FC-FBGA (FineLine BGA)
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Peak Reflow Temperature 220 °C —
Operating Temperature Grade Commercial (C suffix) —
Process Node 0.18 µm —
JTAG Support IEEE 1149.1 boundary-scan —
Configuration Modes PS, AS, JTAG —
Tindminan RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Design Software Quartus II (legacy support required) —
Typical Gates — 120,000
Logic Cells — 4,800
Logic Elements (LEs) — 49,152 (per distributor listing)
User I/O — 303
Logic Array Blocks (LABs) — 480
Ball Pitch — [DATA_NEEDED: ball pitch]
Core Supply Voltage — 1.8 V
Logic Family — CMOS
Temperature na Operasyon — 0 C to +85 C (Commercial)
Integrated Transceivers — High-speed CDR to 1.25 Gbps
Embedded System Blocks (ESBs) — Yes (dual-port RAM / ROM / CAM)
Process Technology — [DATA_NEEDED: process node]

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