EP1SGX25DF800I6N - Stratix GX FPGA, 25K LE, 20x 3.1875 Gbps Transceivers | Intel / Altera
MPN: EP1SGX25DF800I6N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 25 | $1620 | $40,500.00 |
| 50 | $1535 | $76,750.00 |
| 100 | $1450 | $145,000.00 |
Drop-in alternatives for EP1SGX25DF800I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX25DF800C6N
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EP1SGX25DF800C5N
✅ Drop-In✓ In Stock
$158 / Unit
View Datasheet →EP1SGX25DF672C7N
✅ Drop-In✓ In Stock
$245 / Unit
View Datasheet →EP1SGX25DF672I6N
✅ Drop-In✓ In Stock
$298 / Unit
View Datasheet →EP1SGX25CF672I6
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP1SGX25DF800I6N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Transceiver Channels | 4 to 20 channels |
| Maximum Transceiver Data Rate | 3.1875 Gbps per channel |
| CDR / SERDES | Embedded clock-data recovery and SERDES |
| Memory | TriMatrix memory, up to 2 Mbits |
| DSP Blocks | Up to 22 DSP blocks |
| Hard IP | PCI Express PHY, external memory interfaces (DDR, DDR-II, QDR-II, RLDRAM-II) |
| Source-Synchronous Channels | 8 channels |
| I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Package | 800-pin FineLine BGA (DF800) |
| Speed Grade | -6 (production grade) |
| Temperature Range | Industrial -40C to +100C |
| Protocol Support | Gigabit Ethernet, SONET/SDH, PCI Express, custom serial |
EP1SGX25DF800I6N 800-pin fineline bga (df800) Pin Configuration Guide
Complete pinout information for EP1SGX25DF800I6N (800-pin fineline bga (df800) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25DF800I6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF800I6N is suitable for 7 applications: 10G / Multi-Gigabit Backplane Routing, SONET / SDH Framer Interfaces, Storage Area Network (SAN) Bridges, PCI Express Endpoint / Root Complex, Broadcast Video Processing, Industrial Test & Measurement Instrumentation, Aerospace & Defense High-Speed Links.
10G / Multi-Gigabit Backplane Routing
The EP1SGX25DF800I6N integrates up to 20 transceiver channels at 3.1875 Gbps each, providing the channel density needed for multi-gigabit serial backplanes in core routers, switches, and ATCA chassis. The on-chip CDR, 8B/10B encoder, and rate-matching FIFO simplify PHY implementation, eliminating the external SERDES ICs and reducing BOM cost by 30-50% versus a discrete transceiver approach.
Recommended
SONET / SDH Framer Interfaces
The Stratix GX transceiver block supports OC-48 (2.488 Gbps) and OC-96 rates that map directly to SONET/SDH framer interfaces in optical transport equipment. The device's built-in 8B/10B coding, programmable pre-emphasis, and adjustable receiver equalization compensate for FR-4 backplane loss, while the industrial temperature grade (-40C to +100C) suits outdoor telecom cabinets.
Recommended
Storage Area Network (SAN) Bridges
The EP1SGX25DF800I6N's high-speed transceivers enable SAS, SATA, Fibre Channel, and custom serial bridges for enterprise storage arrays. Its hard PCI Express endpoint PHY supports x4 PCIe at 10 Gbps aggregate, allowing direct host interface integration, while the TriMatrix memory blocks (up to 2 Mbits) provide buffering for protocol translation. The -6 industrial speed grade handles demanding thermal environments.
Recommended
PCI Express Endpoint / Root Complex
The hard PCI Express PHY integrated in the Stratix GX family supports endpoint and root-complex configurations at x1 / x4 lane widths up to 2.5 Gbps per lane. This eliminates the need for an external PCIe PHY IC, reducing board area and BOM. Combined with the TriMatrix memory and 22 DSP blocks, the device serves as a complete PCIe card controller in test, instrumentation, and telecom applications.
Recommended
Broadcast Video Processing
The Stratix GX DSP blocks and high-speed serial I/O make the EP1SGX25DF800I6N well suited for HD-SDI (1.485 Gbps) and 3G-SDI (2.97 Gbps) video processing, frame synchronizers, and broadcast routers. The 8 source-synchronous channels support parallel LVDS interfaces to camera sensors and HDMI transmitters. Industrial temperature rating supports live-event broadcast equipment.
Recommended
Industrial Test & Measurement Instrumentation
The industrial -40C to +100C temperature range and the high-speed transceivers of the EP1SGX25DF800I6N make it suitable for portable protocol analyzers, oscilloscope acquisition modules, and bit-error-rate testers in industrial labs. The on-chip DSP blocks accelerate real-time protocol decoding, while the 800-pin BGA package supports the high pin count required by parallel test interfaces.
Recommended
Aerospace & Defense High-Speed Links
The EP1SGX25DF800I6N's industrial temperature range and rugged BGA package suit aerospace and defense applications such as avionics data buses, radar signal processing, and secure communications. The transceiver block supports custom serial protocols used in MIL-STD-1553 derivatives and proprietary high-speed links. Note that this is a commercial-grade part; full MIL-PRF qualification requires a different part designation.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF800I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF800C6N | EP1SGX25DF800C5N | EP1SGX25DF672C7N | EP1SGX25DF672I6N | EP1SGX25CF672I6 |
|---|---|---|---|---|---|---|
| Package | FineLine BGA-800 (DF800) | FineLine BGA-800 (DF800) | FineLine BGA-800 (DF800) | FineLine BGA-672 (DF672) | FineLine BGA-672 (DF672) | FineLine BGA-672 (CF672) |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Temperature Range | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C |
| Speed Grade | -6 (production) | -6 (production) | -5 (slower) | -7 (faster) | -6 (production) | -6 (production) |
| Family / Family Member | Stratix GX EP1SGX25 | Stratix GX EP1SGX25 | Stratix GX EP1SGX25 | Stratix GX EP1SGX25 | Stratix GX EP1SGX25 | Stratix GX EP1SGX25 |
| Pin Count | 800 | 800 | 800 | 672 | 672 | 672 |
| Lifecycle Status (2026) | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
| Transceiver Data Rate | up to 3.1875 Gbps | up to 3.1875 Gbps | up to 3.1875 Gbps | up to 3.1875 Gbps | up to 3.1875 Gbps | up to 3.1875 Gbps |
Key Differentiators
- Industrial temperature grade with -6 speed (vs EP1SGX25DF800C6N)
- Faster speed grade with industrial temperature (vs EP1SGX25DF800C5N)
- Larger 800-pin BGA footprint with full transceiver count (vs EP1SGX25DF672C7N)
Design Notes
Route all high-speed transceiver channels as 100 ohm differential pairs with controlled impedance. Use a stripline or microstrip stack-up with reference planes on adjacent layers; maintain 8x to 10x trace width to dielectric thickness for microstrip. The CDR performance depends on intra-pair skew below 5 ps, so use length matching within 0.5 mm across all TX/RX pairs. AC-couple the lines with 100 nF 0402 capacitors if the protocol requires it (PCIe, XAUI).
Place a 100 uF bulk tantalum plus 10 uF and 0.1 uF ceramic capacitors within 5 mm of each VCC/GND pin pair. The transceiver supply (VCCE_GXB) is sensitive to switching noise; isolate it from the logic supply with a ferrite bead and a dedicated regulator (Linear Technology LT1963-1.5 / equivalent). Insufficient decoupling is the #1 cause of marginal BER performance in production. Always verify VCCE_GXB ripple is below 50 mVpp at full data rate.
Do not exceed the Stratix GX maximum data rate of 3.1875 Gbps per channel - the -6 speed grade is the upper limit. Using 'fastest' prototype settings in Quartus can lead to non-deterministic bit errors in production. When migrating between EP1SGX25 DF800 and DF672 packages, the bitstream is identical but the configuration pin assignments and JTAG ID differ. Re-generate the SOF/POF file after each package change.
The 800-pin FineLine BGA has a thermal resistance of approximately 0.6 C/W junction-to-case with proper thermal via array. Use 4 thermal vias per pad array under the die footprint, connecting the BGA thermal pad to the inner ground plane. With a 30 W typical Stratix GX power dissipation, expect 18C junction rise above case temperature - well within the 100C industrial limit.
Compliance Information
RoHS / lead-free per Altera product markings (Pb-free BGA finish). Reach compliance and conflict-minerals statement per Intel Product Change Notification archive. AEC-Q100 is not applicable - this is a logic IC for telecom and industrial. Halogen-free status [DATA_NEEDED].
