EP1SGX25DF800C6N - Stratix GX FPGA, 25K LE, 3.1875 Gbps SERDES | Intel / Altera
MPN: EP1SGX25DF800C6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $145 | $14,500.00 |
| 500 | $130 | $65,000.00 |
| 1,000 | $118 | $118,000.00 |
Drop-in alternatives for EP1SGX25DF800C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX25DF800C5N
✅ Drop-In✓ In Stock
$158 / Unit
View Datasheet →EP1SGX25DF800C7N
✅ Drop-In📋 Reference alternative (not in catalog)
EP1SGX25DF800I6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1450 / Unit
View Datasheet →EP1SGX25CF780C6
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1SGX25DF800C6N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 25,560 LEs |
| Maximum Transceiver Channels | 20 channels |
| Maximum Transceiver Data Rate | 3.1875 Gbps |
| Package | FBGA-780 (FineLine BGA, 800-ball per JEDEC ordering code) |
| Core Voltage | 1.5 V |
| Operating Temperature | Commercial (0 C to +85 C) |
| Speed Grade | 6 |
| Configuration Method | Passive Serial / Passive Parallel / Active Serial / JTAG |
| Transceiver Encoding | 8B/10B |
| Clock Data Recovery (CDR) | Yes, integrated per channel |
| Memory Type | TriMatrix embedded SRAM |
| DSP Blocks | Yes, embedded multiplier blocks |
| Mounting Type | Surface Mount (BGA) |
EP1SGX25DF800C6N fbga-780 (fineline bga, 800-ball per jedec ordering code) Pin Configuration Guide
Complete pinout information for EP1SGX25DF800C6N (fbga-780 (fineline bga, 800-ball per jedec ordering code) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX25DF800C6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX25DF800C6N is suitable for 6 applications: SONET/SDH OC-48 / STM-16 Line Card, 1G/2G Fibre Channel Switch Fabric, Multi-Gigabit Serial Backplane, High-Speed Test and Measurement Instrumentation, Wireless Base Station Signal Processing, Video Broadcast Routing and Processing.
SONET/SDH OC-48 / STM-16 Line Card
The EP1SGX25DF800C6N is well suited to OC-48/STM-16 line cards operating at 2.488 Gbps per direction. Its 3.1875 Gbps SERDES headroom plus integrated CDR and 8B/10B encoding match the SONET framer interface, while the 25,560 LEs provide capacity for STS-1 path overhead processing and concatenation logic. Designers typically instantiate a soft MII/UTOPIA bridge between the SERDES and an external framer, simplifying the BOM.
Recommended
1G/2G Fibre Channel Switch Fabric
The EP1SGX25DF800C6N's 3.1875 Gbps transceivers natively support 1 Gbps and 2 Gbps Fibre Channel rates defined by FC-PI-2, allowing designers to build a complete FC switch port in a single chip. The fabric implements cut-through or store-and-forward forwarding across up to 20 ports using on-chip TriMatrix memory for buffer credits. The 1.5 V core and hot-socketing make it deployable in hot-swappable FC switch chassis.
Recommended
Multi-Gigabit Serial Backplane
Backplane links running proprietary multi-gigabit protocols from 1 Gbps to 3.125 Gbps can be implemented on the EP1SGX25DF800C6N, leveraging its on-chip CDR to recover clock from data and eliminate external PHY components. The 25,560 LEs support custom 8B/10B-aware link-layer state machines, while DSP blocks enable pre-emphasis and equalization adjustment at the FPGA side. This reduces board complexity versus discrete SERDES approaches.
Recommended
High-Speed Test and Measurement Instrumentation
Test equipment such as protocol analyzers, BERT systems, and pattern generators benefit from the EP1SGX25DF800C6N's combination of multi-gigabit SERDES and programmable logic for custom trigger and capture sequences. Up to 20 channels can be aggregated for parallel bus protocol analysis at 2.5 Gbps, while TriMatrix memory buffers large capture windows. The FBGA-780 package supports high-density probe cards and ATE load boards.
Recommended
Wireless Base Station Signal Processing
The DSP blocks and TriMatrix memory on the EP1SGX25DF800C6N enable digital up/down-conversion, crest-factor reduction, and digital predistortion for 3G/4G base station radios. The SERDES interface connects to CPRI or OBSAI framer ASICs at 1.228 Gbps, 2.457 Gbps, or 3.072 Gbps, while the fabric implements baseband filtering and DPD feedback loops. This architecture consolidates what previously required separate DSP + FPGA designs.
Recommended
Video Broadcast Routing and Processing
SMPTE 259M and SMPTE 292M SDI links at 270 Mbps and 1.485 Gbps can be deserialized using the EP1SGX25DF800C6N's transceivers, with the fabric implementing line doubling, color-space conversion, and frame synchronization. The 25 KLE fabric supports real-time processing of SD and HD streams, and the SERDES headroom allows future migration to 3G-SDI (2.97 Gbps) on the same hardware platform.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX25DF800C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX25DF800C5N | EP1SGX25DF800C7N | EP1SGX25DF800I6N | EP1SGX25CF780C6 |
|---|---|---|---|---|---|
| Package | FBGA-780 (FineLine BGA, flip-chip) | FBGA-780 (same) | FBGA-780 (same) | FBGA-780 (same) | FBGA-780 (same) |
| Brand | Intel (formerly Altera) | Intel (same) | Intel (same) | Intel (same) | Intel (same) |
| Logic Elements | 25,560 LEs | 25,560 LEs (same) | 25,560 LEs (same) | 25,560 LEs (same) | 25,560 LEs (same) |
| Max Transceiver Data Rate | 3.1875 Gbps | 3.1875 Gbps (same) | 3.1875 Gbps (same) | 3.1875 Gbps (same) | 3.1875 Gbps (same) |
| Speed Grade | 6 | 5 (faster Fmax) | 7 (slower Fmax) | 6 (same) | 6 (same) |
| Operating Temperature | Commercial 0 C to +85 C | Commercial 0 C to +85 C | Commercial 0 C to +85 C | Industrial -40 C to +100 C | Commercial 0 C to +85 C |
| SERDES Channels | Up to 20 | Up to 20 (same) | Up to 20 (same) | Up to 20 (same) | Up to 20 (same) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Speed grade 6 hits the cost/performance sweet spot for most designs (vs EP1SGX25DF800C5N)
- Industrial temperature option available in same package (vs EP1SGX25DF800I6N)
- Standard silicon revision with widest legacy support (vs EP1SGX25CF780C6)
Design Notes
Estimated: the FBGA-780 FineLine BGA pitch is 1.0 mm with 0.6 mm pads, requiring laser-drilled microvias and a 6+ layer stackup with full power/ground planes. Each SERDES lane must route as 100-ohm differential with intra-pair length matching under 0.1 mm and lane-to-lane matching within 0.7 mm to meet 3.1875 Gbps jitter budgets. Reference the Altera Stratix GX PCB Design Guidelines for the recommended stackup and de-embedding recommendations.
Estimated: the Stratix GX core supply (VCCINT) is 1.5 V with a typical ICCINT around 0.5 A-1.5 A depending on utilization; SERDES supply (VCCE) is 1.5 V and PLL analog (VCCA) requires a low-noise LDO such as a 3.3 V to 1.5 V LT3021 or similar with <10 uVrms noise. Decoupling must include 0.1 uF X7R placed within 100 mil of every supply pin plus bulk 220 uF tantalums at the regulator outputs.
The Quartus II 13.0sp1 is the final release supporting the Stratix GX family - newer Quartus Prime releases drop these devices. Use legacy project archives (.qpf/.qsf) and lock the tool version to avoid synthesis regressions. Verify configuration mode pin strapping against the active configuration device (EPC16, EPC8, or EPC4) and confirm CONF_DONE goes high within 100 ms after nCONFIG release.
Estimated: at 100% SERDES utilization and high logic toggle rates, the FBGA-780 can dissipate 3 W to 5 W, requiring thermal vias beneath the BGA and a moderate airflow of 200 LFM. The exposed die (flip-chip) path through the package top demands heatsink attachment with thermal interface material rated for 1.0 W/m-K minimum. Monitor junction temperature via the on-die TSD sensor at -40 C / +85 C corners.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status are not documented in the public distributor data or Altera Stratix GX datasheet. The device predates widely enforced RoHS declarations and was likely ordered as a RoHS-5/6 compliant variant in many sources. Verify date code with your distributor before purchasing for any compliance-driven program.
