EP2A40F33C-9 vs EP2A40F33I-8 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A40F33C-9 disebabkan oleh Intel dan EP2A40F33I-8 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EP2A40F33C-9 EP2A40F33I-8
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Obsolete
Family APEX II APEX II
Maximum System Gates 1,600,000 —
Embedded RAM 65 Kbytes (approximately 540 Kbits depending on configuration) —
Kemasan 672-ball FineLine BGA (F33), 1.27 mm pitch 672-ball FineLine BGA (F33)
Speed Grade -9 -8
Suhu Operasi 0C to +85C (commercial) —
Process Technology 0.15 micrometer CMOS —
PLLs 4 4
LVDS Channels 16 high-speed LVDS channels —
Logic Elements [DATA_NEEDED: exact LE count] —
Maximum User I/O [DATA_NEEDED: max user I/O count] 672
Multi-Core Architecture MegaLAB structure with embedded memory and CAM —
Configuration Method JTAG, serial PROM, parallel flash SRAM (volatile) - external PROM required
Aras MSL 3 —
Peak Reflow Temperature 220 C 220 °C
Status RoHS [DATA_NEEDED: not stated in provided data] [DATA_NEEDED: RoHS status]
Core Voltage [DATA_NEEDED: nominal core voltage] —
Jenis Pemasangan Surface Mount (BGA) —
Manufacturer — Intel (formerly Altera)
Device Type — FPGA (Field-Programmable Gate Array)
Typical Gates — 1,500,000
Logic Elements (LEs) — 40,960
Embedded System Memory — 425,984 bits
Temperature Grade — Industrial (-40 °C to +85 °C)
High-Speed Clock Pins — 16
Moisture Sensitivity Level — MSL 3

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