EP2A40F33C-9 vs EP2A40F33I-8 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A40F33C-9 sa pamamagitan ng Intel at EP2A40F33I-8 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A40F33C-9 | EP2A40F33I-8 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | APEX II | APEX II |
| Maximum System Gates | 1,600,000 | — |
| Embedded RAM | 65 Kbytes (approximately 540 Kbits depending on configuration) | — |
| Packhaging | 672-ball FineLine BGA (F33), 1.27 mm pitch | 672-ball FineLine BGA (F33) |
| Speed Grade | -9 | -8 |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Process Technology | 0.15 micrometer CMOS | — |
| PLLs | 4 | 4 |
| LVDS Channels | 16 high-speed LVDS channels | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | 672 |
| Multi-Core Architecture | MegaLAB structure with embedded memory and CAM | — |
| Configuration Method | JTAG, serial PROM, parallel flash | SRAM (volatile) - external PROM required |
| Level ng MSL | 3 | — |
| Peak Reflow Temperature | 220 C | 220 °C |
| Tindminan RoHS | [DATA_NEEDED: not stated in provided data] | [DATA_NEEDED: RoHS status] |
| Core Voltage | [DATA_NEEDED: nominal core voltage] | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Device Type | — | FPGA (Field-Programmable Gate Array) |
| Typical Gates | — | 1,500,000 |
| Logic Elements (LEs) | — | 40,960 |
| Embedded System Memory | — | 425,984 bits |
| Temperature Grade | — | Industrial (-40 °C to +85 °C) |
| High-Speed Clock Pins | — | 16 |
| Moisture Sensitivity Level | — | MSL 3 |