EP2SGX60DF780C3 vs EP2SGX60CF780C3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60DF780C3 sa pamamagitan ng Intel at EP2SGX60CF780C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP2SGX60CF780C3N EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel

EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel

EP2SGX60CF780C3N ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP2SGX60DF780C3 EP2SGX60CF780C3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Huling Pagbili
Family Stratix II GX —
Series Stratix II Stratix II GX
Logic Elements / Cells 60,440 —
Logic Array Blocks (LABs) 3,022 [DATA_NEEDED: LAB count]
Total RAM Bits [DATA_NEEDED: total embedded memory bits] —
Number of I/O 364 —
Number of Transceivers Up to 20 —
Transceiver Data Rate Up to 6.375 Gbps —
Core Voltage 1.2 V —
Process Technology 90 nm 90 nm CMOS
Internal Frequency (max) ~717 MHz 816.9 MHz
Packhaging 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch —
Uri ng Pagpapasok Surface Mount —
Operating Temperature (TJ) 0 °C to +85 °C (commercial, C speed grade) —
Speed Grade C3 (fastest commercial) —
Tindminan RoHS Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) Lead-free / Compliant
Device Type — FPGA (Field Programmable Gate Array)
Logic Elements — 60,440
User I/O Pins — 364
Embedded Memory (bits) — 2,544,192
Number of CLBs — 60,440
Core Supply Voltage — 1.2 V
Transceiver Channels — 12 (up to 6.375 Gbps)
Package Type — 780-ball FC-FBGA
Package Dimensions — 29 mm x 29 mm, 1.0 mm pitch
Level ng MSL — [DATA_NEEDED: MSL rating]

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