EP2SGX60DF780C3 vs EP2SGX60CF780C3N 比較

詳細並排比較 EP2SGX60DF780C3 由 Intel 與 EP2SGX60CF780C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP2SGX60CF780C3N EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel

EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel

EP2SGX60CF780C3N ⚠ 最後購買機會

規格比較

參數 EP2SGX60DF780C3 EP2SGX60CF780C3N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete 最後購買
Family Stratix II GX —
Series Stratix II Stratix II GX
Logic Elements / Cells 60,440 —
Logic Array Blocks (LABs) 3,022 [DATA_NEEDED: LAB count]
Total RAM Bits [DATA_NEEDED: total embedded memory bits] —
Number of I/O 364 —
Number of Transceivers Up to 20 —
Transceiver Data Rate Up to 6.375 Gbps —
Core Voltage 1.2 V —
Process Technology 90 nm 90 nm CMOS
Internal Frequency (max) ~717 MHz 816.9 MHz
封裝 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch —
安裝類型 Surface Mount —
Operating Temperature (TJ) 0 °C to +85 °C (commercial, C speed grade) —
Speed Grade C3 (fastest commercial) —
RoHS 狀態 Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) Lead-free / Compliant
Device Type — FPGA (Field Programmable Gate Array)
Logic Elements — 60,440
User I/O Pins — 364
Embedded Memory (bits) — 2,544,192
Number of CLBs — 60,440
Core Supply Voltage — 1.2 V
Transceiver Channels — 12 (up to 6.375 Gbps)
Package Type — 780-ball FC-FBGA
Package Dimensions — 29 mm x 29 mm, 1.0 mm pitch
MSL 等級 — [DATA_NEEDED: MSL rating]

資料表與資源

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