EP2SGX60DF780C3 vs EP2SGX60CF780C3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60DF780C3 disebabkan oleh Intel dan EP2SGX60CF780C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP2SGX60CF780C3N EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel

EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel

EP2SGX60CF780C3N ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP2SGX60DF780C3 EP2SGX60CF780C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Masa Terakhir Dibeli
Family Stratix II GX —
Series Stratix II Stratix II GX
Logic Elements / Cells 60,440 —
Logic Array Blocks (LABs) 3,022 [DATA_NEEDED: LAB count]
Total RAM Bits [DATA_NEEDED: total embedded memory bits] —
Number of I/O 364 —
Number of Transceivers Up to 20 —
Transceiver Data Rate Up to 6.375 Gbps —
Core Voltage 1.2 V —
Process Technology 90 nm 90 nm CMOS
Internal Frequency (max) ~717 MHz 816.9 MHz
Kemasan 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch —
Jenis Pemasangan Surface Mount —
Operating Temperature (TJ) 0 °C to +85 °C (commercial, C speed grade) —
Speed Grade C3 (fastest commercial) —
Status RoHS Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot) Lead-free / Compliant
Device Type — FPGA (Field Programmable Gate Array)
Logic Elements — 60,440
User I/O Pins — 364
Embedded Memory (bits) — 2,544,192
Number of CLBs — 60,440
Core Supply Voltage — 1.2 V
Transceiver Channels — 12 (up to 6.375 Gbps)
Package Type — 780-ball FC-FBGA
Package Dimensions — 29 mm x 29 mm, 1.0 mm pitch
Aras MSL — [DATA_NEEDED: MSL rating]

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