EP2SGX60DF780C4 vs EP2SGX60DF780C3 Perbandingan

Perbandingan bersamaan detil EP2SGX60DF780C4 dari Intel dan EP2SGX60DF780C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP2SGX60DF780C4 EP2SGX60DF780C3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Obsolete
Device Family Stratix II GX —
Logic Elements 60,440 —
Embedded Memory Bits 2,544,192 —
User I/O Count 364 —
Maximum Internal Frequency 717 MHz —
Transceiver Channels [DATA_NEEDED: exact transceiver count and data rate] —
Number of CLBs 60,440 —
Process Technology 90 nm CMOS 90 nm
Core Supply Voltage 1.2 V —
Package Type 780-ball FC-FBGA —
Package Dimensions 29 x 29 mm —
Ball Pitch 1.0 mm —
Operating Temperature Grade Commercial (C) —
Speed Grade 4 (C4) C3 (fastest commercial)
Tipe Mounting Surface Mount Surface Mount
Status RoHS Compliant Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot)
Family — Stratix II GX
Series — Stratix II
Logic Elements / Cells — 60,440
Logic Array Blocks (LABs) — 3,022
Total RAM Bits — [DATA_NEEDED: total embedded memory bits]
Number of I/O — 364
Number of Transceivers — Up to 20
Transceiver Data Rate — Up to 6.375 Gbps
Core Voltage — 1.2 V
Internal Frequency (max) — ~717 MHz
Paket — 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch
Operating Temperature (TJ) — 0 °C to +85 °C (commercial, C speed grade)

Spek dan Sumber

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