EP2SGX60DF780C4 vs EP2SGX60DF780C3 比較

詳細並排比較 EP2SGX60DF780C4 由 Intel 與 EP2SGX60DF780C3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP2SGX60DF780C4 EP2SGX60DF780C3
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND Obsolete
Device Family Stratix II GX —
Logic Elements 60,440 —
Embedded Memory Bits 2,544,192 —
User I/O Count 364 —
Maximum Internal Frequency 717 MHz —
Transceiver Channels [DATA_NEEDED: exact transceiver count and data rate] —
Number of CLBs 60,440 —
Process Technology 90 nm CMOS 90 nm
Core Supply Voltage 1.2 V —
Package Type 780-ball FC-FBGA —
Package Dimensions 29 x 29 mm —
Ball Pitch 1.0 mm —
Operating Temperature Grade Commercial (C) —
Speed Grade 4 (C4) C3 (fastest commercial)
安裝類型 Surface Mount Surface Mount
RoHS 狀態 Compliant Non-compliant (legacy Altera-era BGAs use SnPb or non-RoHS bump finish; verify per lot)
Family — Stratix II GX
Series — Stratix II
Logic Elements / Cells — 60,440
Logic Array Blocks (LABs) — 3,022
Total RAM Bits — [DATA_NEEDED: total embedded memory bits]
Number of I/O — 364
Number of Transceivers — Up to 20
Transceiver Data Rate — Up to 6.375 Gbps
Core Voltage — 1.2 V
Internal Frequency (max) — ~717 MHz
封裝 — 780-ball FC-FBGA (FineLine BGA), 29 x 29 mm, 1.0 mm pitch
Operating Temperature (TJ) — 0 °C to +85 °C (commercial, C speed grade)

資料表與資源

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