EP2SGX60DF780I4N vs EP2SGX60DF780C3N Comparison
Detailed side-by-side comparison of EP2SGX60DF780I4N by Intel and EP2SGX60DF780C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2SGX60DF780I4N | EP2SGX60DF780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | End of Life |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | 60,440 |
| Logic Array Blocks (LABs) | 3,022 | — |
| User I/O Pins | 364 | — |
| Embedded Transceivers | Yes (multi-gigabit) | — |
| Transceiver Data Rate (max) | 6.375 Gbps | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm CMOS | 90 nm |
| Package | FBGA-780 (DF) | — |
| Package Body Size | 29 x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Operating Temperature | -40C to +100C (industrial) | [DATA_NEEDED: operating temperature range C] |
| Lead Free | Yes | — |
| RoHS | Compliant | — |
| Maximum Internal Frequency | 732.1 MHz | — |
| Device Type | — | FPGA |
| LABs/CLBs | — | 3,022 |
| Total Memory Bits | — | 2,544,192 |
| User I/Os | — | 364 |
| Package Type | — | 780-pin FC-FBGA (DF780) |
| Package Dimensions | — | 23 x 23 mm |
| Pitch | — | 1 mm |
| Internal Frequency | — | 717 MHz |
| Propagation Delay | — | [DATA_NEEDED: propagation delay ns] |
| Mounting Type | — | Surface Mount (BGA) |
| RoHS Status | — | Compliant (per distributor listing) |