EP2SGX60DF780I4N vs EP2SGX60DF780C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60DF780I4N sa pamamagitan ng Intel at EP2SGX60DF780C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2SGX60DF780I4N | EP2SGX60DF780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Tapus ng Buhay |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | 60,440 |
| Logic Array Blocks (LABs) | 3,022 | — |
| User I/O Pins | 364 | — |
| Embedded Transceivers | Yes (multi-gigabit) | — |
| Transceiver Data Rate (max) | 6.375 Gbps | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm CMOS | 90 nm |
| Packhaging | FBGA-780 (DF) | — |
| Package Body Size | 29 x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Temperature na Operasyon | -40C to +100C (industrial) | [DATA_NEEDED: operating temperature range C] |
| Lead Free | Yes | — |
| RoHS | Compliant | — |
| Maximum Internal Frequency | 732.1 MHz | — |
| Device Type | — | FPGA |
| LABs/CLBs | — | 3,022 |
| Total Memory Bits | — | 2,544,192 |
| User I/Os | — | 364 |
| Package Type | — | 780-pin FC-FBGA (DF780) |
| Package Dimensions | — | 23 x 23 mm |
| Pitch | — | 1 mm |
| Internal Frequency | — | 717 MHz |
| Propagation Delay | — | [DATA_NEEDED: propagation delay ns] |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Tindminan RoHS | — | Compliant (per distributor listing) |