EP2SGX60DF780I4N vs EP2SGX60DF780C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60DF780I4N disebabkan oleh Intel dan EP2SGX60DF780C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2SGX60DF780I4N | EP2SGX60DF780C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Akhir Hidup |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | 60,440 |
| Logic Array Blocks (LABs) | 3,022 | — |
| User I/O Pins | 364 | — |
| Embedded Transceivers | Yes (multi-gigabit) | — |
| Transceiver Data Rate (max) | 6.375 Gbps | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm CMOS | 90 nm |
| Kemasan | FBGA-780 (DF) | — |
| Package Body Size | 29 x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Suhu Operasi | -40C to +100C (industrial) | [DATA_NEEDED: operating temperature range C] |
| Lead Free | Yes | — |
| RoHS | Compliant | — |
| Maximum Internal Frequency | 732.1 MHz | — |
| Device Type | — | FPGA |
| LABs/CLBs | — | 3,022 |
| Total Memory Bits | — | 2,544,192 |
| User I/Os | — | 364 |
| Package Type | — | 780-pin FC-FBGA (DF780) |
| Package Dimensions | — | 23 x 23 mm |
| Pitch | — | 1 mm |
| Internal Frequency | — | 717 MHz |
| Propagation Delay | — | [DATA_NEEDED: propagation delay ns] |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Status RoHS | — | Compliant (per distributor listing) |