EP2SGX60DF780I4N vs EP2SGX60DF780C3N Perbandingan
Perbandingan bersamaan detil EP2SGX60DF780I4N dari Intel dan EP2SGX60DF780C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2SGX60DF780I4N | EP2SGX60DF780C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Akhir Hidup |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | 60,440 |
| Logic Array Blocks (LABs) | 3,022 | — |
| User I/O Pins | 364 | — |
| Embedded Transceivers | Yes (multi-gigabit) | — |
| Transceiver Data Rate (max) | 6.375 Gbps | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm CMOS | 90 nm |
| Paket | FBGA-780 (DF) | — |
| Package Body Size | 29 x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Suhu Kerja | -40C to +100C (industrial) | [DATA_NEEDED: operating temperature range C] |
| Lead Free | Yes | — |
| RoHS | Compliant | — |
| Maximum Internal Frequency | 732.1 MHz | — |
| Device Type | — | FPGA |
| LABs/CLBs | — | 3,022 |
| Total Memory Bits | — | 2,544,192 |
| User I/Os | — | 364 |
| Package Type | — | 780-pin FC-FBGA (DF780) |
| Package Dimensions | — | 23 x 23 mm |
| Pitch | — | 1 mm |
| Internal Frequency | — | 717 MHz |
| Propagation Delay | — | [DATA_NEEDED: propagation delay ns] |
| Tipe Mounting | — | Surface Mount (BGA) |
| Status RoHS | — | Compliant (per distributor listing) |