EP3C16F256I7N vs EP3C10F256I7 Comparison

Detailed side-by-side comparison of EP3C16F256I7N by Intel and EP3C10F256I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C16F256I7N EP3C10F256I7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active NRND
Family Cyclone III —
Logic Elements (LEs) 15408 —
Logic Array Blocks (LABs) 963 —
Total Memory Bits 516096 —
Embedded Memory 56 M9K blocks (504 Kbit) 423,936 bits
Embedded 18x18 Multipliers 56 —
PLLs 4 —
Maximum User I/O Pins 168 —
Package 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) —
Operating Temperature -40C to +100C (industrial, I7) -40°C to +125°C
Supply Voltage (Core) 1.2 V typical —
Process Technology TSMC 60 nm low-leakage —
Configuration SRAM-based, requires external config device (EPCS/EPCQ) —
Lead-Free / Pb-Free Yes (N suffix per JEDEC JESD97) —
RoHS Compliance Compliant —
Device Type — Cyclone III Field Programmable Gate Array (FPGA)
Logic Cells — 10,320 logic cells
I/O Count — 182 I/O pins
Total Terminals — 256 terminals
Package Type — 256-LBGA
Package Family — LBGA
Package Shape — Square
Mounting Type — Surface Mount
Terminal Form — Ball
Temperature Grade — Industrial
Supply Voltage — [DATA_NEEDED: supply voltage range]
Core Voltage — [DATA_NEEDED: core voltage]
I/O Standard — [DATA_NEEDED: supported I/O standards]
Configuration Interface — [DATA_NEEDED: configuration interfaces]
Lead-Free Status — Lead Free
RoHS Status — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
Manufacturer Family — Cyclone III
Logic Block Count — 10,320 logic blocks

Datasheets & Resources

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