EP3C16F256I7N vs EP3C10F256I7 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3C16F256I7N sa pamamagitan ng Intel at EP3C10F256I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3C16F256I7N EP3C10F256I7
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo NRND
Family Cyclone III —
Logic Elements (LEs) 15408 —
Logic Array Blocks (LABs) 963 —
Total Memory Bits 516096 —
Embedded Memory 56 M9K blocks (504 Kbit) 423,936 bits
Embedded 18x18 Multipliers 56 —
PLLs 4 —
Maximum User I/O Pins 168 —
Packhaging 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) —
Temperature na Operasyon -40C to +100C (industrial, I7) -40°C to +125°C
Supply Voltage (Core) 1.2 V typical —
Process Technology TSMC 60 nm low-leakage —
Configuration SRAM-based, requires external config device (EPCS/EPCQ) —
Lead-Free / Pb-Free Yes (N suffix per JEDEC JESD97) —
RoHS Compliance Compliant —
Device Type — Cyclone III Field Programmable Gate Array (FPGA)
Logic Cells — 10,320 logic cells
I/O Count — 182 I/O pins
Total Terminals — 256 terminals
Package Type — 256-LBGA
Package Family — LBGA
Package Shape — Square
Uri ng Pagpapasok — Surface Mount
Terminal Form — Ball
Temperature Grade — Industrial
Volte ng Pagbibigay — [DATA_NEEDED: supply voltage range]
Core Voltage — [DATA_NEEDED: core voltage]
I/O Standard — [DATA_NEEDED: supported I/O standards]
Configuration Interface — [DATA_NEEDED: configuration interfaces]
Lead-Free Status — Lead Free
Tindminan RoHS — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
Manufacturer Family — Cyclone III
Logic Block Count — 10,320 logic blocks

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