EP3C16F256I7N vs EP3C10F256I7 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP3C16F256I7N بواسطة Intel و EP3C10F256I7 بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP3C16F256I7N | EP3C10F256I7 |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | NRND |
| Family | Cyclone III | — |
| Logic Elements (LEs) | 15408 | — |
| Logic Array Blocks (LABs) | 963 | — |
| Total Memory Bits | 516096 | — |
| Embedded Memory | 56 M9K blocks (504 Kbit) | 423,936 bits |
| Embedded 18x18 Multipliers | 56 | — |
| PLLs | 4 | — |
| Maximum User I/O Pins | 168 | — |
| العلبة | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | — |
| درجة حرارة التشغيل | -40C to +100C (industrial, I7) | -40°C to +125°C |
| Supply Voltage (Core) | 1.2 V typical | — |
| Process Technology | TSMC 60 nm low-leakage | — |
| Configuration | SRAM-based, requires external config device (EPCS/EPCQ) | — |
| Lead-Free / Pb-Free | Yes (N suffix per JEDEC JESD97) | — |
| RoHS Compliance | Compliant | — |
| Device Type | — | Cyclone III Field Programmable Gate Array (FPGA) |
| Logic Cells | — | 10,320 logic cells |
| I/O Count | — | 182 I/O pins |
| Total Terminals | — | 256 terminals |
| Package Type | — | 256-LBGA |
| Package Family | — | LBGA |
| Package Shape | — | Square |
| نوع التركيب | — | Surface Mount |
| Terminal Form | — | Ball |
| Temperature Grade | — | Industrial |
| جهد التغذية | — | [DATA_NEEDED: supply voltage range] |
| Core Voltage | — | [DATA_NEEDED: core voltage] |
| I/O Standard | — | [DATA_NEEDED: supported I/O standards] |
| Configuration Interface | — | [DATA_NEEDED: configuration interfaces] |
| Lead-Free Status | — | Lead Free |
| حالة RoHS | — | [DATA_NEEDED: RoHS status] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Manufacturer Family | — | Cyclone III |
| Logic Block Count | — | 10,320 logic blocks |