EP3C16F256I7N vs EP3C10F256I7 Vergleich

Detaillierter Direktvergleich von EP3C16F256I7N von Intel und EP3C10F256I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C16F256I7N EP3C10F256I7
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv NRND
Family Cyclone III —
Logic Elements (LEs) 15408 —
Logic Array Blocks (LABs) 963 —
Total Memory Bits 516096 —
Embedded Memory 56 M9K blocks (504 Kbit) 423,936 bits
Embedded 18x18 Multipliers 56 —
PLLs 4 —
Maximum User I/O Pins 168 —
Gehäuse 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) —
Betriebstemperatur -40C to +100C (industrial, I7) -40°C to +125°C
Supply Voltage (Core) 1.2 V typical —
Process Technology TSMC 60 nm low-leakage —
Configuration SRAM-based, requires external config device (EPCS/EPCQ) —
Lead-Free / Pb-Free Yes (N suffix per JEDEC JESD97) —
RoHS Compliance Compliant —
Device Type — Cyclone III Field Programmable Gate Array (FPGA)
Logic Cells — 10,320 logic cells
I/O Count — 182 I/O pins
Total Terminals — 256 terminals
Package Type — 256-LBGA
Package Family — LBGA
Package Shape — Square
Montageart — Surface Mount
Terminal Form — Ball
Temperature Grade — Industrial
Versorgungsspannung — [DATA_NEEDED: supply voltage range]
Core Voltage — [DATA_NEEDED: core voltage]
I/O Standard — [DATA_NEEDED: supported I/O standards]
Configuration Interface — [DATA_NEEDED: configuration interfaces]
Lead-Free Status — Lead Free
RoHS-Status — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
Manufacturer Family — Cyclone III
Logic Block Count — 10,320 logic blocks

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