EP3C16F256I7N vs EP3C10F256I7 तुलना
विस्तृत दोनों ओर की तुलना EP3C16F256I7N द्वारा Intel और EP3C10F256I7 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP3C16F256I7N | EP3C10F256I7 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | NRND |
| Family | Cyclone III | — |
| Logic Elements (LEs) | 15408 | — |
| Logic Array Blocks (LABs) | 963 | — |
| Total Memory Bits | 516096 | — |
| Embedded Memory | 56 M9K blocks (504 Kbit) | 423,936 bits |
| Embedded 18x18 Multipliers | 56 | — |
| PLLs | 4 | — |
| Maximum User I/O Pins | 168 | — |
| पैकेज | 256-ball FBGA (17 mm x 17 mm, 1.0 mm pitch) | — |
| ऑपरेटिंग तापमान | -40C to +100C (industrial, I7) | -40°C to +125°C |
| Supply Voltage (Core) | 1.2 V typical | — |
| Process Technology | TSMC 60 nm low-leakage | — |
| Configuration | SRAM-based, requires external config device (EPCS/EPCQ) | — |
| Lead-Free / Pb-Free | Yes (N suffix per JEDEC JESD97) | — |
| RoHS Compliance | Compliant | — |
| Device Type | — | Cyclone III Field Programmable Gate Array (FPGA) |
| Logic Cells | — | 10,320 logic cells |
| I/O Count | — | 182 I/O pins |
| Total Terminals | — | 256 terminals |
| Package Type | — | 256-LBGA |
| Package Family | — | LBGA |
| Package Shape | — | Square |
| माउंटिंग प्रकार | — | Surface Mount |
| Terminal Form | — | Ball |
| Temperature Grade | — | Industrial |
| सप्लाई वोल्टेज | — | [DATA_NEEDED: supply voltage range] |
| Core Voltage | — | [DATA_NEEDED: core voltage] |
| I/O Standard | — | [DATA_NEEDED: supported I/O standards] |
| Configuration Interface | — | [DATA_NEEDED: configuration interfaces] |
| Lead-Free Status | — | Lead Free |
| RoHS स्थिति | — | [DATA_NEEDED: RoHS status] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Manufacturer Family | — | Cyclone III |
| Logic Block Count | — | 10,320 logic blocks |