EP3C25F324C7 vs EP3C25F324I7 Comparison

Detailed side-by-side comparison of EP3C25F324C7 by Intel and EP3C25F324I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C25F324C7 EP3C25F324I7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active NRND
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Cyclone III —
Logic Elements 24,624 —
Memory Bits 608,256 bits —
Number of I/O 215 —
Package Type 324-BGA —
Package Code BGA —
Number of Terminals 324 —
Package Shape Square —
Terminal Form Ball —
Mounting Type Surface Mount Surface Mount
Operating Voltage Range [DATA_NEEDED: operating voltage range] —
Maximum Operating Frequency [DATA_NEEDED: maximum operating frequency] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Internal Memory Configuration [DATA_NEEDED: internal memory configuration] —
I/O Standard [DATA_NEEDED: supported I/O standards] —
RoHS Compliance [DATA_NEEDED: RoHS compliance] —
REACH Compliance [DATA_NEEDED: REACH compliance] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Series — Cyclone III
Logic Elements (LEs) — 24,624
Logic Array Blocks (LABs) — 1,539
Embedded Memory — 608,256 bits (594 Kbits M9K blocks)
Embedded 18x18 Multipliers — 66
PLLs — 4
Global Clock Networks — 20
Maximum User I/O — 215
Process Technology — TSMC 65 nm low-power CMOS
Core Voltage (VCCINT) — 1.2 V
I/O Voltage (VCCIO) — 1.2 V to 3.3 V (per bank)
Operating Junction Temperature — -40 °C to +100 °C (industrial)
Package — 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch
Configuration Modes — Passive Serial (PS), Active Serial (AS), JTAG
RoHS Status — Compliant

Datasheets & Resources

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