EP3C25F324C7 vs EP3C25F324I7 Perbandingan

Perbandingan bersamaan detil EP3C25F324C7 dari Intel dan EP3C25F324I7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3C25F324C7 EP3C25F324I7
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif NRND
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Cyclone III —
Logic Elements 24,624 —
Memory Bits 608,256 bits —
Number of I/O 215 —
Package Type 324-BGA —
Package Code BGA —
Number of Terminals 324 —
Package Shape Square —
Terminal Form Ball —
Tipe Mounting Surface Mount Surface Mount
Operating Voltage Range [DATA_NEEDED: operating voltage range] —
Maximum Operating Frequency [DATA_NEEDED: maximum operating frequency] —
Rentang Suhu Kerja [DATA_NEEDED: operating temperature range] —
Internal Memory Configuration [DATA_NEEDED: internal memory configuration] —
I/O Standard [DATA_NEEDED: supported I/O standards] —
RoHS Compliance [DATA_NEEDED: RoHS compliance] —
REACH Compliance [DATA_NEEDED: REACH compliance] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Series — Cyclone III
Logic Elements (LEs) — 24,624
Logic Array Blocks (LABs) — 1,539
Embedded Memory — 608,256 bits (594 Kbits M9K blocks)
Embedded 18x18 Multipliers — 66
PLLs — 4
Global Clock Networks — 20
Maximum User I/O — 215
Process Technology — TSMC 65 nm low-power CMOS
Core Voltage (VCCINT) — 1.2 V
I/O Voltage (VCCIO) — 1.2 V to 3.3 V (per bank)
Suhu Hubung Kerja — -40 °C to +100 °C (industrial)
Paket — 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch
Configuration Modes — Passive Serial (PS), Active Serial (AS), JTAG
Status RoHS — Compliant

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