EP3C25F324C7 vs EP3C25F324I7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C25F324C7 sa pamamagitan ng Intel at EP3C25F324I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C25F324C7 | EP3C25F324I7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| FPGA Family | Cyclone III | — |
| Logic Elements | 24,624 | — |
| Memory Bits | 608,256 bits | — |
| Number of I/O | 215 | — |
| Package Type | 324-BGA | — |
| Package Code | BGA | — |
| Number of Terminals | 324 | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Operating Voltage Range | [DATA_NEEDED: operating voltage range] | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Hanay ng Temperature na Operasyon | [DATA_NEEDED: operating temperature range] | — |
| Internal Memory Configuration | [DATA_NEEDED: internal memory configuration] | — |
| I/O Standard | [DATA_NEEDED: supported I/O standards] | — |
| RoHS Compliance | [DATA_NEEDED: RoHS compliance] | — |
| REACH Compliance | [DATA_NEEDED: REACH compliance] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Series | — | Cyclone III |
| Logic Elements (LEs) | — | 24,624 |
| Logic Array Blocks (LABs) | — | 1,539 |
| Embedded Memory | — | 608,256 bits (594 Kbits M9K blocks) |
| Embedded 18x18 Multipliers | — | 66 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Maximum User I/O | — | 215 |
| Process Technology | — | TSMC 65 nm low-power CMOS |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (per bank) |
| Temperature ng Junction na Operasyon | — | -40 °C to +100 °C (industrial) |
| Packhaging | — | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |
| Tindminan RoHS | — | Compliant |