EP3SE110F1152C2 vs EP3SE260F1152C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F1152C2 sa pamamagitan ng Intel at EP3SE260F1152C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE110F1152C2 - Stratix III E FPGA, 107K LE, 1152-FCBGA | Intel
EP3SE110F1152C2 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE110F1152C2 | EP3SE260F1152C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | Stratix III E (Enhanced) | — |
| Logic Elements | 107,500 | — |
| Logic Array Blocks (LABs) | 4,300 | 10,200 |
| Adaptive Logic Modules (ALMs) | 53,750 | — |
| Embedded Memory (bits) | 8,936,448 | 16,672,768 |
| Maximum User I/Os | 744 | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage | 0.9 V | — |
| Maximum Internal Frequency | 800 MHz | — |
| Temperature na Operasyon | 0C to 85C (Commercial) | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Packhaging | 1152-ball FC-BGA | 1152-ball FC-FBGA (Flip Chip) |
| Package Code | F1152 | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Device Type | FPGA | — |
| Configuration | SRAM-based, volatile (requires configuration device) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix® III E |
| Logic Elements (LE) | — | 255,000 |
| User I/Os | — | 744 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage (VCCINT) | — | 1.1 V |
| Speed Grade | — | C2 (commercial) |
| Tindminan RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |