EP3SE110F1152C2 vs EP3SE260F1152C2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F1152C2 disebabkan oleh Intel dan EP3SE260F1152C2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE110F1152C2 - Stratix III E FPGA, 107K LE, 1152-FCBGA | Intel
EP3SE110F1152C2 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE110F1152C2 | EP3SE260F1152C2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Obsolete |
| Family | Stratix III E (Enhanced) | — |
| Logic Elements | 107,500 | — |
| Logic Array Blocks (LABs) | 4,300 | 10,200 |
| Adaptive Logic Modules (ALMs) | 53,750 | — |
| Embedded Memory (bits) | 8,936,448 | 16,672,768 |
| Maximum User I/Os | 744 | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage | 0.9 V | — |
| Maximum Internal Frequency | 800 MHz | — |
| Suhu Operasi | 0C to 85C (Commercial) | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Kemasan | 1152-ball FC-BGA | 1152-ball FC-FBGA (Flip Chip) |
| Package Code | F1152 | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Device Type | FPGA | — |
| Configuration | SRAM-based, volatile (requires configuration device) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix® III E |
| Logic Elements (LE) | — | 255,000 |
| User I/Os | — | 744 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage (VCCINT) | — | 1.1 V |
| Speed Grade | — | C2 (commercial) |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |
| Design Software | — | Quartus II (Stratix III support) |