EP3SE50F780C4L vs EP3SE110F780C4L Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F780C4L sa pamamagitan ng Intel at EP3SE110F780C4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE50F780C4L EP3SE110F780C4L
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Aktibo
Series Stratix III E Stratix III E
Family Stratix III —
Logic Elements (LE) 47,500 —
Embedded Memory 5,760,000 bits —
User I/Os 488 —
DSP Blocks (18x18 multipliers) 304 (19x16) —
Packhaging 780-ball FCBGA (Flip-Chip BGA) —
Process Node 40 nm —
Core Voltage 1.1 V —
Speed Grade C4 (commercial, speed 4) -4 (commercial)
Lead-Free (L suffix) Yes —
Configuration Method Passive Serial / Fast Passive Parallel / JTAG / Enhanced —
Temperature na Operasyon [DATA_NEEDED: full industrial/commercial grade] 0C to +85C (commercial)
Tindminan RoHS Compliant (lead-free) Compliant
Transceivers [DATA_NEEDED: per Stratix III E variant] —
PLLs [DATA_NEEDED: PLL count] —
Number of Logic Elements (LE) — 107,500
Number of Logic Array Blocks (LAB) — [DATA_NEEDED: number of LABs]
Total Memory Bits — 8,936,448 bits
Number of 18x18 Multipliers — 488
Number of PLLs — [DATA_NEEDED: PLL count]
User I/O Pins — 488
Process Variant — L (low-leakage)
Supply Voltage (Core) — [DATA_NEEDED: core voltage]
Package Type — 780-Ball FCBGA
Ball Pitch — 1.0 mm
Uri ng Pagpapasok — Surface Mount
Process Technology — 65 nm CMOS
Level ng MSL — 3 (per JEDEC J-STD-020)

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