EP4CE55F23I7N vs EP4CE55F23C9L Perbandingan
Perbandingan bersamaan detil EP4CE55F23I7N dari Intel dan EP4CE55F23C9L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CE55F23I7N | EP4CE55F23C9L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone IV E | — |
| Logic Elements | 55,856 | — |
| Configurable Logic Blocks (CLBs) | 3,491 | — |
| Embedded Memory | 2,396,160 bits | 2,396,160 bits (2.5 Mbit) |
| Embedded 18x18 Multipliers | 56 | 156 |
| PLLs | 4 | 4 |
| Maximum User I/O | 324 | — |
| Paket | 484-ball FBGA (23x23 mm, 1.0 mm pitch) | 484-ball FBGA (F23) |
| Process Technology | TSMC 60 nm low-power | — |
| Core Voltage | 1.2 V | 1.2 V (typical) |
| Suhu Kerja | -40C to +100C (industrial, I7 grade) | -40C to +85C (industrial) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (lead-free finish) | — |
| Configuration Modes | JTAG, AS, PS, FPP | — |
| Memory Interface Support | DDR, DDR2, QDRII | — |
| Family | — | Cyclone IV E |
| Logic Elements (LE) | — | 55,856 |
| User I/Os | — | 324 |
| Speed Grade | — | C9 (fastest commercial/industrial) |
| Process Node | — | 60 nm low-power |
| Configuration Method | — | SRAM-based, requires external flash |
| Status RoHS | — | Compliant |
| Level MSL | — | [DATA_NEEDED: MSL level] |
| Hard PCIe Blocks | — | 0 (soft PCIe via fabric) |