EP4CE55F29I7N vs EP4CE55F29C7N 比較
詳細並排比較 EP4CE55F29I7N 由 Intel 與 EP4CE55F29C7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP4CE55F29I7N | EP4CE55F29C7N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 單價 (USD) | — | $138.00 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 55,856 | 55,856 |
| Embedded Memory Bits | 2,396,160 | — |
| Number of LABs/CLBs | 3491 | — |
| Maximum User I/O | 374 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Number of PLLs | 4 | [DATA_NEEDED: PLL count] |
| Global Clock Networks | 20 | — |
| Dedicated Clock Pins | 11 | — |
| Embedded Multipliers (18x18) | 154 | [DATA_NEEDED: 18x18 multiplier count] |
| 封裝 | 780-ball FBGA (F29), 29 mm x 29 mm, 1.0 mm pitch | 780-ball FBGA (F29) |
| Speed Grade | I7 (industrial) | -7 (C7) |
| 工作接面溫度 | -40 C to +100 C | — |
| Process Technology | 60 nm low-k | — |
| RoHS 狀態 | Compliant | Compliant (LEAD FREE) |
| 安裝類型 | Surface Mount | Surface Mount |
| Supply Type | Tray | — |
| Configurable Logic Blocks (CLBs) | — | 3,491 |
| Total RAM Bits | — | 2,396,160 |
| User I/O Count | — | 374 |
| Package Dimensions | — | 29 mm x 29 mm |
| Ball Pitch | — | 1.0 mm |
| 工作溫度 | — | 0C to +85C (commercial) |
| Core Voltage | — | 1.2 V nominal |
| 供應電壓 | — | 1.2 V |
| Lead Free | — | Yes |
| Configuration Mode | — | JTAG, Active Serial, Passive Parallel |