EP4CGX110DF31I7 vs EP4CGX110DF27I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX110DF31I7 sa pamamagitan ng Intel at EP4CGX110DF27I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4CGX110DF27I7N - Cyclone IV GX FPGA, 110K LEs, 672-FBGA | Intel
EP4CGX110DF27I7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4CGX110DF31I7 | EP4CGX110DF27I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone IV GX | Cyclone IV GX |
| Device Logic Elements | 109,424 | — |
| Total Memory Bits | 5,621,760 | — |
| Number of Logic Array Blocks (LABs) | Not specified in provided data [DATA_NEEDED: LAB count] | — |
| Number of I/O | 475 user I/O | — |
| Multipliers (18x18) | 432 | — |
| PLLs | 4 | 4 |
| Transceivers | 8 (up to 3.125 Gbps) | 8 channels, up to 3.125 Gbps |
| M9K Memory Blocks | 270 | — |
| Packhaging | 896-BGA (FBGA-896), 31 mm | 672-ball FBGA, 1.0 mm pitch |
| Ball Pitch | 0.8 mm | — |
| Speed Grade | -7 | — |
| Temperature Grade | Industrial (-40C to +100C Tj) | — |
| Core Voltage | 1.2 V typical | 1.2 V |
| Configuration Method | SRAM (EPCS or JTAG) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Level ng MSL | 3 (per JEDEC J-STD-020) [DATA_NEEDED: floor life days] | — |
| Tindminan RoHS | Compliant | Compliant |
| Device Family | — | EP4CGX110 |
| Logic Elements (LEs) | — | 109,424 |
| Logic Array Blocks (LABs) | — | 6,422 |
| Embedded Memory (bits) | — | 5,621,760 |
| Memory Blocks (M9K) | — | 610 |
| Embedded 18x18 Multipliers | — | 280 |
| User I/Os | — | 393 |
| PCIe Hard IP Blocks | — | 4 (Gen1 x1/x2/x4) |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Process Node | — | 60 nm |
| Configuration Scheme | — | AS, PS, JTAG, FPP |