EP4CGX50CF23I7NAA vs EP4CGX50CF23C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50CF23I7NAA sa pamamagitan ng Intel at EP4CGX50CF23C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX50CF23I7NAA | EP4CGX50CF23C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LEs) | 49,888 | — |
| Logic Array Blocks (LABs) | 3,136 | — |
| Embedded Memory (Bits) | 2,562,048 | 2,562,048 (2.5 Mb) |
| Embedded Memory (M9K Blocks) | 270 | — |
| Embedded 18x18 Multipliers | 132 | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/O Pins | [DATA_NEEDED: exact max user I/O for F484] | — |
| Transceivers | 8 channels, up to 3.125 Gbps | — |
| Core Voltage | 1.2 V | 1.2 V |
| Hanay ng Temperature na Operasyon | -40C to +100C (Industrial, I7) | — |
| Speed Grade | 7 | C7 (commercial) |
| Packhaging | 484-ball FineLine BGA (F23), 1.0mm pitch | 484-FBGA (F23, 23 x 23 mm) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Tindminan RoHS | Compliant | Compliant (lead-free) |
| Lead-Free | Yes | — |
| Level ng MSL | 3 | — |
| Logic Elements (LE) | — | 49,888 |
| User I/O | — | 290 |
| Logic Array Blocks | — | 47 |
| Multi-Gigabit Transceivers | — | 4 channels up to 3.125 Gbps |
| Hard Memory Controllers | — | Yes (DDR/DDR2/QDRII/QDRII+/RLDRAM II) |
| I/O Voltage Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL (1.2V-3.3V) |
| Temperature na Operasyon | — | -40C to +85C (commercial) |
| Process Technology | — | 60 nm TSMC low-power |
| Configuration Modes | — | JTAG, Active Serial (EPCS), Passive Serial, Fast Passive Parallel |