EPF8282ATC100-3 vs EPF8282ATC100-4 Comparison
Detailed side-by-side comparison of EPF8282ATC100-3 by Intel and EPF8282ATC100-4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF8282ATC100-3 | EPF8282ATC100-4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 8000 | Flex 8000 FPGA |
| Logic Cells (LEs) | 208 | — |
| Usable Gates | 2,500 | 2500 |
| Typical Gates Equivalent | 12,000 | — |
| Maximum User I/O | 78 | — |
| Number of Logic Array Blocks (LABs) | 26 | — |
| Embedded Array Blocks (EABs) | 6 | — |
| Total RAM Bits | 12 Kbits | [DATA_NEEDED: total embedded memory bits] |
| Process Technology | 0.42 micron CMOS SRAM | — |
| Supply Voltage (Core) | 5 V | — |
| MultiVolt I/O Support | 3.3 V / 5 V | — |
| Maximum Frequency | 125 MHz | — |
| Speed Grade | -3 | — |
| Package | 100-pin TQFP (100-TQFP) | — |
| Configuration Method | SRAM, EPC1/EPC1064/EPC1213/EPC1441, microprocessor | SRAM (serial or parallel EPROM) |
| Operating Temperature (Commercial) | 0 C to +70 C | — |
| In-Circuit Reconfigurable | Yes (ICR) | — |
| Boundary Scan | JTAG IEEE 1149.1 | — |
| Series | — | FLEX 8000 |
| Number of Logic Elements/Cells | — | 208 |
| Number of LABs/CLBs | — | 26 |
| Number of I/O | — | 78 |
| Supply Voltage | — | 5 V |
| I/O Voltage (MultiVolt) | — | 3.3 V or 5.0 V |
| Operating Temperature | — | 0 C to 70 C |
| Mounting Type | — | Surface Mount |
| Package / Case | — | 100-TQFP (LFQFP, S-PQFP-G100) |
| Pin Count | — | 100 |
| Terminal Pitch | — | 0.500 mm |
| Logic Family | — | CMOS |
| Configuration Devices Supported | — | EPC1, EPC1064, EPC1213, EPC1441 |
| RoHS Status | — | [DATA_NEEDED: RoHS status - obsolete part] |
| Temperature Grade | — | Commercial |
| MSL Level | — | [DATA_NEEDED: MSL level] |